being uniform

Industry

CPC
H01L2224/09151

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/09151being uniform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip having chip pads of different surface areas, and...
- Patent number 11,682,643
- Issue date Jun 20, 2023
- SK hynix Inc.
- Ju Il Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded packaging module and manufacturing method for the same
- Patent number 11,552,039
- Issue date Jan 10, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Zengsheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including die bond pads at a die edge
- Patent number 10,128,218
- Issue date Nov 13, 2018
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with periphery contact pads surrounding central c...
- Patent number 9,859,196
- Issue date Jan 2, 2018
- STMicroelectronics (Shenzhen) R&D Co., Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,466,557
- Issue date Oct 11, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with first and second contact pads and related me...
- Patent number 9,287,227
- Issue date Mar 15, 2016
- STMicroelectronics (Shenzhen) R&D Co. Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-support for XFD packaging
- Patent number 9,123,555
- Issue date Sep 1, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005885
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyemi Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...
- Publication number 20220173061
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Ju Il EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20200251438
- Publication date Aug 6, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Zengsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE
- Publication number 20180175006
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...
- Publication number 20150155215
- Publication date Jun 4, 2015
- STMICROELECTRONICS (SHENZHEN) MANUFACTURING CO. LTD
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-SUPPORT FOR XFD PACKAGING
- Publication number 20150115472
- Publication date Apr 30, 2015
- Invensas Corporation
- Richard Dewitt Crisp
- H01 - BASIC ELECTRIC ELEMENTS

being uniform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip having chip pads of different surface areas, and...

Embedded packaging module and manufacturing method for the same

Semiconductor device including die bond pads at a die edge

Electronic device with periphery contact pads surrounding central c...

Electronic device with first and second contact pads and related me...

Electronic device with first and second contact pads and related me...

Co-support for XFD packaging

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP HAVING CHIP PADS OF DIFFERENT SURFACE AREAS, AND...

EMBEDDED PACKAGING MODULE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE

ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED ME...

CO-SUPPORT FOR XFD PACKAGING