Blind plated via connections

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CPC
H05K3/421

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/421Blind plated via connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package carrier with improved heat dissipation efficiency and manuf...
- Patent number 12,156,325
- Issue date Nov 26, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with a conductive bump mounted on an adhesive layer
- Patent number 12,016,133
- Issue date Jun 18, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having substrate
- Patent number 11,756,865
- Issue date Sep 12, 2023
- Industrial Technology Research Institute
- Sheng-Che Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spiral antenna and related fabrication techniques
- Patent number 11,581,652
- Issue date Feb 14, 2023
- Raytheon Company
- Peter J. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid mixture for filling blind holes in copper foil
- Patent number 11,486,050
- Issue date Nov 1, 2022
- An Xie
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
All-directions embeded module, method for manufacturing the all-dir...
- Patent number 11,483,931
- Issue date Oct 25, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer flex circuit with non-plated outer metal layer
- Patent number 11,419,213
- Issue date Aug 16, 2022
- Western Digital Technologies, Inc.
- Nobumasa Nishiyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Spiral antenna and related fabrication techniques
- Patent number 11,289,814
- Issue date Mar 29, 2022
- Raytheon Company
- Peter J. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High frequency module
- Patent number 11,178,778
- Issue date Nov 16, 2021
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package to printed circuit board transition
- Patent number 11,147,161
- Issue date Oct 12, 2021
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bath and method for filling a vertical interconnect access or trenc...
- Patent number 11,091,849
- Issue date Aug 17, 2021
- Atotech Deutschland GmbH
- Josef Gaida
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Substrate bonding structure
- Patent number 11,096,282
- Issue date Aug 17, 2021
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with integrated strain gauge
- Patent number 11,081,436
- Issue date Aug 3, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Alexander Kasper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning and removal of circuit board material using ultrafast la...
- Patent number 11,064,611
- Issue date Jul 13, 2021
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
All-directions embeded module, method for manufacturing the all-dir...
- Patent number 11,044,813
- Issue date Jun 22, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Module-embedded multilayer circuit board and method for manufacturi...
- Patent number 10,993,328
- Issue date Apr 27, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetric electronic substrate and method of manufacture
- Patent number 10,980,129
- Issue date Apr 13, 2021
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package to printed circuit board transition
- Patent number 10,917,968
- Issue date Feb 9, 2021
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, laminated wiring board, and semiconductor device
- Patent number 10,905,005
- Issue date Jan 26, 2021
- Shinko Electric Industries Co., Ltd.
- Hiroshi Taneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit carrier board structure and manufacturing method thereof
- Patent number 10,888,001
- Issue date Jan 5, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for production thereof
- Patent number 10,834,810
- Issue date Nov 10, 2020
- Schweizer Electronic AG
- Hubert Trageser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING
- Publication number 20240271307
- Publication date Aug 15, 2024
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...
- Publication number 20230292446
- Publication date Sep 14, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- LAN-TING CHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Asymmetric Build-Up And Methods for Determin...
- Publication number 20230217589
- Publication date Jul 6, 2023
- AT&S (China) Co. Ltd.
- Diego LORENZONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...
- Publication number 20230199958
- Publication date Jun 22, 2023
- ABB Schweiz AG
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...
- Publication number 20230121285
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Sangwon HA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH
- Publication number 20230121347
- Publication date Apr 20, 2023
- Raytheon Company
- Andrew R. Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20230058180
- Publication date Feb 23, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20220386453
- Publication date Dec 1, 2022
- Nitto Denko Corporation
- Akihito MATSUTOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220232695
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20220159824
- Publication date May 19, 2022
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIRAL ANTENNA AND RELATED FABRICATION TECHNIQUES
- Publication number 20220140485
- Publication date May 5, 2022
- Raytheon Company
- Peter J. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH-HOLE, AND SUBSTRATE FOR FLEXIBLE PRINTED...
- Publication number 20220117085
- Publication date Apr 14, 2022
- NIPPON MEKTRON, LTD.
- Toshihiro HIGASHIRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220087033
- Publication date Mar 17, 2022
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...
- Publication number 20210267064
- Publication date Aug 26, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HAVING SUBSTRATE
- Publication number 20210257279
- Publication date Aug 19, 2021
- Industrial Technology Research Institute
- Sheng-Che HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE TO PRINTED CIRCUIT BOARD TRANSITION
- Publication number 20210195740
- Publication date Jun 24, 2021
- Google LLC
- Leesa Marie Noujeim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...
- Publication number 20210120674
- Publication date Apr 22, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE
- Publication number 20210076508
- Publication date Mar 11, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE-EMBEDDED MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURI...
- Publication number 20210037653
- Publication date Feb 4, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20200389983
- Publication date Dec 10, 2020
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER FLEX CIRCUIT WITH NON-PLATED OUTER METAL LAYER
- Publication number 20200315014
- Publication date Oct 1, 2020
- Western Digital Technologies, Inc.
- Nobumasa Nishiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE
- Publication number 20200221577
- Publication date Jul 9, 2020
- Intel Corporation
- Sri Chaitra Jyotsna Chavali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...
- Publication number 20200199766
- Publication date Jun 25, 2020
- Atotech Deutschland GmbH
- Josef GAIDA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HIGH FREQUENCY MODULE
- Publication number 20200137893
- Publication date Apr 30, 2020
- MURATA MANUFACTURING CO., LTD.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, LAMINATED WIRING BOARD, AND SEMICONDUCTOR DEVICE
- Publication number 20200092993
- Publication date Mar 19, 2020
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045829
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Blind plated via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package carrier with improved heat dissipation efficiency and manuf...

Circuit board with a conductive bump mounted on an adhesive layer

Single-layer circuit board, multi-layer circuit board, and manufact...

Method for forming through-hole, and substrate for flexible printed...

Substrate with buried component and manufacture method thereof

Printed circuit boards with plated blind slots for improved vertica...

Electronic device having substrate

Manufacturing method of circuit carrier board structure

Process for fabrication of a printed circuit board using a semi-add...

Circuit board and method for manufacturing the same

Spiral antenna and related fabrication techniques

Liquid mixture for filling blind holes in copper foil

All-directions embeded module, method for manufacturing the all-dir...

Multilayer flex circuit with non-plated outer metal layer

Spiral antenna and related fabrication techniques

Single-layer circuit board, multi-layer circuit board, and manufact...

High frequency module

Package to printed circuit board transition

Bath and method for filling a vertical interconnect access or trenc...

Substrate bonding structure

Component carrier with integrated strain gauge

Patterning and removal of circuit board material using ultrafast la...

All-directions embeded module, method for manufacturing the all-dir...

Single-layer circuit board, multi-layer circuit board, and manufact...

Module-embedded multilayer circuit board and method for manufacturi...

Asymmetric electronic substrate and method of manufacture

Package to printed circuit board transition

Wiring board, laminated wiring board, and semiconductor device

Circuit carrier board structure and manufacturing method thereof

Circuit board and method for production thereof

Patents Applicationslast 30 patents

Component Carrier and Method Manufacturing the Same

COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING

Structures for Forming Printed Board Interconnects Using Solder

MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...

Component Carrier With Asymmetric Build-Up And Methods for Determin...

PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...

CIRCUIT BOARD

PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

SUBSTRATE WITH BURIED COMPONENT AND MANUFACTURE METHOD THEREOF

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

SPIRAL ANTENNA AND RELATED FABRICATION TECHNIQUES

METHOD FOR FORMING THROUGH-HOLE, AND SUBSTRATE FOR FLEXIBLE PRINTED...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...

ELECTRONIC DEVICE HAVING SUBSTRATE

PACKAGE TO PRINTED CIRCUIT BOARD TRANSITION

ALL-DIRECTIONS EMBEDED MODULE, METHOD FOR MANUFACTURING THE ALL-DIR...

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD STRUCTURE

MODULE-EMBEDDED MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURI...

Semi-Additive Process for Printed Circuit Boards

MULTILAYER FLEX CIRCUIT WITH NON-PLATED OUTER METAL LAYER

ASYMMETRIC ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURE

A BATH AND METHOD FOR FILLING A VERTICAL INTERCONNECT ACCESS OR TRE...

HIGH FREQUENCY MODULE

WIRING BOARD, LAMINATED WIRING BOARD, AND SEMICONDUCTOR DEVICE

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD