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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Display device including anisotropic conductive film (ACF)
- Patent number 12,167,644
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Shinzoh Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing different size opposing bonding pads and...
- Patent number 12,125,814
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device comprising polygonal pads
- Patent number 12,057,420
- Issue date Aug 6, 2024
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of additively manufacturing an integrated circuit of an inte...
- Patent number 12,027,477
- Issue date Jul 2, 2024
- Board of Trustees of Michigan State University
- Ioannis Papapolymerou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 12,002,776
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Chou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared sensor and imaging apparatus
- Patent number 11,901,389
- Issue date Feb 13, 2024
- NEC Corporation
- Tomo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D image sensor
- Patent number 11,810,941
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Min-Sun Keel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crack detection chip and crack detection method using the same
- Patent number 11,740,276
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Chan-Sik Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,728,300
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Woon-Ki Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 11,705,415
- Issue date Jul 18, 2023
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving bonding reliability
- Patent number 11,658,139
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,356
- Issue date Apr 11, 2023
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip, circuit board and electronic device
- Patent number 11,600,584
- Issue date Mar 7, 2023
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Jinfu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,857
- Issue date Feb 21, 2023
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure, semiconductor structure including interconn...
- Patent number 11,532,580
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Chou Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,527,502
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor die with output bondpad at the input side of the die, an...
- Patent number 11,444,044
- Issue date Sep 13, 2022
- NXP USA, INC.
- Ibrahim Khalil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple band multiple mode transceiver front end flip-chip archite...
- Patent number 11,309,926
- Issue date Apr 19, 2022
- Skyworks Solutions, Inc.
- Lisette L. Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,296,044
- Issue date Apr 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,264,344
- Issue date Mar 1, 2022
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power island segmentation for selective bond-out
- Patent number 11,211,329
- Issue date Dec 28, 2021
- Kioxia Corporation
- Benjamin Kerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using wires and stacked semiconductor package
- Patent number 11,164,833
- Issue date Nov 2, 2021
- SK hynix Inc.
- Young Jo Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...
- Publication number 20240332134
- Publication date Oct 3, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321831
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321667
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20240274561
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-CHOU TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Arranging Conductive Pads In Electronic Devices
- Publication number 20240120302
- Publication date Apr 11, 2024
- Intel Corporation
- Krishna Bharath Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED...
- Publication number 20240071979
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS
- Publication number 20230413586
- Publication date Dec 21, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402424
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME
- Publication number 20230352428
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...
- Publication number 20230253353
- Publication date Aug 10, 2023
- SANDISK TECHNOLOGIES LLC
- Lin HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230238359
- Publication date Jul 27, 2023
- Samsung Elctronics Co., Ltd.
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, D...
- Publication number 20230215851
- Publication date Jul 6, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhijun LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
- Publication number 20230187398
- Publication date Jun 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL
- Publication number 20230106976
- Publication date Apr 6, 2023
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098931
- Publication date Mar 30, 2023
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220344293
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-CHOU TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...
- Publication number 20220336394
- Publication date Oct 20, 2022
- SANDISK TECHNOLOGIES LLC
- Kensuke ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220246498
- Publication date Aug 4, 2022
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...
- Publication number 20220246564
- Publication date Aug 4, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Guilian GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20220157753
- Publication date May 19, 2022
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220068853
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- WOON-KI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY
- Publication number 20220037273
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20220013484
- Publication date Jan 13, 2022
- Beijing Xiaomi Mobile Software Co., Ltd.
- Jinfu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED SENSOR AND IMAGING APPARATUS
- Publication number 20210375974
- Publication date Dec 2, 2021
- NEC Corporation
- Tomo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20210305184
- Publication date Sep 30, 2021
- Beijing Xiaomi Mobile Software Co., Ltd.
- Jinfu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

being uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including anisotropic conductive film (ACF)

Bonded assembly containing different size opposing bonding pads and...

Display device including connection pad part and electronic compone...

Chip, circuit board and electronic device comprising polygonal pads

Method of additively manufacturing an integrated circuit of an inte...

Interconnect structure and method for forming the same

Bond enhancement structure in microelectronics for trapping contami...

Semiconductor device

Contact pad for semiconductor device

Infrared sensor and imaging apparatus

3D image sensor

Crack detection chip and crack detection method using the same

Semiconductor memory device structure

Semiconductor device

Semiconductor device and semiconductor device manufacturing method

Semiconductor package for improving bonding reliability

Semiconductor device

Chip, circuit board and electronic device

Semiconductor device

Chemical mechanical polishing for hybrid bonding

Interconnect structure, semiconductor structure including interconn...

Contact pad for semiconductor device

Manufacturing method of chip package

Transistor die with output bondpad at the input side of the die, an...

Multiple band multiple mode transceiver front end flip-chip archite...

Bond enhancement structure in microelectronics for trapping contami...

Mixed UBM and mixed pitch on a single die

Semiconductor memory device structure

Power island segmentation for selective bond-out

Semiconductor device using wires and stacked semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

METHODS AND APPARATUS TO MITIGATE ELECTROMIGRATION IN INTEGRATED CI...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTERCONNECT STRUCTURE

Techniques For Arranging Conductive Pads In Electronic Devices

SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH ELECTRONIC CIRCUIT UNITS

SEMICONDUCTOR PACKAGE

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

BASIN-SHAPED UNDERBUMP PLATES AND METHODS OF FORMING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

BONDED ASSEMBLY CONTAINING DIFFERENT SIZE OPPOSING BONDING PADS AND...

SEMICONDUCTOR PACKAGE

DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, D...

BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES

SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

BONDED ASSEMBLY INCLUDING INTERCONNECT-LEVEL BONDING PADS AND METHO...

SEMICONDUCTOR DEVICE

BOND ENHANCEMENT STRUCTURE IN MICROELECTRONICS FOR TRAPPING CONTAMI...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE FOR IMPROVING BONDING RELIABILITY

CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE

INFRARED SENSOR AND IMAGING APPARATUS

CHIP, CIRCUIT BOARD AND ELECTRONIC DEVICE