between electrically insulating surfaces

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H01L2224/81896

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81896between electrically insulating surfaces

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Patents Grantslast 30 patents

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Information Patent Grant
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
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MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
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- The Regents of the University of California
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between electrically insulating surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Modified direct bond interconnect for FPAs

Electronic device bonding structure and fabrication method thereof

Mixed hybrid bonding structures and methods of forming the same

Optical-electrical interposers

Method for fabricating substrate structure and substrate structure...

Optoelectronic component and method for producing an optoelectronic...

Semiconductor device including built-in crack-arresting film structure

Method for fabricating substrate structure and substrate structure...

Semiconductor device including built-in crack-arresting film structure

Integrated device comprising high density interconnects in inorgani...

Patents Applicationslast 30 patents

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE BONDING STRUCTURE AND FABRICATION METHOD THEREOF

Modified Direct Bond Interconnect for FPAs

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

OPTICAL-ELECTRICAL INTERPOSERS

METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...

METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME