between electrically conductive surfaces

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H01L2224/80895

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80895between electrically conductive surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Contact structures for three-dimensional memory devices and methods...
- Patent number 12,283,547
- Issue date Apr 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended seal ring structure on wafer-stacking
- Patent number 12,283,552
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device with a conductive etch stop layer, metho...
- Patent number 12,278,201
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth package structure
- Patent number 12,278,166
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,278,203
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,278,214
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral circuit having recess gate transistors and method for fo...
- Patent number 12,278,209
- Issue date Apr 15, 2025
- Yangtze Memory Technologies Co., Ltd.
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,278,210
- Issue date Apr 15, 2025
- United Microelectronics Corp.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,272,686
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked chip that shares power rails
- Patent number 12,272,647
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and stacked storage unit...
- Patent number 12,274,049
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory peripheral circuit having three-dimensional transistors and...
- Patent number 12,274,066
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor packaging system with enhanced dielectric-...
- Patent number 12,272,670
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having hybrid bondi...
- Patent number 12,266,622
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically mounted die groups
- Patent number 12,266,634
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate layered body and layered body
- Patent number 12,261,143
- Issue date Mar 25, 2025
- Mitsui Chemicals, Inc.
- Yasuhisa Kayaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,261,151
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device manufacturing method
- Patent number 12,261,161
- Issue date Mar 25, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- François Templier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded dies in semiconductor packages and methods of forming same
- Patent number 12,261,163
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,261,149
- Issue date Mar 25, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Shih-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrate rinse module in hybrid bonding platform
- Patent number 12,255,062
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mirror image of geometrical patterns in stacked integrated circuit...
- Patent number 12,255,178
- Issue date Mar 18, 2025
- Mellanox Technologies, Ltd.
- Ido Bourstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 12,255,181
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding system and method of using the same
- Patent number 12,255,171
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including substrates bonded to each other and...
- Patent number 12,255,126
- Issue date Mar 18, 2025
- SK hynix Inc.
- Mi Seon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132296
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250133723
- Publication date Apr 24, 2025
- SK HYNIX INC.
- Myung Hee NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS AND...
- Publication number 20250133753
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD INCLUDING POSITIONING A SOURCE DIE OR A DESTINATION SITE TO...
- Publication number 20250132285
- Publication date Apr 24, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIFFERENT WIDTH SUPPORT PILLAR...
- Publication number 20250133737
- Publication date Apr 24, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Tomohiro KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250133752
- Publication date Apr 24, 2025
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD INCLUDING POSITIONING A DUMMY SOURCE DIE OR A DESTINATION SI...
- Publication number 20250132206
- Publication date Apr 24, 2025
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL TEST PAD
- Publication number 20250132208
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250125291
- Publication date Apr 17, 2025
- MICLEDI MICRODISPLAYS BV
- Emmanuel LE BOULBAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250126796
- Publication date Apr 17, 2025
- SK HYNIX INC.
- Eun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20250126811
- Publication date Apr 17, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS
- Publication number 20250125293
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...
- Publication number 20250118693
- Publication date Apr 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH MULTIPLE HBM STACKS
- Publication number 20250118719
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Brett P. WILKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mitigating process problems in hybrid bonding of vertical die stacking
- Publication number 20250118692
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250118710
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20250118649
- Publication date Apr 10, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...
- Publication number 20250113484
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masato NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...
- Publication number 20250112077
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Publication number 20250112173
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Publication number 20250112199
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...
- Publication number 20250112200
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...
- Publication number 20250113486
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Nobuyuki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113492
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT
- Publication number 20250112187
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250113700
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

between electrically conductive surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact structures for three-dimensional memory devices and methods...

Extended seal ring structure on wafer-stacking

Non-volatile memory device with a conductive etch stop layer, metho...

High bandwidth package structure

Modular construction of hybrid-bonded semiconductor die assemblies...

Semiconductor structure and manufacturing method thereof

Integrated circuit package and method

Peripheral circuit having recess gate transistors and method for fo...

Manufacturing method of semiconductor structure

Capacitive coupling in a direct-bonded interface for microelectroni...

Stacking structure, package structure and method of fabricating the...

Semiconductor structure and manufacturing method of the same

3D stacked chip that shares power rails

Memory devices having vertical transistors and stacked storage unit...

Memory peripheral circuit having three-dimensional transistors and...

Integrated semiconductor packaging system with enhanced dielectric-...

Method of manufacturing semiconductor structure having hybrid bondi...

Vertically mounted die groups

Method of manufacturing substrate layered body and layered body

Integrated circuit packages

Optoelectronic device manufacturing method

Molded dies in semiconductor packages and methods of forming same

Manufacturing method of semiconductor structure

Integrate rinse module in hybrid bonding platform

Bond pads for semiconductor die assemblies and associated methods a...

Mirror image of geometrical patterns in stacked integrated circuit...

Methods for forming three-dimensional memory devices

Wafer bonding system and method of using the same

Semiconductor devices including substrates bonded to each other and...

Integrated structure with bifunctional routing and assembly compris...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACK TYPE SEMICONDUCTOR MEMORY DEVICE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS AND...

METHOD INCLUDING POSITIONING A SOURCE DIE OR A DESTINATION SITE TO...

THREE-DIMENSIONAL MEMORY DEVICE WITH DIFFERENT WIDTH SUPPORT PILLAR...

STACK TYPE SEMICONDUCTOR MEMORY DEVICE

METHOD INCLUDING POSITIONING A DUMMY SOURCE DIE OR A DESTINATION SI...

SACRIFICIAL TEST PAD

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

SEMICONDUCTOR PRODUCT AND METHOD FOR MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS

TECHNIQUES FOR SEMICONDUCTOR DIE COUPLING IN STACKED MEMORY ARCHITE...

CHIP PACKAGE WITH MULTIPLE HBM STACKS

Mitigating process problems in hybrid bonding of vertical die stacking

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

Method for Forming Semiconductor Package and Semiconductor Package

SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...

ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRA...

PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES

SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES

HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT

QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD