Bismuth [Bi] as principal constituent

Industry

CPC
H01L2224/05113

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05113Bismuth [Bi] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 11,270,964
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,818,623
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed UBM and mixed pitch on a single die
- Patent number 10,249,586
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced solder pad
- Patent number 10,121,753
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Jens Oetjen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 10,049,897
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,966,322
- Issue date May 8, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hisao Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 9,754,893
- Issue date Sep 5, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingxiu Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...
- Publication number 20190184480
- Publication date Jun 20, 2019
- The Government of the United States of America, as represented by the Secreta...
- Raymond C.Y. Auyeung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED UBM AND MIXED PITCH ON A SINGLE DIE
- Publication number 20180331056
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SOLDER PAD
- Publication number 20180012854
- Publication date Jan 11, 2018
- INFINEON TECHNOLOGIES AG
- Jens Oetjen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...
- Publication number 20170148754
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160093601
- Publication date Mar 31, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- JINGXIU DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS

Bismuth [Bi] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High-temperature superconducting striated tape combinations

Fabrication of high-temperature superconducting striated tape combi...

Mixed UBM and mixed pitch on a single die

Mixed UBM and mixed pitch on a single die

Mixed UBM and mixed pitch on a single die

Enhanced solder pad

Extrusion-resistant solder interconnect structures and methods of f...

Semiconductor device

Semiconductor structure and fabrication method thereof

Power semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Precise Alignment and Decal Bonding of a Pattern of Solder Preforms...

MIXED UBM AND MIXED PITCH ON A SINGLE DIE

ENHANCED SOLDER PAD

EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

POWER SEMICONDUCTOR DEVICES