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H01L2224/30151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Method for coating conductive substrate with adhesive
- Patent number 10,056,534
- Issue date Aug 21, 2018
- G-SMATT CO., LTD.
- Hak Ryul Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of an integrated circuit chip and of a plate
- Patent number 9,941,188
- Issue date Apr 10, 2018
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, and semiconductor package and system each inclu...
- Patent number 8,519,470
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Sun-won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising blind vias intended to be metalized
- Patent number 8,482,130
- Issue date Jul 9, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,687,319
- Issue date Mar 30, 2010
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE
- Publication number 20170133297
- Publication date May 11, 2017
- STMicroelectronics (Crolles 2) SAS
- Louis-Michel Collin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE
- Publication number 20160284958
- Publication date Sep 29, 2016
- G-SMATT CO., LTD.
- Hak Ryul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME
- Publication number 20120273940
- Publication date Nov 1, 2012
- Hynix Semiconductor Inc.
- Seung Hee JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...
- Publication number 20110283034
- Publication date Nov 17, 2011
- Samsung Electronics Co., Ltd.
- Sun-won KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED
- Publication number 20110221068
- Publication date Sep 15, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Damien SAINT-PATRICE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080188058
- Publication date Aug 7, 2008
- Fujitsu Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dies bonding apparatus and dies bonding method
- Publication number 20050172891
- Publication date Aug 11, 2005
- Shinsuke Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

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Industry

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Current Industry

Patents Grantslast 30 patents

Method for coating conductive substrate with adhesive

Assembly of an integrated circuit chip and of a plate

Semiconductor chip, and semiconductor package and system each inclu...

Interconnect structure comprising blind vias intended to be metalized

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP AND OF A PLATE

METHOD FOR COATING CONDUCTIVE SUBSTRATE WITH ADHESIVE

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...

INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Dies bonding apparatus and dies bonding method