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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 12,026,008
- Issue date Jul 2, 2024
- Altera Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Compact routing package for high frequency isolation
- Patent number 11,955,418
- Issue date Apr 9, 2024
- Cypress Semiconductor Corporation
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,916,033
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-on-wafer structure and fabrication method
- Patent number 11,876,071
- Issue date Jan 16, 2024
- ZHEJIANG LAB
- Weihao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging of light emitting diodes (LEDs)
- Patent number 11,837,585
- Issue date Dec 5, 2023
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including coax-like electrical connections and methods for...
- Patent number 11,837,565
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Saqib Kaleem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 11,824,032
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector structure and method of forming same
- Patent number 11,824,026
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D image sensor
- Patent number 11,810,941
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Min-Sun Keel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and amplifier assembly
- Patent number 11,736,067
- Issue date Aug 22, 2023
- Sumitomo Electric Industries, Ltd.
- Masahiro Tanomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric molded indium bump formation and INP planarization
- Patent number 11,694,981
- Issue date Jul 4, 2023
- Princeton Infrared Technologies, Inc.
- Martin H Ettenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 11,646,296
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with protected sidewall and method of forming...
- Patent number 11,562,937
- Issue date Jan 24, 2023
- STMicroelectronics Pte Ltd
- Yun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package electronic device
- Patent number 11,552,005
- Issue date Jan 10, 2023
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 11,500,412
- Issue date Nov 15, 2022
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for packing optimization of semiconductor devices
- Patent number 11,239,192
- Issue date Feb 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including at least one row of bumps
- Patent number 11,177,230
- Issue date Nov 16, 2021
- Novatek Microelectronics Corp.
- Hsien-Wen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of semiconductor chips with microbumps
- Patent number 11,169,207
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,121,102
- Issue date Sep 14, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package electronic device including pillar conta...
- Patent number 11,088,052
- Issue date Aug 10, 2021
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,063,009
- Issue date Jul 13, 2021
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...
- Publication number 20240332134
- Publication date Oct 3, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD
- Publication number 20240332236
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shenggao LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321667
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION
- Publication number 20240290709
- Publication date Aug 29, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
- Publication number 20240234358
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240145418
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Junghoo Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240128173
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Ji-Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-ON-WAFER STRUCTURE AND FABRICATION METHOD
- Publication number 20240006372
- Publication date Jan 4, 2024
- ZHEJIANG LAB
- Weihao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
- Publication number 20230387061
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...
- Publication number 20230386950
- Publication date Nov 30, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230378114
- Publication date Nov 23, 2023
- Sony Semiconductor Solutions Corporation
- YUICHI MIYAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS
- Publication number 20230197658
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Clock Signal Transmission In Integrated Circuits And...
- Publication number 20230049681
- Publication date Feb 16, 2023
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION
- Publication number 20230022660
- Publication date Jan 26, 2023
- CYPRESS SEMICONDUCTOR CORPORATION
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE OF CHIP
- Publication number 20220336398
- Publication date Oct 20, 2022
- Sitronix Technology Corp.
- KUO-WEI TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
- Publication number 20220302064
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE AND DISPLAY DEVICE
- Publication number 20220216183
- Publication date Jul 7, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Mingxing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Packing Optimization of Semiconductor Devices
- Publication number 20220157755
- Publication date May 19, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148987
- Publication date May 12, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...
- Publication number 20220059487
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Saqib KALEEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...
- Publication number 20210367112
- Publication date Nov 25, 2021
- CreeLED, Inc.
- Michael John Bergmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ELECTRONIC DEVICE
- Publication number 20210366811
- Publication date Nov 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- ABRAM M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20210305212
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

being uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including anisotropic conductive film (ACF)

Semiconductor package and manufacturing method of semiconductor pac...

Techniques for clock signal transmission in integrated circuits and...

Advanced device assembly structures and methods

Multiple plated via arrays of different wire heights on a same subs...

Compact routing package for high frequency isolation

Method and system for packing optimization of semiconductor devices

System-on-wafer structure and fabrication method

Semiconductor package and manufacturing method thereof

Wafer level packaging of light emitting diodes (LEDs)

Devices including coax-like electrical connections and methods for...

Die corner removal for underfill crack suppression in semiconductor...

Connector structure and method of forming same

3D image sensor

Semiconductor device and amplifier assembly

Dielectric molded indium bump formation and INP planarization

Forming recesses in molding compound of wafer to reduce stress

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor package with protected sidewall and method of forming...

Coupling inductors in an IC device using interconnecting elements w...

Integrated circuit package electronic device

Techniques for clock signal transmission in integrated circuits and...

Manufacturing method of chip package

Semiconductor chip with patterned underbump metallization and polym...

Method and system for packing optimization of semiconductor devices

Electronic device including at least one row of bumps

Testing of semiconductor chips with microbumps

Semiconductor package and manufacturing method thereof

Integrated circuit package electronic device including pillar conta...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...

SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT DEVICE, AND METHOD

SEMICONDUCTOR PACKAGE

COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SYSTEM-ON-WAFER STRUCTURE AND FABRICATION METHOD

DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...

3D FAN-OUT PACKAGING STRUCTURE OF INTERCONNECTION SYSTEM WITH ULTRA...

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

DISPLAY DEVICE

Forming Recesses in Molding Compound of Wafer to Reduce Stress

Harvested Reconstitution Bumping

ELECTRONIC PACKAGE WITH VARYING INTERCONNECTS

Techniques For Clock Signal Transmission In Integrated Circuits And...

COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION

BUMP STRUCTURE OF CHIP

DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...

DISPLAY SUBSTRATE AND DISPLAY DEVICE

Method and System for Packing Optimization of Semiconductor Devices

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Advanced Device Assembly Structures And Methods

DEVICES INCLUDING COAX-LIKE ELECTRICAL CONNECTIONS AND METHODS FOR...

WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A...

INTEGRATED CIRCUIT PACKAGE ELECTRONIC DEVICE

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...