Patent Application
20130277839
1. Technical Field
The present disclosure relates to a chip package and a method for assembling the chip package.
2. Description of Related Art
To achieve predetermined functions, an electronic device typically includes a printed circuit board (PCB) and a number of chips packaged on the PCB. The chips and the PCB may have different heights. The chips are connected to each other or the PCB via bonding wires. The bonding wires are connected to the chips and/or the PCB by a pressure welding manner. However, when connecting the bonding wire to the chips by the pressure welding manner, the chips may be damaged by a welding pressure.
What is needed therefore is a chip package and a method for assembling the chip package addressing the limitations described.
The components of the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout several views.
Referring to
The PCB 10 includes a mounting surface 11 and a number of first bonding pads 12 formed on the mounting surface 11. Each bonding pad 12 includes a soldering ball 13 formed thereon.
The chip 20 includes a number of second bonding pads 21 formed on a surface facing away from the PCB 10. The second bonding pads 21 correspond to the first bonding pads 12. Each second bonding pad 21 includes a second soldering pad 22 formed thereon.
The bonding wires 30 each electrically connect a first bonding pad 12 to a corresponding second bonding pad 21. Each bonding wire 30 includes a beginning end 31 and an opposite ending end 32 and a vaulted portion 33 between the beginning end 31 and the ending end 32. The beginning end 31 is an end of the bonding wire 30 which is firstly bonded, and the ending end 31 is an end of the bonding wired 30 which is lastly bonded. The vaulted portion 33 is a portion which is formed by dragging the bonding wire 30 from the first soldering pad 12 to the second soldering pad 21. The vaulted portion 33 is adjacent to a top of the first soldering ball 13 and a height of the vaulted portion 33 is substantially equal to a height of the second soldering ball 22.
The first soldering pads 13, the second soldering pads 22 and the bonding wires 30 are made from a material(s) with high conductivity. In the embodiment, the first soldering balls 13, the second soldering balls 22 and the bonding wires 30 are made from gold.
Referring to
In step S01, a PCB is provided. The PCB includes a number of first bonding pads formed thereon.
In step S02, a chip is provided. The chip includes a number of second bonding pads corresponding to the first bonding pads.
In step S03, the chip is positioned on the PCB, a surface of chip with the second bonding pads is away from the PCB.
In step S04, a first soldering ball is formed on a first bonding pad.
In step S05, a second soldering ball is formed on a second bonding pad.
In step S06, a bonding wire is provided.
In step S07, an end of the bonding wire is bonded to the first soldering ball, and the other end of the bonding wire is dragged to the second bonding pad and is bonded on the second soldering ball. A vaulted portion of the bonding wire is formed upon the first bonding ball. The vaulted portion is adjacent to a top of the first soldering ball and a height of the vaulted portion is substantially equal to a height of the second soldering ball.
It should be noted that the above chip assembling method just described how to electrically a first bonding pad to a corresponding second bonding pad. The other first bonding pads can be electrically connected to the corresponding second bonding pad by a similar method.
The chip package and the method for assembling the chip package forms soldering balls both on the first bonding pads and the second bonding pads, thus a welding pressure to bond the bonding wires to the second soldering ball is decreased, accordingly, the quality of the chip is ensured. In addition, each bonding wire is dragged from a first bonding pad to a corresponding second bonding pad, thus the vaulted portion are formed upon the first soldering ball, as such, a height of the bonding wire can be controlled substantially equal to that of the second soldering ball, therefore, a height of the chip package is reduced.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 101114040 | Apr 2012 | TW | national |
