between electrically insulating surfaces

Industry

CPC
H01L2224/82897

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/82897between electrically insulating surfaces

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
- Patent number 11,355,443
- Issue date Jun 7, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,854,574
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,685,935
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
- Patent number 10,403,577
- Issue date Sep 3, 2019
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE
- Publication number 20240413136
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Tsung-Kai Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
- Publication number 20230369292
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20220278048
- Publication date Sep 1, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal Bonds with Recesses
- Publication number 20200006288
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20190341350
- Publication date Nov 7, 2019
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal Bonds with Recesses
- Publication number 20190148336
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS
- Publication number 20190057950
- Publication date Feb 21, 2019
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT
- Publication number 20170025381
- Publication date Jan 26, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS

between electrically insulating surfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dielets on flexible and stretchable packaging for microelectronics

Forming metal bonds with recesses

Forming metal bonds with recesses

Dielets on flexible and stretchable packaging for microelectronics

Patents Applicationslast 30 patents

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

Forming Metal Bonds with Recesses

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

Forming Metal Bonds with Recesses

PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS

HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT