between the package lid and the substrate

Industry

CPC
B81B7/0051

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0051between the package lid and the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
MEMS actuators having a physical gap filled with fluid
- Patent number 12,162,746
- Issue date Dec 10, 2024
- Mirrorcle Technologies, Inc.
- Veljko Milanovic
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 12,134,555
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level packaging of MEMS
- Patent number 12,091,311
- Issue date Sep 17, 2024
- Texas Instruments Incorporated
- Stuart M. Jacobsen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-acoustic wafer-level package and method of manufacture
- Patent number 12,071,339
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Manuel Hofer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 12,024,418
- Issue date Jul 2, 2024
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 11,795,053
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 11,667,517
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 11,655,142
- Issue date May 23, 2023
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMs device and electronic device
- Patent number 11,594,670
- Issue date Feb 28, 2023
- Seiko Epson Corporation
- Chikara Kojima
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with flexible interconnect
- Patent number 11,542,152
- Issue date Jan 3, 2023
- STMicroelectronics, Inc.
- Jefferson Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,524,890
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulation of sensing device
- Patent number 11,358,861
- Issue date Jun 14, 2022
- INDIGO DIABETES NV
- Juan Sebastian Ordonez Orellana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Single line axis solder dispense process for a MEMS device
- Patent number 11,259,133
- Issue date Feb 22, 2022
- Knowles Electronics, LLC
- Norman Dennis Talag
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor
- Patent number 11,150,092
- Issue date Oct 19, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Imanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS actuators with improved performance and cooling
- Patent number 11,111,133
- Issue date Sep 7, 2021
- Mirrorcle Technologies, Inc.
- Veljko Milanovic
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micromechanical sensor
- Patent number 11,111,137
- Issue date Sep 7, 2021
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor with multiple sensitivity and small dimensions
- Patent number 11,079,298
- Issue date Aug 3, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D-printed protective shell structures with support columns for str...
- Patent number 11,082,028
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for fabricating a device for detecting electromagnetic radi...
- Patent number 10,981,782
- Issue date Apr 20, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Jacques Yon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 10,906,801
- Issue date Feb 2, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,858,245
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for closing off a micromechanical device by laser melting, a...
- Patent number 10,836,631
- Issue date Nov 17, 2020
- Robert Bosch GmbH
- Jochen Reinmuth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensor
- Patent number 10,816,422
- Issue date Oct 27, 2020
- Invensense, Inc.
- Chung-Hsien Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low stress integrated device packages
- Patent number 10,800,651
- Issue date Oct 13, 2020
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component
- Patent number 10,781,097
- Issue date Sep 22, 2020
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Gas sensor packages
- Patent number 10,730,743
- Issue date Aug 4, 2020
- Analog Devices Global Unlimited Company
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package including a wall and a grounding ring...
- Patent number 10,689,249
- Issue date Jun 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...
- Publication number 20240002217
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20230278856
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE
- Publication number 20230249962
- Publication date Aug 10, 2023
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DETECTION DEVICE COMPRISING A PERIPHERAL...
- Publication number 20230213389
- Publication date Jul 6, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Geoffroy DUMONT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20210395076
- Publication date Dec 23, 2021
- RF360 Europe GmbH
- Manuel HOFER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...
- Publication number 20210323812
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...
- Publication number 20210147222
- Publication date May 20, 2021
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210130165
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Hsing CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Single Line Axis Solder Dispense Process for a MEMS Device
- Publication number 20210076149
- Publication date Mar 11, 2021
- KNOWLES ELECTRONICS, LLC
- Norman Dennis Talag
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH FLEXIBLE INTERCONNECT
- Publication number 20210032098
- Publication date Feb 4, 2021
- STMICROELECTRONICS, INC.
- Jefferson TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210017018
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20200317506
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND ELECTRONIC DEVICE
- Publication number 20200303618
- Publication date Sep 24, 2020
- SEIKO EPSON CORPORATION
- Chikara KOJIMA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE
- Publication number 20200231432
- Publication date Jul 23, 2020
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION OF SENSING DEVICE
- Publication number 20200207612
- Publication date Jul 2, 2020
- INDIGO DIABETES NV
- Juan Sebastian ORDONEZ ORELLANA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...
- Publication number 20200127637
- Publication date Apr 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper WAINERDI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR FABRICATING A DEVICE FOR DETECTING ELECTROMAGNETIC RADI...
- Publication number 20200115225
- Publication date Apr 16, 2020
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean-Jacques YON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE SENSOR AND MANUFACTURE METHOD THEREOF
- Publication number 20200048074
- Publication date Feb 13, 2020
- MiraMEMS Sensing Technology Co., Ltd.
- Li-Tien TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE SENSOR AND MANUFACTURE METHOD THEREOF
- Publication number 20190330053
- Publication date Oct 31, 2019
- MiraMEMS Sensing Technology Co., Ltd.
- Li-Tien TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...
- Publication number 20190330056
- Publication date Oct 31, 2019
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190300362
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR
- Publication number 20190242709
- Publication date Aug 8, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKASHI IMANAKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MICROMECHANICAL SENSOR
- Publication number 20190161347
- Publication date May 30, 2019
- ROBERT BOSCH GmbH
- Johannes CLASSEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GAS SENSOR PACKAGES
- Publication number 20190135614
- Publication date May 9, 2019
- Analog Devices Global Unlimited Company
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR CLOSING OFF A MICROMECHANICAL DEVICE BY LASER MELTING, A...
- Publication number 20190071307
- Publication date Mar 7, 2019
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20190002277
- Publication date Jan 3, 2019
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OIL PRESSURE SENSOR ATTACHING STRUCTURE
- Publication number 20180087990
- Publication date Mar 29, 2018
- Nidec Tosok Corporation
- Tomoka OSAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR ATTACHMENT STRUCTURE
- Publication number 20180057355
- Publication date Mar 1, 2018
- Nidec Tosok Corporation
- Tomoka OSAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW STRESS INTEGRATED DEVICE PACKAGES
- Publication number 20170320725
- Publication date Nov 9, 2017
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR MEMS TRANSDUCERS
- Publication number 20170295434
- Publication date Oct 12, 2017
- Cirrus Logic International Semiconductor Ltd.
- Tsjerk HOEKSTRA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

between the package lid and the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS actuators having a physical gap filled with fluid

Method and structure for CMOS-MEMS thin film encapsulation

Sensor devices with gas-permeable cover and associated production m...

Wafer level packaging of MEMS

Micro-acoustic wafer-level package and method of manufacture

Method of manufacturing a sensor device and moulding support structure

Semiconductor integrated device with electrical contacts between st...

Sensor devices with gas-permeable cover and associated production m...

Method and structure for CMOS-MEMS thin film encapsulation

Method of manufacturing a sensor device and moulding support structure

MEMs device and electronic device

Semiconductor package with flexible interconnect

Semiconductor device packages and methods of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Encapsulation of sensing device

Single line axis solder dispense process for a MEMS device

Sensor

MEMS actuators with improved performance and cooling

Method for manufacturing a micromechanical sensor

MEMS pressure sensor with multiple sensitivity and small dimensions

3D-printed protective shell structures with support columns for str...

Process for fabricating a device for detecting electromagnetic radi...

Semiconductor integrated device with electrical contacts between st...

Deposition of protective material at wafer level in front end for e...

Method for closing off a micromechanical device by laser melting, a...

Pressure sensor

Low stress integrated device packages

Micromechanical component

Gas sensor packages

Semiconductor device package including a wall and a grounding ring...

Patents Applicationslast 30 patents

SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...

Method and Structure for CMOS-MEMS Thin Film Encapsulation

METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE

METHOD FOR MANUFACTURING A DETECTION DEVICE COMPRISING A PERIPHERAL...

MICRO-ACOUSTIC WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURE

SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...

SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

Single Line Axis Solder Dispense Process for a MEMS Device

SEMICONDUCTOR PACKAGE WITH FLEXIBLE INTERCONNECT

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Method and Structure for CMOS-MEMS Thin Film Encapsulation

MEMS DEVICE AND ELECTRONIC DEVICE

METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE

ENCAPSULATION OF SENSING DEVICE

3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...

PROCESS FOR FABRICATING A DEVICE FOR DETECTING ELECTROMAGNETIC RADI...

FORCE SENSOR AND MANUFACTURE METHOD THEREOF

FORCE SENSOR AND MANUFACTURE METHOD THEREOF

SEMICONDUCTOR INTEGRATED DEVICE WITH ELECTRICAL CONTACTS BETWEEN ST...

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

SENSOR

METHOD FOR MANUFACTURING A MICROMECHANICAL SENSOR

GAS SENSOR PACKAGES

METHOD FOR CLOSING OFF A MICROMECHANICAL DEVICE BY LASER MELTING, A...

MICROMECHANICAL COMPONENT

OIL PRESSURE SENSOR ATTACHING STRUCTURE

SENSOR ATTACHMENT STRUCTURE

LOW STRESS INTEGRATED DEVICE PACKAGES

PACKAGING FOR MEMS TRANSDUCERS