Bonding areas formed on an encapsulation of the semiconductor or solid-state body

Industry

CPC
H01L2224/04105

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/04105Bonding areas formed on an encapsulation of the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package having a main die and a dummy die
- Patent number 11,967,563
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,961,789
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,459
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stacking using chip to wafer bonding
- Patent number 11,955,462
- Issue date Apr 9, 2024
- Intel Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,948,862
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method
- Patent number 11,942,417
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including seed structure and method of manufa...
- Patent number 11,935,858
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seungmin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,935,907
- Issue date Mar 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution layer
- Patent number 11,935,856
- Issue date Mar 19, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,929,261
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming device and package structure
- Patent number 11,929,322
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect
- Patent number 11,929,337
- Issue date Mar 12, 2024
- Invensas LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
- Patent number 11,908,783
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,908,795
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,901,303
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer system-level fan-out packaging structure and manufacturing me...
- Patent number 11,894,243
- Issue date Feb 6, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,882,660
- Issue date Jan 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153884
- Publication date May 9, 2024
- Siliconware Precision Industries Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
- Publication number 20240153872
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20240135079
- Publication date Apr 25, 2024
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
- Publication number 20240120211
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240113159
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240096760
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096773
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20240088100
- Publication date Mar 14, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088053
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
- Publication number 20240088104
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...
- Publication number 20240014086
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Seokgeun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014193
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240014151
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20240006377
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420402
- Publication date Dec 28, 2023
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE PROTRUSION
- Publication number 20230395542
- Publication date Dec 7, 2023
- MURATA MANUFACTURING CO., LTD.
- Kazuya KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
- Publication number 20230386865
- Publication date Nov 30, 2023
- Apple Inc.
- Kishore N. Renjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy through vias for Integrated Circuit Packages and Methods of F...
- Publication number 20230377905
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
- Publication number 20230378075
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...
- Publication number 20230352355
- Publication date Nov 2, 2023
- Nippon Electric Glass Co., Ltd.
- Hiroki KATAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230343607
- Publication date Oct 26, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230343604
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20230343133
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE WITH DUMMY DIE
- Publication number 20230335539
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230335514
- Publication date Oct 19, 2023
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20230335536
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas formed on an encapsulation of the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with improved antenna patterns performance

Fan-out package having a main die and a dummy die

Electronic device package and fabricating method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device and method of making a wafer-level chip-scale...

Ultra small molded module integrated with die by module-on-wafer as...

Package structure

Package stacking using chip to wafer bonding

Advanced info POP and method of forming thereof

Package structures and method of forming the same

Sensor package and method

Semiconductor package and method

Semiconductor devices including seed structure and method of manufa...

Image sensor device

Semiconductor device having a redistribution layer

Semiconductor package and method of manufacturing the same

Method of forming device and package structure

3D-interconnect

LTHC as charging barrier in info package formation

Method for fabricating a chip package

Wiring substrate, semiconductor package having the wiring substrate...

Package structures and method of forming the same

Semiconductor device

Semiconductor package and method of manufacturing the semiconductor...

Integrated fan-out package

Contact pad for semiconductor device

Wafer system-level fan-out packaging structure and manufacturing me...

Manufacturing method of package structure

Semiconductor device encapsulated by molding material attached to r...

Embedded component package structure and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SEMICONDUCTO...

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

SEMICONDUCTOR PACKAGE

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

SEMICONDUCTOR DEVICE WITH PROTECTIVE PROTRUSION

Embedded Packaging Concepts for Integration of ASICs and Optical Co...

Dummy through vias for Integrated Circuit Packages and Methods of F...

Method of Forming Semiconductor Packages Having Through Package Vias

Process Including a Re-etching Process for Forming a Semiconductor...

SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD

Fingerprint Sensor Device and Method

PACKAGE STRUCTURE WITH DUMMY DIE

FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING SAME

Semiconductor Packages and Methods of Forming the Same