between electrically conductive surfaces

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82896between electrically conductive surfaces

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Patents Grantslast 30 patents

Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
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- Taiwan Semiconductor Manufacturing Co., Ltd
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
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- Issue date Dec 19, 2023
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Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
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Information Patent Grant
Semiconductor device and method of forming the same
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- Issue date Aug 9, 2022
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Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
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- Invensas Corporation
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Information Patent Grant
Engineered substrate with embedded mirror
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Information Patent Grant
Forming metal bonds with recesses
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- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,685,935
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
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Information Patent Grant
Semiconductor device and method
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- Issue date Mar 10, 2020
- CHIP SOLUTIONS, LLC
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Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
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- Issue date Sep 3, 2019
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Information Patent Grant
Releasable carrier method
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- Issue date Jul 16, 2019
- CHIP SOLUTIONS, LLC
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Information Patent Grant
Releasable carrier and method
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- Issue date Jun 25, 2019
- CHIP SOLUTIONS, LLC
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Information Patent Grant
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Information Patent Grant
Semiconductor device and method
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Information Patent Grant
Semiconductor device and method
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Information Patent Grant
Semiconductor device and method
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Information Patent Grant
Method for metalizing blind vias
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- Issue date Apr 14, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
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Redistribution Layer (RDL) Layouts for Integrated Circuits
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- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
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METHOD OF MANUFACTURING THREE-DIMENSIONAL SYSTEM-ON-CHIP AND THREE-...
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DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
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WAFER BONDING METHOD AND BONDED WAFER
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SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20190341350
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- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
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- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
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- Chip Solutions, LLC
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SEMICONDUCTOR DEVICE AND METHOD
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- Publication number 20170025381
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- H01 - BASIC ELECTRIC ELEMENTS
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- Publication date Jan 19, 2017
- Chip Solutions, LLC
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METHOD FOR METALIZING BLIND VIAS
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- Comm. á I'éner. atom. et aux énergies alter.
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- H01 - BASIC ELECTRIC ELEMENTS

between electrically conductive surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Redistribution layer (RDL) layouts for integrated circuits

Semiconductor device and method of forming the same

Redistribution layer (RDL) layouts for integrated circuits

Semiconductor device and method of forming the same

Dielets on flexible and stretchable packaging for microelectronics

Engineered substrate with embedded mirror

Forming metal bonds with recesses

Forming metal bonds with recesses

Semiconductor device and method

Dielets on flexible and stretchable packaging for microelectronics

Releasable carrier method

Releasable carrier and method

Semiconductor device and method

Semiconductor device and method

Semiconductor device and method

Semiconductor device and method

Method for metalizing blind vias

Patents Applicationslast 30 patents

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

Semiconductor Device and Method of Forming the Same

Redistribution Layer (RDL) Layouts for Integrated Circuits

METHOD OF MANUFACTURING THREE-DIMENSIONAL SYSTEM-ON-CHIP AND THREE-...

Semiconductor Device and Method of Forming the Same

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

WAFER BONDING METHOD AND BONDED WAFER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Forming Metal Bonds with Recesses

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

REDISTRIBUTION LAYER (RDL) LAYOUTS FOR INTEGRATED CIRCUITS

Forming Metal Bonds with Recesses

RELEASABLE CARRIER METHOD

SEMICONDUCTOR DEVICE AND METHOD

HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT

SEMICONDUCTOR DEVICE AND METHOD

3DIC Interconnect Apparatus and Method

METHOD FOR METALIZING BLIND VIAS