between electrically insulating surfaces

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CPC
H01L2224/81896

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81896between electrically insulating surfaces

Industries

Patents Grantslast 30 patents

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Information Patent Grant
Electronic device bonding structure and fabrication method thereof
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Information Patent Grant
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- Issue date Dec 8, 2020
- The Regents of the University of California
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Information Patent Grant
Method for fabricating substrate structure and substrate structure...
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Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
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Information Patent Grant
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Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
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Information Patent Grant
Integrated device comprising high density interconnects in inorgani...
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- Issue date Aug 16, 2016
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Patents Applicationslast 30 patents

Information Patent Application
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Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
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- Publication date Apr 27, 2023
- SK HYNIX INC.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE BONDING STRUCTURE AND FABRICATION METHOD THEREOF
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Information Patent Application
Modified Direct Bond Interconnect for FPAs
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- Publication date Feb 17, 2022
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Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
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- Publication date Jan 20, 2022
- Intel Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20210098411
- Publication date Apr 1, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL-ELECTRICAL INTERPOSERS
- Publication number 20190310433
- Publication date Oct 10, 2019
- The Regents of the University of California
- Sung-Joo Ben Yoo
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METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...
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- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...
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Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME
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- Publication date Nov 1, 2012
- Hynix Semiconductor Inc.
- Seung Hee JO
- H01 - BASIC ELECTRIC ELEMENTS

between electrically insulating surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Modified direct bond interconnect for FPAs

Electronic device bonding structure and fabrication method thereof

Mixed hybrid bonding structures and methods of forming the same

Optical-electrical interposers

Method for fabricating substrate structure and substrate structure...

Optoelectronic component and method for producing an optoelectronic...

Semiconductor device including built-in crack-arresting film structure

Method for fabricating substrate structure and substrate structure...

Semiconductor device including built-in crack-arresting film structure

Integrated device comprising high density interconnects in inorgani...

Patents Applicationslast 30 patents

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE BONDING STRUCTURE AND FABRICATION METHOD THEREOF

Modified Direct Bond Interconnect for FPAs

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

OPTICAL-ELECTRICAL INTERPOSERS

METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...

METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE...

SEMICONDUCTOR DEVICE INCLUDING BUILT-IN CRACK-ARRESTING FILM STRUCTURE

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...

SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME