Bent leads

Industry

CPC
H05K2201/10757

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10757Bent leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Battery pack and method of manufacture
- Patent number 12,095,046
- Issue date Sep 17, 2024
- BLACK & DECKER INC.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shunt resistor module
- Patent number 11,961,642
- Issue date Apr 16, 2024
- LG ENERGY SOLUTION, LTD.
- Dong-Wan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric compressor with inverter circuit section and filter circui...
- Patent number 11,936,251
- Issue date Mar 19, 2024
- SANDEN AUTOMOTIVE COMPONENTS CORPORATION
- Mikio Kobayashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Firing switch for compact capacitive discharge unit
- Patent number 11,927,431
- Issue date Mar 12, 2024
- Northrop Grumman Systems Corporation
- James D. Lucas
- F42 - AMMUNITION BLASTING
Information Patent Grant
Imaging unit and endoscope
- Patent number 11,857,166
- Issue date Jan 2, 2024
- Olympus Corporation
- Hiroyuki Motohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,728,240
- Issue date Aug 15, 2023
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,659,664
- Issue date May 23, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery pack and method of manufacture
- Patent number 11,563,239
- Issue date Jan 24, 2023
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB assembly and manufacturing method thereof
- Patent number 11,503,721
- Issue date Nov 15, 2022
- LG ENERGY SOLUTION, LTD.
- Seung-Min Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and electrically insulating member therefor
- Patent number 11,369,022
- Issue date Jun 21, 2022
- Mitsubishi Electric Corporation
- Haruyuki Matsuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical component and a method for producing an electrical compo...
- Patent number 11,342,126
- Issue date May 24, 2022
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and substrate having the same mounted thereon
- Patent number 11,302,481
- Issue date Apr 12, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Beom Joon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically-compliant and electrically and thermally conductive le...
- Patent number 11,272,618
- Issue date Mar 8, 2022
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,212,908
- Issue date Dec 28, 2021
- Mitsubishi Electric Corporation
- Yuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, circuit board with integrated circuit, and disp...
- Patent number 11,114,372
- Issue date Sep 7, 2021
- LG Display Co., Ltd.
- Jungjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection box
- Patent number 10,958,027
- Issue date Mar 23, 2021
- Sumitomo Wiring Systems, Ltd.
- Ryoma Hamada
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electrical connection contact for a ceramic component, a ceramic co...
- Patent number 10,943,740
- Issue date Mar 9, 2021
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with relay mounted to substrate
- Patent number 10,945,336
- Issue date Mar 9, 2021
- TE Connectivity Corporation
- Ronald Martin Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,912,186
- Issue date Feb 2, 2021
- Mitsubishi Electric Corporation
- Shota Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting arrangement and corresponding method for mounting an ele...
- Patent number 10,905,010
- Issue date Jan 26, 2021
- Robert Bosch GmbH
- Helmut Seiband
- G01 - MEASURING TESTING
Information Patent Grant
System and method for minimizing connector pad open-circuit stubs
- Patent number 10,856,414
- Issue date Dec 1, 2020
- Dell Products, L.P.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing of wire bond wire tips to provide bent-over tips
- Patent number 10,806,036
- Issue date Oct 13, 2020
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection terminal assembly and electromotive drive device using same
- Patent number 10,770,955
- Issue date Sep 8, 2020
- Hitachi Automotive Systems, Ltd.
- Keiji Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection terminal assembled body and circuit board using same con...
- Patent number 10,770,812
- Issue date Sep 8, 2020
- Hitachi Automotive Systems, Ltd.
- Katsumasa Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse mounted gull wing electronic package
- Patent number 10,699,992
- Issue date Jun 30, 2020
- Intel Corporation
- Juan Landeros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module assembly and assembling method thereof
- Patent number 10,638,646
- Issue date Apr 28, 2020
- Delta Electronics (Shanghai) Co., Ltd.
- Wei Guo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Solder component
- Patent number 10,594,061
- Issue date Mar 17, 2020
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement and method for connecting an electrical component to a...
- Patent number 10,539,585
- Issue date Jan 21, 2020
- Continental Automotive Systems, Inc.
- Gaetan Vich
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20250168985
- Publication date May 22, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Toshiharu MOTOFUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE
- Publication number 20250106978
- Publication date Mar 27, 2025
- LG Innotek Co., Ltd.
- Ho Sung KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...
- Publication number 20250062592
- Publication date Feb 20, 2025
- PRIMAX ELECTRONICS LTD.
- CHING-HUI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20240421365
- Publication date Dec 19, 2024
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR PIN ALIGNMENT ASSEMBLY
- Publication number 20240215167
- Publication date Jun 27, 2024
- Garrett Transportation I Inc.
- Valeriy Fedorikhin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240206074
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
- Publication number 20240090130
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Chad CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Sink Component Terminations
- Publication number 20240032185
- Publication date Jan 25, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20230207899
- Publication date Jun 29, 2023
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220330429
- Publication date Oct 13, 2022
- Fuji Electric Co., Ltd.
- Taichi ITOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shunt Resistor Module
- Publication number 20220102032
- Publication date Mar 31, 2022
- LG ENERGY SOLUTION, LTD.
- Dong-Wan KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20220087023
- Publication date Mar 17, 2022
- SEIKO EPSON CORPORATION
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND ELECTRICALLY INSULATING MEMBER THEREFOR
- Publication number 20210204407
- Publication date Jul 1, 2021
- Mitsubishi Electric Corporation
- Haruyuki MATSUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20210176868
- Publication date Jun 10, 2021
- LG CHEM, LTD.
- Seung-Min YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SUBSTRATE HAVING THE SAME MOUNTED THEREON
- Publication number 20210027946
- Publication date Jan 28, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Beom Joon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING UNIT AND ENDOSCOPE
- Publication number 20210006690
- Publication date Jan 7, 2021
- OLYMPUS CORPORATION
- Hiroyuki MOTOHARA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20200350635
- Publication date Nov 5, 2020
- Moriah Counts
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20200196432
- Publication date Jun 18, 2020
- Mitsubishi Electric Corporation
- Yuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, CIRCUIT BOARD WITH INTEGRATED CIRCUIT, AND DISP...
- Publication number 20200006216
- Publication date Jan 2, 2020
- LG Display Co., Ltd.
- Jungjae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH RELAY MOUNTED TO SUBSTRATE
- Publication number 20190387627
- Publication date Dec 19, 2019
- TE Connectivity Corporation
- Ronald Martin Weber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20190304702
- Publication date Oct 3, 2019
- EPCOS AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Minimizing Connector Pad Open-Circuit Stubs
- Publication number 20190281698
- Publication date Sep 12, 2019
- DELL PRODUCTS, L.P.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION TERMINAL ASSEMBLED BODY AND CIRCUIT BOARD USING SAME CON...
- Publication number 20190221952
- Publication date Jul 18, 2019
- Hitachi Automotive Systems, Ltd.
- Katsumasa HAGIWARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE ASSEMBLY AND ASSEMBLING METHOD THEREOF
- Publication number 20190069438
- Publication date Feb 28, 2019
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Wei Guo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CONNECTION TERMINAL ASSEMBLY AND ELECTROMOTIVE DRIVE DEVICE USING SAME
- Publication number 20190028004
- Publication date Jan 24, 2019
- Hitachi Automotive Systems, Ltd.
- Keiji HAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting Arrangement and Corresponding Method for Mounting an Ele...
- Publication number 20180352657
- Publication date Dec 6, 2018
- ROBERT BOSCH GmbH
- Helmut Seiband
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180343736
- Publication date Nov 29, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Shota SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REVERSE MOUNTED GULL WING ELECTRONIC PACKAGE
- Publication number 20180337114
- Publication date Nov 22, 2018
- Intel Corporation
- Juan Landeros
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Battery pack and method of manufacture

Semiconductor device, printed circuit board (PCB), and method of in...

Shunt resistor module

Circuit carrier arrangement and method for producing such a circuit...

Electric compressor with inverter circuit section and filter circui...

Firing switch for compact capacitive discharge unit

Imaging unit and endoscope

Circuit carrier arrangement and method for producing such a circuit...

Electronic device

Battery pack and method of manufacture

PCB assembly and manufacturing method thereof

Electronic device and electrically insulating member therefor

Electrical component and a method for producing an electrical compo...

Electronic component and substrate having the same mounted thereon

Mechanically-compliant and electrically and thermally conductive le...

Semiconductor apparatus

Integrated circuit, circuit board with integrated circuit, and disp...

Electrical connection box

Electrical connection contact for a ceramic component, a ceramic co...

Electronic device with relay mounted to substrate

Semiconductor device

Connecting arrangement and corresponding method for mounting an ele...

System and method for minimizing connector pad open-circuit stubs

Pressing of wire bond wire tips to provide bent-over tips

Connection terminal assembly and electromotive drive device using same

Connection terminal assembled body and circuit board using same con...

Reverse mounted gull wing electronic package

Power module assembly and assembling method thereof

Solder component

Arrangement and method for connecting an electrical component to a...

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE

OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

BATTERY PACK AND METHOD OF MANUFACTURE

TRANSISTOR PIN ALIGNMENT ASSEMBLY

SEMICONDUCTOR STORAGE DEVICE

LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING

Heat Sink Component Terminations

BATTERY PACK AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Shunt Resistor Module

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND ELECTRICALLY INSULATING MEMBER THEREFOR

PCB ASSEMBLY AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT AND SUBSTRATE HAVING THE SAME MOUNTED THEREON

IMAGING UNIT AND ENDOSCOPE

BATTERY PACK AND METHOD OF MANUFACTURE

SEMICONDUCTOR APPARATUS

INTEGRATED CIRCUIT, CIRCUIT BOARD WITH INTEGRATED CIRCUIT, AND DISP...

ELECTRONIC DEVICE WITH RELAY MOUNTED TO SUBSTRATE

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

System and Method for Minimizing Connector Pad Open-Circuit Stubs

CONNECTION TERMINAL ASSEMBLED BODY AND CIRCUIT BOARD USING SAME CON...

POWER MODULE ASSEMBLY AND ASSEMBLING METHOD THEREOF

CONNECTION TERMINAL ASSEMBLY AND ELECTROMOTIVE DRIVE DEVICE USING SAME

Connecting Arrangement and Corresponding Method for Mounting an Ele...

SEMICONDUCTOR DEVICE

REVERSE MOUNTED GULL WING ELECTRONIC PACKAGE