Bolometers

Industry

CPC
B81B2201/0207

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/0207Bolometers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Monolithic post complementary metal-oxide-semiconductor integration...
- Patent number 12,168,603
- Issue date Dec 17, 2024
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS and NEMS structures
- Patent number 12,006,209
- Issue date Jun 11, 2024
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Distributed sensor system
- Patent number 11,401,161
- Issue date Aug 2, 2022
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for assembling conductive particles into conductive pathways...
- Patent number 11,371,961
- Issue date Jun 28, 2022
- CONDALIGAN AS
- Mark Buchanan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device having curved reflective layer and method for manufactu...
- Patent number 11,359,973
- Issue date Jun 14, 2022
- Korea Advanced Institute of Science and Technology
- Jong-Kwon Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic housing comprising a getter, optoelectronic component or M...
- Patent number 11,305,983
- Issue date Apr 19, 2022
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal detector and thermal detector array
- Patent number 11,199,455
- Issue date Dec 14, 2021
- Teknologian tutkimuskeskus VTT Oy
- Aapo Varpula
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 11,174,154
- Issue date Nov 16, 2021
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal protection mechanisms for uncooled microbolometers
- Patent number 10,520,364
- Issue date Dec 31, 2019
- Raytheon Company
- Paolo Masini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 10,508,026
- Issue date Dec 17, 2019
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a device comprising a hermetically sealed...
- Patent number 10,414,647
- Issue date Sep 17, 2019
- LYNRED
- Jérôme Favier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of stress relief in anti-reflective coated cap wafers for wa...
- Patent number 10,315,918
- Issue date Jun 11, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 10,280,074
- Issue date May 7, 2019
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device having at least two wafers for detecting electromagnetic rad...
- Patent number 10,270,001
- Issue date Apr 23, 2019
- Robert Bosch GmbH
- Ingo Herrmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 10,262,913
- Issue date Apr 16, 2019
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Distributed sensor system
- Patent number 10,246,322
- Issue date Apr 2, 2019
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermal protection mechanisms for uncooled microbolometers
- Patent number 10,175,113
- Issue date Jan 8, 2019
- Raytheon Company
- Paolo Masini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS-CMOS platform
- Patent number 10,093,533
- Issue date Oct 9, 2018
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Radiation detector comprising a compensating sensor
- Patent number 10,096,724
- Issue date Oct 9, 2018
- Melexis Technologies NV
- Carl Van Buggenhout
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor device package housing with an embedded controllable de...
- Patent number 9,975,760
- Issue date May 22, 2018
- Robert Bosch GmbH
- Mikko VA Suvanto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,969,610
- Issue date May 15, 2018
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level package solder barrier used as vacuum getter
- Patent number 9,966,320
- Issue date May 8, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a device comprising a hermetically sealed...
- Patent number 9,957,154
- Issue date May 1, 2018
- Ulis
- Jérôme Favier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 9,890,038
- Issue date Feb 13, 2018
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable device having a monolithically integrated multi-sensor dev...
- Patent number 9,862,594
- Issue date Jan 9, 2018
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS-CMOS platform
- Patent number 9,796,580
- Issue date Oct 24, 2017
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level MEMS package including dual seal ring
- Patent number 9,771,258
- Issue date Sep 26, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithically integrated multi-sensor device on a semiconductor su...
- Patent number 9,758,368
- Issue date Sep 12, 2017
- VERSANA MICRO INC
- Bishnu Prasanna Gogoi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed package having stress reducing layer
- Patent number 9,708,181
- Issue date Jul 18, 2017
- Raytheon Company
- Adam M. Kennedy
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS AND NEMS STRUCTURES
- Publication number 20250042727
- Publication date Feb 6, 2025
- Obsidian Sensors, Inc.
- John HONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE MANUFACTURING
- Publication number 20240043264
- Publication date Feb 8, 2024
- Obsidian Sensors, Inc.
- Tallis CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR
- Publication number 20230384164
- Publication date Nov 30, 2023
- MSG Lithoglas GmbH
- David Bunel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...
- Publication number 20230084280
- Publication date Mar 16, 2023
- Meridian Innovation Pte Ltd
- Xintong ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CROSSOVERS FOR VACUUM PACKAGING
- Publication number 20220411261
- Publication date Dec 29, 2022
- Obsidian Sensors, Inc.
- John HONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISTRIBUTED SENSOR SYSTEM
- Publication number 20220315417
- Publication date Oct 6, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...
- Publication number 20220162062
- Publication date May 26, 2022
- Meridian Innovation Pte Ltd
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20220089433
- Publication date Mar 24, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20220041434
- Publication date Feb 10, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC HOUSING COMPRISING A GETTER, OPTOELECTRONIC COMPONENT OR M...
- Publication number 20220033250
- Publication date Feb 3, 2022
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20220033255
- Publication date Feb 3, 2022
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE HAVING CURVED REFLECTIVE LAYER AND METHOD FOR MANUFACTU...
- Publication number 20210278282
- Publication date Sep 9, 2021
- Korea Advanced Institute of Science and Technology
- Jong-Kwon LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20210002129
- Publication date Jan 7, 2021
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS AND NEMS STRUCTURES
- Publication number 20200407219
- Publication date Dec 31, 2020
- Obsidian Sensors, Inc.
- John HONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20200079644
- Publication date Mar 12, 2020
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20190218093
- Publication date Jul 18, 2019
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DISTRIBUTED SENSOR SYSTEM
- Publication number 20190169021
- Publication date Jun 6, 2019
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMAL PROTECTION MECHANISMS FOR UNCOOLED MICROBOLOMETERS
- Publication number 20190107442
- Publication date Apr 11, 2019
- Raytheon Company
- Paolo Masini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PROCESS
- Publication number 20180339901
- Publication date Nov 29, 2018
- United Microelectronics Corp.
- Guo-Chih Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMAL PROTECTION MECHANISMS FOR UNCOOLED MICROBOLOMETERS
- Publication number 20180299329
- Publication date Oct 18, 2018
- Raytheon Company
- Paolo Masini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
- Publication number 20180226309
- Publication date Aug 9, 2018
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING A HERMETICALLY SEALED...
- Publication number 20180215610
- Publication date Aug 2, 2018
- Ulis
- Jérôme Favier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20180170746
- Publication date Jun 21, 2018
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE HAVING A MONOLITHICALLY INTEGRATED MULTI-SENSOR DEV...
- Publication number 20180099868
- Publication date Apr 12, 2018
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS-CMOS PLATFORM
- Publication number 20180009654
- Publication date Jan 11, 2018
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Sensor Device Package Housing with an Embedded Controllable De...
- Publication number 20170369305
- Publication date Dec 28, 2017
- ROBERT BOSCH GmbH
- Mikko VA Suvanto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...
- Publication number 20170355596
- Publication date Dec 14, 2017
- Versana Micro Inc.
- BISHNU PRASANNA GOGOI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Atomic Layer Deposition Layer for a Microelectromechanical system (...
- Publication number 20170275154
- Publication date Sep 28, 2017
- ROBERT BOSCH GmbH
- Seow Yuen Yee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Manufacturing a Device Comprising a Hermetically Sealed...
- Publication number 20170137281
- Publication date May 18, 2017
- Ulis
- Jérôme Favier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
- Publication number 20170129775
- Publication date May 11, 2017
- Raytheon Company
- Buu Q. Diep
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Monolithic post complementary metal-oxide-semiconductor integration...

MEMS and NEMS structures

Heterogenous integration of complementary metal-oxide-semiconductor...

Distributed sensor system

Method for assembling conductive particles into conductive pathways...

MEMS device having curved reflective layer and method for manufactu...

Hermetic housing comprising a getter, optoelectronic component or M...

Thermal detector and thermal detector array

Monolithically integrated multi-sensor device on a semiconductor su...

Thermal protection mechanisms for uncooled microbolometers

Monolithically integrated multi-sensor device on a semiconductor su...

Method for manufacturing a device comprising a hermetically sealed...

Method of stress relief in anti-reflective coated cap wafers for wa...

Monolithically integrated multi-sensor device on a semiconductor su...

Device having at least two wafers for detecting electromagnetic rad...

Wafer level package solder barrier used as vacuum getter

Distributed sensor system

Thermal protection mechanisms for uncooled microbolometers

CMOS-MEMS-CMOS platform

Radiation detector comprising a compensating sensor

MEMS sensor device package housing with an embedded controllable de...

Wafer level MEMS package including dual seal ring

Wafer level package solder barrier used as vacuum getter

Method for manufacturing a device comprising a hermetically sealed...

Monolithically integrated multi-sensor device on a semiconductor su...

Wearable device having a monolithically integrated multi-sensor dev...

CMOS-MEMS-CMOS platform

Wafer level MEMS package including dual seal ring

Monolithically integrated multi-sensor device on a semiconductor su...

Hermetically sealed package having stress reducing layer

Patents Applicationslast 30 patents

MEMS AND NEMS STRUCTURES

MEMS DEVICE MANUFACTURING

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

COVER FOR AN INFRARED DETECTOR AND A METHOD OF FABRICATING A COVER...

CROSSOVERS FOR VACUUM PACKAGING

DISTRIBUTED SENSOR SYSTEM

HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

HERMETIC HOUSING COMPRISING A GETTER, OPTOELECTRONIC COMPONENT OR M...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MEMS DEVICE HAVING CURVED REFLECTIVE LAYER AND METHOD FOR MANUFACTU...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MEMS AND NEMS STRUCTURES

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

DISTRIBUTED SENSOR SYSTEM

THERMAL PROTECTION MECHANISMS FOR UNCOOLED MICROBOLOMETERS

SEMICONDUCTOR PROCESS

THERMAL PROTECTION MECHANISMS FOR UNCOOLED MICROBOLOMETERS

WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER

METHOD FOR MANUFACTURING A DEVICE COMPRISING A HERMETICALLY SEALED...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

WEARABLE DEVICE HAVING A MONOLITHICALLY INTEGRATED MULTI-SENSOR DEV...

CMOS-MEMS-CMOS PLATFORM

MEMS Sensor Device Package Housing with an Embedded Controllable De...

MONOLITHICALLY INTEGRATED MULTI-SENSOR DEVICE ON A SEMICONDUCTOR SU...

Atomic Layer Deposition Layer for a Microelectromechanical system (...

Method for Manufacturing a Device Comprising a Hermetically Sealed...

WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING