between other parts not provided for in B81B7/0048 - B81B7/0051

Industry

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B81B7/0054

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0054between other parts not provided for in B81B7/0048 - B81B7/0051

Industries

Patents Grantslast 30 patents

Information Patent Grant
MEMS device with a diaphragm having a net compressive stress
- Patent number 11,560,303
- Issue date Jan 24, 2023
- Knowles Electronics, LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 11,498,831
- Issue date Nov 15, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor
- Patent number 10,816,422
- Issue date Oct 27, 2020
- Invensense, Inc.
- Chung-Hsien Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device with terminal-containing sensor
- Patent number 10,775,402
- Issue date Sep 15, 2020
- VEONEER US INC.
- Jacob Pusheck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 10,723,616
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component
- Patent number 10,544,033
- Issue date Jan 28, 2020
- Robert Bosch GmbH
- Rudy Eid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with symmetrically embedded sensor elements
- Patent number 10,451,646
- Issue date Oct 22, 2019
- Continental Teves AG & Co. oHG
- Svenja Raukopf
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deformable apparatus and method
- Patent number 10,435,289
- Issue date Oct 8, 2019
- Nokia Technoloiges Oy
- Darryl Cotton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical sensor device with reduced stress-sensitivit...
- Patent number 10,427,933
- Issue date Oct 1, 2019
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for packaging stress-sensitive micro-electro-mechanical...
- Patent number 10,233,074
- Issue date Mar 19, 2019
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced stress pressure sensor
- Patent number 10,161,817
- Issue date Dec 25, 2018
- Invensense, Inc.
- Felix Mayer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure and method to mitigate soldering offset for wafer-level c...
- Patent number 10,131,540
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Chi Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure of MEMS PLCSP fabrication
- Patent number 9,975,759
- Issue date May 22, 2018
- MCube, Inc.
- Chien Chen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress decoupled piezoresistive relative pressure sensor and method...
- Patent number 9,938,135
- Issue date Apr 10, 2018
- Infineon Technologies Dresden GmbH
- Steffen Bieselt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical sensor device with reduced stress-sensitivit...
- Patent number 9,914,639
- Issue date Mar 13, 2018
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of protecting microelectro mechanical system device
- Patent number 9,771,260
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with deformable membrane and method of manufacture
- Patent number 9,581,512
- Issue date Feb 28, 2017
- Invensense, Inc.
- Chung-Hsien Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,550,670
- Issue date Jan 24, 2017
- Intel IP Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated component comprising a MEMS component and method for t...
- Patent number 9,481,565
- Issue date Nov 1, 2016
- Epcos AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
VHF etch barrier for semiconductor integrated microsystem
- Patent number 9,449,867
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Heng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface mount actuator
- Patent number 9,414,495
- Issue date Aug 9, 2016
- DigitalOptics Corporation MEMS
- Roman C. Gutierrez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dynamic quantity sensor
- Patent number 9,276,136
- Issue date Mar 1, 2016
- Dai Nippon Printing Co., Ltd.
- Katsumi Hashimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor arrangement with stress release and thermal insulation
- Patent number 9,238,578
- Issue date Jan 19, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device manufacturing method and sensor device
- Patent number 9,209,319
- Issue date Dec 8, 2015
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device assembly and method of packaging same
- Patent number 9,131,325
- Issue date Sep 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor arrangement with stress release configuration
- Patent number 9,114,976
- Issue date Aug 25, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectro mechanical system encapsulation scheme
- Patent number 9,073,748
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of improving MEMS microphone mechanical stability
- Patent number 8,921,957
- Issue date Dec 30, 2014
- Robert Bosch GmbH
- Yujie Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadless package housing having a symmetrical construction with def...
- Patent number 8,836,099
- Issue date Sep 16, 2014
- Robert Bosch GmbH
- Ricardo Ehrenpfordt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cantilever packages for sensor MEMS (micro-electro-mechanical system)
- Patent number 8,810,023
- Issue date Aug 19, 2014
- Texas Instruments Incorporated
- Sreenivasan Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...
- Publication number 20240228265
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SWITCH AND MANUFACTURE METHOD
- Publication number 20240166496
- Publication date May 23, 2024
- Beijing BOE Technology Development Co., Ltd.
- Yingli SHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT WITH REDUCED STRESS
- Publication number 20240079350
- Publication date Mar 7, 2024
- Murata Manufacturing Co., Ltd.
- Shigeru ENDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY...
- Publication number 20230174373
- Publication date Jun 8, 2023
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Wooicheang Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING
- Publication number 20230126914
- Publication date Apr 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jane Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH A DIAPHRAGM HAVING A NET COMPRESSIVE STRESS
- Publication number 20220009770
- Publication date Jan 13, 2022
- KNOWLES ELECTRONICS, LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20200354214
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20190284043
- Publication date Sep 19, 2019
- ROBERT BOSCH GmbH
- Rudy Eid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20190169019
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SENSOR DEVICE WITH REDUCED STRESS-SENSITIVIT...
- Publication number 20180148321
- Publication date May 31, 2018
- STMicroelectronics S.r.l.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...
- Publication number 20180127266
- Publication date May 10, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS DECOUPLED PIEZORESISTIVE RELATIVE PRESSURE SENSOR AND METHOD...
- Publication number 20170369306
- Publication date Dec 28, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Steffen BIESELT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A DEFORMABLE APPARATUS AND METHOD
- Publication number 20170305741
- Publication date Oct 26, 2017
- Nokia Technologies Oy
- Darryl COTTON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SENSOR DEVICE WITH REDUCED STRESS-SENSITIVIT...
- Publication number 20170073220
- Publication date Mar 16, 2017
- STMicroelectronics S.r.l.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VHF ETCH BARRIER FOR SEMICONDUCTOR INTEGRATED MICROSYSTEM
- Publication number 20150364363
- Publication date Dec 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Tzu-Heng Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH STRESS RELEASE AND THERMAL INSULATION
- Publication number 20150251901
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH STRESS RELEASE CONFIGURATION
- Publication number 20150251900
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...
- Publication number 20150102390
- Publication date Apr 16, 2015
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140231934
- Publication date Aug 21, 2014
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTRO MECHANICAL SYSTEM (MEMS) MICROPHONE AND FABRICATION M...
- Publication number 20140084394
- Publication date Mar 27, 2014
- Chang Han JE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SURFACE MOUNT ACTUATOR
- Publication number 20140055971
- Publication date Feb 27, 2014
- DigitalOptics Corporation MEMS
- Roman C. Gutierrez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Cantilever Packages for Sensor MEMS (MIcro-Electro-Mechanical System)
- Publication number 20140008737
- Publication date Jan 9, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan KODURI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRO MECHANICAL SYSTEM ENCAPSULATION SCHEME
- Publication number 20130119493
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. CHOU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DYNAMIC QUANTITY SENSOR
- Publication number 20130113056
- Publication date May 9, 2013
- DAI NIPPON PRINTING CO., LTD.
- Katsumi Hashimoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE
- Publication number 20130113055
- Publication date May 9, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SURFACE MOUNT ACTUATOR
- Publication number 20130077948
- Publication date Mar 28, 2013
- DigitalOptics Corporation MEMS
- Roman C. Gutierrez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME
- Publication number 20120175747
- Publication date Jul 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Mark E. Schlarmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Mechanical Isolation For MEMS Electrical Contacts
- Publication number 20100308431
- Publication date Dec 9, 2010
- Siimpel Corporation
- Roman C. Gutierrez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor module
- Publication number 20100271787
- Publication date Oct 28, 2010
- Martin Holzmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Leadless package housing
- Publication number 20100148330
- Publication date Jun 17, 2010
- Ricardo Ehrenpfordt
- B81 - MICRO-STRUCTURAL TECHNOLOGY

between other parts not provided for in B81B7/0048 - B81B7/0051

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS device with a diaphragm having a net compressive stress

Structures for packaging stress-sensitive micro-electro-mechanical...

Pressure sensor

Device with terminal-containing sensor

Structures for packaging stress-sensitive micro-electro-mechanical...

Micromechanical component

Sensor with symmetrically embedded sensor elements

Deformable apparatus and method

Microelectromechanical sensor device with reduced stress-sensitivit...

Structures for packaging stress-sensitive micro-electro-mechanical...

Reduced stress pressure sensor

Structure and method to mitigate soldering offset for wafer-level c...

Method and structure of MEMS PLCSP fabrication

Stress decoupled piezoresistive relative pressure sensor and method...

Microelectromechanical sensor device with reduced stress-sensitivit...

Method of protecting microelectro mechanical system device

Pressure sensor with deformable membrane and method of manufacture

Stress buffer layer for integrated microelectromechanical systems (...

Encapsulated component comprising a MEMS component and method for t...

VHF etch barrier for semiconductor integrated microsystem

Surface mount actuator

Dynamic quantity sensor

Semiconductor arrangement with stress release and thermal insulation

Sensor device manufacturing method and sensor device

MEMS device assembly and method of packaging same

Semiconductor arrangement with stress release configuration

Microelectro mechanical system encapsulation scheme

Method of improving MEMS microphone mechanical stability

Leadless package housing having a symmetrical construction with def...

Cantilever packages for sensor MEMS (micro-electro-mechanical system)

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR SEMICONDUCTOR PACKAGES WITH WINDOW ASSEMB...

MEMS SWITCH AND MANUFACTURE METHOD

ELECTRONIC COMPONENT WITH REDUCED STRESS

SEALED CAVITY STRUCTURE AND METHOD FOR MANUFACTURING SEALED CAVITY...

METHODS AND APPARATUS FOR ELECTRONIC DEVICE PACKAGING

MEMS DEVICE WITH A DIAPHRAGM HAVING A NET COMPRESSIVE STRESS

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

MICROMECHANICAL COMPONENT

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

MICROELECTROMECHANICAL SENSOR DEVICE WITH REDUCED STRESS-SENSITIVIT...

STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL...

STRESS DECOUPLED PIEZORESISTIVE RELATIVE PRESSURE SENSOR AND METHOD...

A DEFORMABLE APPARATUS AND METHOD

MICROELECTROMECHANICAL SENSOR DEVICE WITH REDUCED STRESS-SENSITIVIT...

VHF ETCH BARRIER FOR SEMICONDUCTOR INTEGRATED MICROSYSTEM

SEMICONDUCTOR ARRANGEMENT WITH STRESS RELEASE AND THERMAL INSULATION

SEMICONDUCTOR ARRANGEMENT WITH STRESS RELEASE CONFIGURATION

INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...

ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME

MICRO ELECTRO MECHANICAL SYSTEM (MEMS) MICROPHONE AND FABRICATION M...

SURFACE MOUNT ACTUATOR

Cantilever Packages for Sensor MEMS (MIcro-Electro-Mechanical System)

MICROELECTRO MECHANICAL SYSTEM ENCAPSULATION SCHEME

DYNAMIC QUANTITY SENSOR

SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE

SURFACE MOUNT ACTUATOR

MEMS DEVICE ASSEMBLY AND METHOD OF PACKAGING SAME

Mechanical Isolation For MEMS Electrical Contacts

Sensor module

Leadless package housing