between electrically conductive surfaces

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H01L2224/80895

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80895between electrically conductive surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,368,121
- Issue date Jul 22, 2025
- SK hynix Inc.
- Yu Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded nanoparticles for on-die thermal enhancement of hybrid bon...
- Patent number 12,368,131
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded memory devices and methods of making the same
- Patent number 12,362,301
- Issue date Jul 15, 2025
- SanDisk Technologies, Inc.
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer and process of making
- Patent number 12,362,304
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,362,302
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method of manufacturing the same
- Patent number 12,364,047
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Doowon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous dielectric bonding scheme
- Patent number 12,362,315
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor device and method of testing the stack typ...
- Patent number 12,362,324
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seong Hwi Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,362,291
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and storage system
- Patent number 12,354,941
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shu-Liang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 12,354,965
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,354,929
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including memory chip and peripheral memory chip and...
- Patent number 12,354,985
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Jooyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and fabrication method
- Patent number 12,354,994
- Issue date Jul 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhiyong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,355,007
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating same
- Patent number 12,347,765
- Issue date Jul 1, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy pattern structure for reducing dishing
- Patent number 12,347,792
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional (3D) memory device and fabrication method
- Patent number 12,347,787
- Issue date Jul 1, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chuanhai Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, solid state image senso...
- Patent number 12,347,798
- Issue date Jul 1, 2025
- Sony Group Corporation
- Masaki Haneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,349,354
- Issue date Jul 1, 2025
- SK hynix Inc.
- Dong Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with source line isolation and meth...
- Patent number 12,347,779
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Ramy Nashed Bassely Said
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dimension compensation control for directly bonded structures
- Patent number 12,341,125
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a hybrid bonded interposer for di...
- Patent number 12,341,114
- Issue date Jun 24, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment-free micro-display architecture
- Patent number 12,336,357
- Issue date Jun 17, 2025
- Meta Platforms Technologies, LLC
- Wei Sin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure using two oxide layers with different stress leve...
- Patent number 12,334,461
- Issue date Jun 17, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jorge A. Lubguban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for wafer level bonding and bonded semicond...
- Patent number 12,334,462
- Issue date Jun 17, 2025
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D trench capacitor for integrated passive devices
- Patent number 12,334,475
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
- Publication number 20250239574
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250240979
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji KANAMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND EL...
- Publication number 20250240957
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMIC...
- Publication number 20250239577
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Oh
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES
- Publication number 20250239579
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tso-Jung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20250240978
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Soochan CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE LAYER MEMORY DEVICE
- Publication number 20250234564
- Publication date Jul 17, 2025
- Rambus Inc.
- Thomas VOGELSANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, HYBRID BONDING INSULA...
- Publication number 20250233103
- Publication date Jul 17, 2025
- HD MICROSYSTEMS, LTD.
- Satoshi YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250234554
- Publication date Jul 17, 2025
- Yunjo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...
- Publication number 20250234543
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...
- Publication number 20250234545
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-...
- Publication number 20250233106
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233113
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...
- Publication number 20250233095
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226278
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226355
- Publication date Jul 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE HYBRID BONDED APPARATUS
- Publication number 20250226356
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTING OF DESIGN AND MASK SHAPE POSITION DUE TO DIE AND WAFER D...
- Publication number 20250226265
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Dave POWER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF
- Publication number 20250218889
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Min Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20250221080
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Daehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...
- Publication number 20250218891
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Shih Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES
- Publication number 20250218988
- Publication date Jul 3, 2025
- Intel Corporation
- Yosuke KANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250220904
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Myunghun Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250220927
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250220929
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...
- Publication number 20250218847
- Publication date Jul 3, 2025
- Intel Corporation
- Veronica A. Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES
- Publication number 20250218933
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

between electrically conductive surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling systems for advanced device packaging and methods...

Semiconductor memory device

Embedded nanoparticles for on-die thermal enhancement of hybrid bon...

Bonded memory devices and methods of making the same

Bonding layer and process of making

Semiconductor devices and data storage systems including the same

Semiconductor package and method of manufacturing semiconductor pac...

Image sensor and method of manufacturing the same

Heterogeneous dielectric bonding scheme

Stack type semiconductor device and method of testing the stack typ...

Semiconductor device and method

Chip package structure and storage system

Semiconductor device with redistribution structure and method for f...

Package structure and manufacturing method thereof

Memory device including memory chip and peripheral memory chip and...

Three-dimensional memory device and fabrication method

Signal routing between memory die and logic die for performing oper...

Package and method of fabricating the same

Semiconductor structure and method for fabricating same

Dummy pattern structure for reducing dishing

Three dimensional (3D) memory device and fabrication method

Semiconductor device, manufacturing method, solid state image senso...

Semiconductor memory device and manufacturing method thereof

Three-dimensional memory device with source line isolation and meth...

Dimension compensation control for directly bonded structures

Microelectronic assemblies having a hybrid bonded interposer for di...

Alignment-free micro-display architecture

Bonding structure using two oxide layers with different stress leve...

Semiconductor structure for wafer level bonding and bonded semicond...

3D trench capacitor for integrated passive devices

Patents Applicationslast 30 patents

FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM

MEMORY DEVICE

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

SEMICONDUCTOR MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND EL...

CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMIC...

SEMICONDUCTOR PACKAGE STRUCTURE WITH INTERPOSER DIES

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

MULTI-DIE LAYER MEMORY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, HYBRID BONDING INSULA...

SEMICONDUCTOR DEVICES

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...

INTEGRATED SEMICONDUCTOR PACKAGING SYSTEM WITH ENHANCED DIELECTRIC-...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR C...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RELIABLE HYBRID BONDED APPARATUS

CORRECTING OF DESIGN AND MASK SHAPE POSITION DUE TO DIE AND WAFER D...

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHODS THEREOF

IMAGE SENSOR

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL PATH TO CARRIER SUB...

DIRECT BOND INTERCONNECT ARCHITECTURES FOR PACKAGING ASSEMBLIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES

CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INT...

DIELECTRIC WINDOWS FOR GROUPS OF VIAS THROUGH SEMICONDUCTOR SUBSTRATES