between electrically conductive surfaces

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H01L2224/83895

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83895between electrically conductive surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,068,267
- Issue date Aug 20, 2024
- Kioxia Corporation
- Yoshihiro Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 11,948,910
- Issue date Apr 2, 2024
- Canon Kabushiki Kaisha
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 11,935,862
- Issue date Mar 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of three-dimensional NAND memory devices with multiple...
- Patent number 11,923,339
- Issue date Mar 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,864,367
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and electronic systems
- Patent number 11,842,990
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and electronic systems
- Patent number 11,837,594
- Issue date Dec 5, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including bonding la...
- Patent number 11,824,035
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Jaehyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric and metallic nanowire bond layers
- Patent number 11,791,296
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,764,126
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connecting structure having nano-twins copper
- Patent number 11,715,721
- Issue date Aug 1, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having programmable logic device and N...
- Patent number 11,711,913
- Issue date Jul 25, 2023
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 11,682,553
- Issue date Jun 20, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Hasan Naser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages formed using RDL-last process
- Patent number 11,670,617
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 11,652,083
- Issue date May 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,621,239
- Issue date Apr 4, 2023
- Kioxia Corporation
- Yoshihiro Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,581,277
- Issue date Feb 14, 2023
- Kioxia Corporation
- Yoshihiro Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSED STACKED DIES
- Publication number 20240404990
- Publication date Dec 5, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF INTEGRATED CIRCUIT WAFERS
- Publication number 20240170451
- Publication date May 23, 2024
- STMicroelectronics (Crolles 2) SAS
- Come De Buttet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20240063205
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES
- Publication number 20240047450
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROU...
- Publication number 20230352415
- Publication date Nov 2, 2023
- Broadcom International Pte. Ltd.
- Thomas Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20230282610
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230130044
- Publication date Apr 27, 2023
- KIOXIA Corporation
- Yoshihiro UOZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSES
- Publication number 20230047555
- Publication date Feb 16, 2023
- TEXAS INSTRUMENTS INCORPORATED
- KEN PHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20230005903
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...
- Publication number 20230005902
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20220392864
- Publication date Dec 8, 2022
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Kun ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...
- Publication number 20220384387
- Publication date Dec 1, 2022
- CANON KABUSHIKI KAISHA
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20220302077
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Takashi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER
- Publication number 20220293549
- Publication date Sep 15, 2022
- SAMSUNG ELECATRONICS CO., LTD.
- Jaehyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220293540
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20220165611
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DIE STACK STRUCTURE
- Publication number 20220165711
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS
- Publication number 20220102307
- Publication date Mar 31, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Scott Robert SUMMERFELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...
- Publication number 20220068905
- Publication date Mar 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20220020716
- Publication date Jan 20, 2022
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER
- Publication number 20210407960
- Publication date Dec 30, 2021
- National Yang Ming Chiao Tung University
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210343623
- Publication date Nov 4, 2021
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS

between electrically conductive surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming a three-dimensional (3D) memory device having bo...

Semiconductor device and method for manufacturing the same

Processed stacked dies

Manufacturing method of semiconductor apparatus and semiconductor a...

Three-dimensional memory devices and methods for forming the same

Integration of three-dimensional NAND memory devices with multiple...

Bonding process with inhibited oxide formation

Bonded semiconductor devices having processor and NAND flash memory...

Seal ring structures and methods of forming same

Microelectronic devices and electronic systems

Bonding structures and methods for forming the same

Microelectronic devices and electronic systems

Method of manufacturing a semiconductor device including bonding la...

Dielectric and metallic nanowire bond layers

Semiconductor device and method of manufacturing semiconductor device

Dielectric-dielectric and metallization bonding via plasma activati...

Electrical connecting structure having nano-twins copper

Bonded semiconductor devices having programmable logic device and N...

Method of manufacturing an electronic device

Packages formed using RDL-last process

System on integrated chips and methods of forming same

Processed stacked dies

Raised via for terminal connections on different planes

Bonded unified semiconductor chips and fabrication and operation me...

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Chemical mechanical polishing for hybrid bonding

Patents Applicationslast 30 patents

PROCESSED STACKED DIES

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

ASSEMBLY OF INTEGRATED CIRCUIT WAFERS

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

METHODS OF FORMING MICROELECTRONIC DEVICES

METHODS OF FORMING MICROELECTRONIC DEVICES

MACROCHIP WITH INTERCONNECT STACK FOR POWER DELIVERY AND SIGNAL ROU...

PROCESSED STACKED DIES

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

SEMICONDUCTOR DEVICES AND PROCESSES

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTR...

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR A...

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD

SEMICONDUCTOR DEVICES INCLUDING BONDING LAYER AND ADSORPTION LAYER

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

Raised Via for Terminal Connections on Different Planes

METHOD OF MANUFACTURING DIE STACK STRUCTURE

DIELECTRIC AND METALLIC NANOWIRE BOND LAYERS

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE...

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

ELECTRICAL CONNECTING STRUCTURE HAVING NANO-TWINS COPPER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE