Bismuth [Bi] as principal constituent

Industry

CPC
H01L2224/05613

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05613Bismuth [Bi] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,417
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 11,973,045
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having exposed redistribution layer features...
- Patent number 11,600,523
- Issue date Mar 7, 2023
- Microchip Technology Incorporated
- ManKit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PoP semiconductor device...
- Patent number 10,297,519
- Issue date May 21, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 10,049,897
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,966,322
- Issue date May 8, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hisao Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic part, and solder
- Patent number 9,831,199
- Issue date Nov 28, 2017
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package bonding structure and method for forming the same
- Patent number 9,673,182
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solder joint and method of forming the...
- Patent number 9,646,945
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 9,607,862
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for use in flip-chip bonding, which reduces la...
- Patent number 9,520,381
- Issue date Dec 13, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuichi Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package bonding structure and method for forming the same
- Patent number 9,397,062
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,368,482
- Issue date Jun 14, 2016
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor device package
- Patent number 9,318,465
- Issue date Apr 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages and methods of fabricating the same
- Patent number 9,214,410
- Issue date Dec 15, 2015
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked substrates with protruding and...
- Patent number 9,209,112
- Issue date Dec 8, 2015
- Seiko Epson Corporation
- Hideo Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL under bump for elect...
- Patent number 9,142,522
- Issue date Sep 22, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with through via electrodes, methods of fabri...
- Patent number 9,117,938
- Issue date Aug 25, 2015
- SK Hynix Inc.
- Jin Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and electronic packaging solder joint structure and...
- Patent number 9,024,441
- Issue date May 5, 2015
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structures and methods for forming the same
- Patent number 9,006,032
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked substrates with protruding and...
- Patent number 9,000,575
- Issue date Apr 7, 2015
- Seiko Epson Corporation
- Hideo Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structures and methods for forming the same
- Patent number 8,704,354
- Issue date Apr 22, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing the same, and meth...
- Patent number 8,586,477
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stacked structure
- Patent number 8,487,452
- Issue date Jul 16, 2013
- Samsung Electronics Co., Ltd.
- Jin-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 8,269,354
- Issue date Sep 18, 2012
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier
- Patent number 8,130,509
- Issue date Mar 6, 2012
- Industrial Technology Research Institute
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board surface structure
- Patent number 8,058,564
- Issue date Nov 15, 2011
- Unimicron Technology Corp.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having stress relief layers and methods for f...
- Patent number 7,977,160
- Issue date Jul 12, 2011
- GLOBALFOUNDRIES, INC.
- Michael Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 7,847,400
- Issue date Dec 7, 2010
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240113090
- Publication date Apr 4, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Myoung KI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER
- Publication number 20230072996
- Publication date Mar 9, 2023
- ISHIHARA CHEMICAL CO., LTD.
- Takahiro TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230005867
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005849
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...
- Publication number 20220406982
- Publication date Dec 22, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC PART, AND SOLDER
- Publication number 20170125366
- Publication date May 4, 2017
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20140197547
- Publication date Jul 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE BONDING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20140183732
- Publication date Jul 3, 2014
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...
- Publication number 20140070401
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20130256914
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND...
- Publication number 20130168851
- Publication date Jul 4, 2013
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Under Bump for Elect...
- Publication number 20130134580
- Publication date May 30, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SENSOR AND ELECTRONIC DEVICE
- Publication number 20120217650
- Publication date Aug 30, 2012
- SEIKO EPSON CORPORATION
- Hideo Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE WITH CONDUCTIVE STRUCTURE
- Publication number 20120181688
- Publication date Jul 19, 2012
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER
- Publication number 20120125669
- Publication date May 24, 2012
- Industrial Technology Research Institute
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR
- Publication number 20120068306
- Publication date Mar 22, 2012
- Sang-Sub SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...
- Publication number 20120028412
- Publication date Feb 2, 2012
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE
- Publication number 20120001347
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Jin-Yang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20110031617
- Publication date Feb 10, 2011
- UNIMICRON TECHONOLOGY COPR.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING STRESS RELIEF LAYERS AND METHODS FOR F...
- Publication number 20110031603
- Publication date Feb 10, 2011
- GLOBALFOUNDRIES INC.
- Michael SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER
- Publication number 20100163292
- Publication date Jul 1, 2010
- Industrial Technology Research Institute
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CONTACT
- Publication number 20100001400
- Publication date Jan 7, 2010
- Hartmut Schmidt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...
- Publication number 20090197103
- Publication date Aug 6, 2009
- Da-Yuan Shih
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER CONTACTS AND METHODS OF FORMING SAME
- Publication number 20090179333
- Publication date Jul 16, 2009
- Alfred Martin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Bismuth [Bi] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method for forming same

Semiconductor package having exposed redistribution layer features...

Method and apparatus for creating a bond between objects based on f...

Semiconductor device and method of forming PoP semiconductor device...

Extrusion-resistant solder interconnect structures and methods of f...

Semiconductor device

Electronic device, electronic part, and solder

Package on package bonding structure and method for forming the same

Semiconductor device having solder joint and method of forming the...

Extrusion-resistant solder interconnect structures and methods of f...

Semiconductor device for use in flip-chip bonding, which reduces la...

Package on package bonding structure and method for forming the same

Stack packages and methods of fabricating the same

Methods for forming a semiconductor device package

Stack packages and methods of fabricating the same

Semiconductor device having stacked substrates with protruding and...

Semiconductor device and method of forming RDL under bump for elect...

Semiconductor devices with through via electrodes, methods of fabri...

Bump structure and electronic packaging solder joint structure and...

Package on package structures and methods for forming the same

Semiconductor device having stacked substrates with protruding and...

Package on package structures and methods for forming the same

Semiconductor apparatus, method of manufacturing the same, and meth...

Semiconductor package having a stacked structure

Semiconductor package substrate structure and manufacturing method...

Package carrier

Circuit board surface structure

Semiconductor devices having stress relief layers and methods for f...

Semiconductor package substrate structure and manufacturing method...

Patents Applicationslast 30 patents

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING ELEMENTS, AND MET...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

ELECTRONIC DEVICE, ELECTRONIC PART, AND SOLDER

PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME

PACKAGE ON PACKAGE BONDING STRUCTURE AND METHOD FOR FORMING THE SAME

EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...

PACKAGE ON PACKAGE STRUCTURES AND METHODS FOR FORMING THE SAME

BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND...

Semiconductor Device and Method of Forming RDL Under Bump for Elect...

SEMICONDUCTOR DEVICE, SENSOR AND ELECTRONIC DEVICE

PACKAGING SUBSTRATE WITH CONDUCTIVE STRUCTURE

PACKAGE CARRIER

SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...

SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE

SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...

SEMICONDUCTOR DEVICES HAVING STRESS RELIEF LAYERS AND METHODS FOR F...

PACKAGE CARRIER

SOLDER CONTACT

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERL...

SOLDER CONTACTS AND METHODS OF FORMING SAME