between electrically insulating surfaces

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CPC
H01L2224/83896

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83896between electrically insulating surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of deposition
- Patent number 12,131,899
- Issue date Oct 29, 2024
- SPTS Technology Limited
- Tristan Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die on die bonding structure
- Patent number 12,125,819
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
- Patent number 12,094,849
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-substrate FPGA semiconductor devices
- Patent number 12,087,750
- Issue date Sep 10, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct gang bonding methods including directly bonding first elemen...
- Patent number 12,080,672
- Issue date Sep 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a three-dimensional (3D) memory device having bo...
- Patent number 12,080,697
- Issue date Sep 3, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shiqi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,068,267
- Issue date Aug 20, 2024
- Kioxia Corporation
- Yoshihiro Uozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,068,277
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 12,068,278
- Issue date Aug 20, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including a first semiconductor wafer and a seco...
- Patent number 12,062,641
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,057,439
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close butted collocated variable technology imaging arrays on a sin...
- Patent number 12,051,712
- Issue date Jul 30, 2024
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of semiconduct...
- Patent number 12,027,511
- Issue date Jul 2, 2024
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing of advanced three-dimensional semiconductor...
- Patent number 12,021,072
- Issue date Jun 25, 2024
- Lumiense Photonics Inc.
- Robert Steven Hannebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid pocket post and tailored via dielectric for 3D-integrated el...
- Patent number 12,002,773
- Issue date Jun 4, 2024
- Raytheon Company
- Andrew Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit for a hybrid molecular bonding
- Patent number 11,990,436
- Issue date May 21, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element and display device including the same and me...
- Patent number 11,955,468
- Issue date Apr 9, 2024
- Samsung Display Co., Ltd.
- Yunku Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite structure, intended for a planar co-integration of electr...
- Patent number 11,955,375
- Issue date Apr 9, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Marilyne Roumanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 11,948,910
- Issue date Apr 2, 2024
- Canon Kabushiki Kaisha
- Shinichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 11,942,447
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and methods for forming the same
- Patent number 11,935,862
- Issue date Mar 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature with non-uniform critical dimension and method o...
- Patent number 11,935,816
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of three-dimensional NAND memory devices with multiple...
- Patent number 11,923,339
- Issue date Mar 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing semiconductor substrate surface unevenness
- Patent number 11,901,186
- Issue date Feb 13, 2024
- Massachusetts Institute of Technology
- Li Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a packaged device with optical pathway
- Patent number 11,899,242
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack and integrated device structure including improved bondin...
- Patent number 11,869,859
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly including inter-die via structures and methods for...
- Patent number 11,869,877
- Issue date Jan 9, 2024
- SanDisk Technologies LLC
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Apparatus and Method
- Publication number 20240387451
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ON DIE BONDING STRUCTURE
- Publication number 20240387452
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT GANG BONDING METHODS AND STRUCTURES
- Publication number 20240387439
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE WITH OPTICAL PATHWAY
- Publication number 20240377587
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240381647
- Publication date Nov 14, 2024
- KIOXIA Corporation
- Tatsunori ISOGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240379623
- Publication date Nov 14, 2024
- AP MEMORY TECHNOLOGY CORPORATION
- WENLIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20240363578
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355900
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Man-Nung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240355782
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES
- Publication number 20240332248
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332261
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20240321855
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20240274485
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...
- Publication number 20240266339
- Publication date Aug 8, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
- Publication number 20240234159
- Publication date Jul 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES
- Publication number 20240194670
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240186284
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF INTEGRATED CIRCUIT WAFERS
- Publication number 20240170451
- Publication date May 23, 2024
- STMicroelectronics (Crolles 2) SAS
- Come De Buttet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING
- Publication number 20240136196
- Publication date Apr 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20240128231
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128155
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minjun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240096846
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Hideyuki Fukushima
- B32 - LAYERED PRODUCTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240088123
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

between electrically insulating surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method having a through substrate via and...

Iterative formation of damascene interconnects

Method of deposition

Die on die bonding structure

Atomic layer deposition bonding layer for joining two semiconductor...

Stacked-substrate FPGA semiconductor devices

Direct gang bonding methods including directly bonding first elemen...

Method for forming a three-dimensional (3D) memory device having bo...

Semiconductor device and method for manufacturing the same

Heterogenous bonding layers for direct semiconductor bonding

Processed stacked dies

Integrated circuit including a first semiconductor wafer and a seco...

Integrated circuit packages

Close butted collocated variable technology imaging arrays on a sin...

Semiconductor memory device and manufacturing method of semiconduct...

Method of manufacturing of advanced three-dimensional semiconductor...

Hybrid pocket post and tailored via dielectric for 3D-integrated el...

Electronic circuit for a hybrid molecular bonding

Semiconductor package and manufacturing method of the same

Light emitting element and display device including the same and me...

Composite structure, intended for a planar co-integration of electr...

Manufacturing method of semiconductor apparatus and semiconductor a...

Storage layers for wafer bonding

Three-dimensional memory devices and methods for forming the same

Conductive feature with non-uniform critical dimension and method o...

Integration of three-dimensional NAND memory devices with multiple...

Method of reducing semiconductor substrate surface unevenness

Method of manufacturing a packaged device with optical pathway

Die stack and integrated device structure including improved bondin...

Bonded assembly including inter-die via structures and methods for...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

Wafer Bonding Apparatus and Method

DIE ON DIE BONDING STRUCTURE

DIRECT GANG BONDING METHODS AND STRUCTURES

PACKAGED DEVICE WITH OPTICAL PATHWAY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

DIRECT HYBRID BONDING IN TOPOGRAPHIC PACKAGES

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCT...

METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING

ASYMMETRICALLY BONDED INTEGRATED CIRCUIT DEVICES

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

ASSEMBLY OF INTEGRATED CIRCUIT WAFERS

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR PREPARING A SURFACE FOR DIRECT-BONDING

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

BONDING APPARATUS AND BONDING METHOD

Integrated Circuit Package and Method