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Semiconductor device
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Patent number 11,621,321
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Issue date Apr 4, 2023
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Mitsubishi Electric Corporation
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Kazuya Konishi
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H01 - BASIC ELECTRIC ELEMENTS
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Wafer scale packaging
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Patent number 11,398,402
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Issue date Jul 26, 2022
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AKOUSTIS, INC.
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Jeffrey B. Shealy
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H01 - BASIC ELECTRIC ELEMENTS
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Wafer scale packaging
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Patent number 10,431,490
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Issue date Oct 1, 2019
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AKOUSTIS, INC.
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Jeffrey B. Shealy
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H03 - BASIC ELECTRONIC CIRCUITRY
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Wafer scale packaging
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Patent number 9,805,966
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Issue date Oct 31, 2017
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AKOUSTIS, INC.
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Jeffrey B. Shealy
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H03 - BASIC ELECTRONIC CIRCUITRY
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