between electrically insulating surfaces

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H01L2224/80896

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80896between electrically insulating surfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with redistribution structure
- Patent number 12,211,831
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device and method for fabricating semiconduct...
- Patent number 12,211,812
- Issue date Jan 28, 2025
- Kioxia Corporation
- Yuanting Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,813
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including backside conductive vias
- Patent number 12,205,997
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of three-dimensional stacking structure
- Patent number 12,191,283
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,193,234
- Issue date Jan 7, 2025
- SK hynix Inc.
- Byung Wook Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method for forming the same
- Patent number 12,191,269
- Issue date Jan 7, 2025
- Yangtze Memory Technologies Co., Ltd.
- Yuancheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector with reduced dark current sensitivity and methods of...
- Patent number 12,191,328
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yeh-Hsun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with logic circuits and memor...
- Patent number 12,183,699
- Issue date Dec 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,178,055
- Issue date Dec 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,176,309
- Issue date Dec 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yanhong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,176,310
- Issue date Dec 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of forming the same
- Patent number 12,176,321
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,170,257
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,170,258
- Issue date Dec 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Simon Shi-Ning Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250038073
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Han SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250040153
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- HYUN-MOOK CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grain Structure Engineering for Metal Gapfill Materials
- Publication number 20250038137
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250031370
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT
- Publication number 20250029972
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACKING PROCESS
- Publication number 20250029949
- Publication date Jan 23, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chih-Feng Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC EQUI...
- Publication number 20250031475
- Publication date Jan 23, 2025
- Sony Semiconductor Solutions Corporation
- HITOSHI OKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250031369
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING CHUCK WITH DISCRETE ACTUATORS
- Publication number 20250029866
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Craig A. Hickman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
- Publication number 20250022752
- Publication date Jan 16, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...
- Publication number 20250024676
- Publication date Jan 16, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING
- Publication number 20250022839
- Publication date Jan 16, 2025
- IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fu...
- Sebastian SCHULZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...
- Publication number 20250022840
- Publication date Jan 16, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Lasse Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES
- Publication number 20250022819
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- KiRak SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES
- Publication number 20250022869
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Sung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250024683
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20250016985
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20250015028
- Publication date Jan 9, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Profile Control Of Passivation Layers In Integrated Circuit...
- Publication number 20250014943
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20250015015
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- He CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES
- Publication number 20250015045
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- H. Jim Fulford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20250014961
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION
- Publication number 20250017026
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING MEMORY DEVICES INCLUDING CAPACITORS
- Publication number 20250017025
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015041
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLATILE MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS
- Publication number 20250015055
- Publication date Jan 9, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...
- Publication number 20250015002
- Publication date Jan 9, 2025
- AOI ELECTRONICS CO., LTD.
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGES
- Publication number 20250015027
- Publication date Jan 9, 2025
- Apple Inc.
- Jiongxin LU
- H01 - BASIC ELECTRIC ELEMENTS

between electrically insulating surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with redistribution structure

Semiconductor storage device and method for fabricating semiconduct...

Highly protective wafer edge sidewall protection layer

Semiconductor structure and manufacturing method thereof

TSV as pad

Oversized via as through-substrate-via (TSV) stop layer

Integrated circuit including backside conductive vias

Bonding system

Semiconductor device, semiconductor package and method of manufactu...

Embedded liquid cooling

Semiconductor device and method of manufacture

Methods of forming microelectronic device assemblies and packages

Semiconductor device and method for producing the same

Embedded cooling systems and methods of manufacturing embedded cool...

Manufacturing method of three-dimensional stacking structure

Semiconductor memory device and manufacturing method of semiconduct...

Three-dimensional memory device and method for forming the same

Photodetector with reduced dark current sensitivity and methods of...

3D semiconductor device and structure with logic circuits and memor...

Embedded cooling assemblies for advanced device packaging and metho...

3D semiconductor memory devices and structures

Three-dimensional memory devices and methods for forming the same

Memory devices having vertical transistors and methods for forming...

Semiconductor packages and method of forming the same

Semiconductor package and method of fabricating the same

Integrated circuit packages and methods of forming the same

Three-dimensional memory devices and methods for forming the same

Memory devices having vertical transistors and methods for forming...

Signal routing between memory die and logic die

Manufacturing method of package

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Grain Structure Engineering for Metal Gapfill Materials

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

SEMICONDUCTOR MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT

WAFER STACKING PROCESS

SEMICONDUCTOR CHIP, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC EQUI...

SEMICONDUCTOR MEMORY DEVICE

WAFER BONDING CHUCK WITH DISCRETE ACTUATORS

FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS

Semiconductor Device and Methods of Manufacture

THREE-DIMENSIONAL MEMORY DEVICE HAVING CONTROLLED LATERAL ISOLATION...

METHOD AND SYSTEM OF PERFORMING COLLECTIVE DIE-TO-WAFER BONDING

SEMICONDUCTOR POWER ENTITY AND METHOD FOR PRODUCING SUCH ENTITY BY...

METHODS FOR FORMING CONDUCTIVE STRUCTURES BETWEEN TWO SUBSTRATES

METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...

Surface Profile Control Of Passivation Layers In Integrated Circuit...

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

METHOD FOR STACKING INTEGRATED CIRCUIT WAFERS AND DIES

GAP-FILL DIELECTRICS FOR DIE STRUCTURES AND METHODS OF FORMING THE...

3D MEMORY CELL WITH DUAL-SIDE CONTACTS AND METHOD OF FABRICATION

METHODS OF FABRICATING MEMORY DEVICES INCLUDING CAPACITORS

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

VOLATILE MEMORY DEVICES AND RELATED ELECTRONIC SYSTEMS

SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC...

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGES