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Micro-structural systems; Auxiliary parts of micro-structural devices or systems
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Industry
CPC
B81B7/00
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
B
PERFORMING OPERATIONS TRANSPORTING
B81
Micro-structural technology
B81B
MICRO-STRUCTURAL DEVICES OR SYSTEMS
Current Industry
B81B7/00
Micro-structural systems; Auxiliary parts of micro-structural devices or systems
Sub Industries
B81B7/0003
MEMS mechanisms for assembling automatically hinged components, self-assembly devices
B81B7/0006
Interconnects
B81B7/0009
Structural features, others than packages, for protecting a device against environmental influences
B81B7/0012
Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
B81B7/0016
Protection against shocks or vibrations
B81B7/0019
Protection against thermal alteration or destruction
B81B7/0022
Protection against electrostatic discharge
B81B7/0025
Protection against chemical alteration
B81B7/0029
Protection against environmental influences not provided for in groups B81B7/0012 - B81B7/0025
B81B7/0032
Packages or encapsulation
B81B7/0035
for maintaining a controlled atmosphere inside of the chamber containing the MEMS
B81B7/0038
using materials for controlling the level of pressure, contaminants or moisture inside of the package
B81B7/0041
maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
B81B7/0045
for reducing stress inside of the package structure
B81B7/0048
between the MEMS die and the substrate
B81B7/0051
between the package lid and the substrate
B81B7/0054
between other parts not provided for in B81B7/0048 - B81B7/0051
B81B7/0058
for protecting against damages due to external chemical or mechanical influences
B81B7/0061
suitable for fluid transfer from the MEMS out of the package or vice-versa
B81B7/0064
for protecting against electromagnetic or electrostatic interferences
B81B7/0067
for controlling the passage of optical signals through the package
B81B7/007
Interconnections between the MEMS and external electrical signals
B81B7/0074
3D packaging
B81B7/0077
Other packages not provided for in groups B81B7/0035 - B81B7/0074
B81B7/008
MEMS characterised by an electronic circuit specially adapted for controlling or driving the same
B81B7/0083
Temperature control
B81B7/0087
On-device systems and sensors for controlling, regulating or monitoring
B81B7/009
Maintaining a constant temperature by heating or cooling
B81B7/0093
by cooling
B81B7/0096
by heating
B81B7/02
containing distinct electrical or optical devices of particular relevance for their function
B81B7/04
Networks or arrays of similar micro-structural devices
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