between the wire connector and the bonding area

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CPC
H01L2224/48476

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48476between the wire connector and the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,056,415
- Issue date Jul 6, 2021
- HITACHI AUTOMOTIVE SYSTEMS, LTD.
- Masami Oonishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,237,295
- Issue date Aug 7, 2012
- Kabushiki Kaisha Toshiba
- Yuichi Sano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead-free, tin, antimony, bismtuh, copper solder alloy
- Patent number 5,411,703
- Issue date May 2, 1995
- International Business Machines Corporation
- Stephen G. Gonya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
- Publication number 20240234338
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Tetsunari SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20190229032
- Publication date Jul 25, 2019
- Hitachi Automotive Systems, Ltd.
- Masami OONISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR ASSEMBLING SAME
- Publication number 20130277839
- Publication date Oct 24, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20110309502
- Publication date Dec 22, 2011
- Kabushiki Kaisha Toshiba
- Yuichi SANO
- H01 - BASIC ELECTRIC ELEMENTS

between the wire connector and the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Package-in-packages and methods of formation thereof

Semiconductor device, method for manufacturing semiconductor device...

Lead-free, tin, antimony, bismtuh, copper solder alloy

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

Semiconductor Device

Package-In-Packages and Methods of Formation Thereof

CHIP PACKAGE AND METHOD FOR ASSEMBLING SAME

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...