between electrically insulating surfaces

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H01L2224/80896

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80896between electrically insulating surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,144,179
- Issue date Nov 12, 2024
- SK hynix Inc.
- Eun Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,596
- Issue date Nov 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 12,137,568
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 12,136,599
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with backside source contact
- Patent number 12,136,618
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,132,020
- Issue date Oct 29, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,127,393
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technologies for plasma oxidation protection during hybrid bonding...
- Patent number 12,125,818
- Issue date Oct 22, 2024
- Tokyo Electron Limited
- Jack Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-dielectric vias for direct connection and method forming same
- Patent number 12,125,820
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interface for hybrid TFT-based micro display projector
- Patent number 12,125,959
- Issue date Oct 22, 2024
- Meta Platforms Technologies, LLC
- Daniel Henry Morris
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,125,812
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned isolation s...
- Patent number 12,127,406
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation of microelectronic components with direct bonding inter...
- Patent number 12,119,317
- Issue date Oct 15, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and electronic systems
- Patent number 12,113,052
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 12,113,037
- Issue date Oct 8, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device including peripheral circuit and cell arr...
- Patent number 12,107,061
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Homoon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature bonded structures
- Patent number 12,100,676
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 12,094,925
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 12,094,908
- Issue date Sep 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masaaki Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral circuit having recess gate transistors and method for fo...
- Patent number 12,089,413
- Issue date Sep 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yanwei Shi
- G11 - INFORMATION STORAGE
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 12,087,732
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for joining substrates
- Patent number 12,087,726
- Issue date Sep 10, 2024
- EV Group E. Thallner GmbH
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387489
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chia LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT SEMICONDUCTOR STRUCTURE
- Publication number 20240387426
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATED ASSEMBLY
- Publication number 20240387229
- Publication date Nov 21, 2024
- Disco Corporation
- Fumihiro INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERIPHERAL CIRCUIT HAVING RECESS GATE TRANSISTORS AND METHOD FOR FO...
- Publication number 20240389331
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Yanwei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240387468
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...
- Publication number 20240389307
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongxue ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240389365
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- SEUNGMIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BACKSIDE CONDUCTIVE VIAS
- Publication number 20240387652
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended Seal Ring Structure on Wafer-Stacking
- Publication number 20240387403
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Hsorng Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20240387428
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hongbin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...
- Publication number 20240387448
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Francisco MACHUCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS DIELECTRIC BONDING SCHEME
- Publication number 20240387449
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...
- Publication number 20240387399
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Vertical Interconnect Architecture and Methods Fo...
- Publication number 20240387458
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES
- Publication number 20240379602
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL STACKING OF WAFERS AND CHIPS
- Publication number 20240379614
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240379601
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240381672
- Publication date Nov 14, 2024
- SK HYNIX INC.
- Sung Wook JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240379619
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20240379635
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240381671
- Publication date Nov 14, 2024
- SK HYNIX INC.
- Sung Wook JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA STRUCTURES L...
- Publication number 20240381639
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VI...
- Publication number 20240381644
- Publication date Nov 14, 2024
- SANDISK TECHNOLOGIES LLC
- Ryo MIZUTSU
- H01 - BASIC ELECTRIC ELEMENTS

between electrically insulating surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor memory device and manufacturing method of semiconduct...

Semiconductor structure and manufacturing method thereof

Hybrid bonding contact structure of three-dimensional memory device

Three-dimensional memory devices and fabricating methods thereof

Three-dimensional memory device with backside source contact

Low temperature bonded structures

Memory devices having vertical transistors and methods for forming...

Method for forming semiconductor package and semiconductor package

Technologies for plasma oxidation protection during hybrid bonding...

Through-dielectric vias for direct connection and method forming same

Bonding interface for hybrid TFT-based micro display projector

Integrated circuit packages and methods of forming the same

Three-dimensional memory device containing self-aligned isolation s...

Singulation of microelectronic components with direct bonding inter...

Memory devices and electronic systems

Method for fabricating semiconductor device with redistribution plugs

Three-dimensional memory devices and methods for forming the same

Memory device for wafer-on-wafer formed memory and logic

Signal routing between memory die and logic die for mode based oper...

Integrated circuit device including peripheral circuit and cell arr...

Low temperature bonded structures

Bonded structures

Hybrid system including photonic and electronic integrated circuits...

Semiconductor structure and method for forming semiconductor struct...

Three-dimensional device structure including embedded integrated pa...

Solid-state imaging device and electronic device

Peripheral circuit having recess gate transistors and method for fo...

Isolation bonding film for semiconductor packages and methods of fo...

Device and method for joining substrates

Patents Applicationslast 30 patents

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTROMIGRATION RESISTANT SEMICONDUCTOR STRUCTURE

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

METHOD OF MANUFACTURING LAMINATED ASSEMBLY

PERIPHERAL CIRCUIT HAVING RECESS GATE TRANSISTORS AND METHOD FOR FO...

PACKAGE AND METHOD OF FABRICATING THE SAME

FABRICATION METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AN...

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

INTEGRATED CIRCUIT INCLUDING BACKSIDE CONDUCTIVE VIAS

Extended Seal Ring Structure on Wafer-Stacking

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

ROENTGEN INTEGRATED METROLOGY FOR HYBRID BONDING PROCESS CONTROL IN...

HETEROGENEOUS DIELECTRIC BONDING SCHEME

RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

Three-Dimensional Vertical Interconnect Architecture and Methods Fo...

METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES

MULTI-LEVEL STACKING OF WAFERS AND CHIPS

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

THREE-DIMENSIONAL MEMORY DEVICE WITH LAYER CONTACT VIA STRUCTURES L...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING COAXIAL DOUBLE CONTACT VI...