Bonding areas specifically adapted for strap connectors

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H01L2224/04034

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/04034Bonding areas specifically adapted for strap connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an aluminum oxide layer, metal surface with alumi...
- Patent number 11,424,201
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement
- Patent number 11,362,080
- Issue date Jun 14, 2022
- Infineon Technologies AG
- Christian Robert Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies electrically connected to a package substrate by lead...
- Patent number 11,227,818
- Issue date Jan 18, 2022
- UTAC HEADQUARTERS PTE. LTD.
- Wing Keung Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrically contacting a component by galvanic connecti...
- Patent number 11,037,862
- Issue date Jun 15, 2021
- Siemens Aktiengesellschaft
- Hubert Baueregger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,896,893
- Issue date Jan 19, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,892,247
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET device and manufacturing process thereof
- Patent number 10,770,576
- Issue date Sep 8, 2020
- STMicroelectronics S.r.l.
- Fabio Russo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,727,170
- Issue date Jul 28, 2020
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode terminal, semiconductor device, and power conversion appa...
- Patent number 10,714,447
- Issue date Jul 14, 2020
- Mitsubishi Electric Corporation
- Rei Yoneyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 10,615,145
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 10,607,903
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor backmetal (BM) and over pad metallization (OPM) struc...
- Patent number 10,600,736
- Issue date Mar 24, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,490,488
- Issue date Nov 26, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 10,325,835
- Issue date Jun 18, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 10,319,652
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,922,928
- Issue date Mar 20, 2018
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low on resistance
- Patent number 9,824,996
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 9,691,732
- Issue date Jun 27, 2017
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common drain semiconductor device structure and method
- Patent number 9,607,984
- Issue date Mar 28, 2017
- Semiconductor Components Industries, LLC
- Kazumasa Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching element with a series-connected junction FET (JFET) and M...
- Patent number 9,502,388
- Issue date Nov 22, 2016
- Renesas Electronics Corporation
- Takamitsu Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and automobile
- Patent number 9,484,927
- Issue date Nov 1, 2016
- Mitsubishi Electric Corporation
- Mitsunori Aiko
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250105179
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Chikara INADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Half-Bridge Module, Power Inverter, and Method for Producing...
- Publication number 20240339439
- Publication date Oct 10, 2024
- Vitesco Technologies Germany GMBH
- Markus Hövermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
- Publication number 20240274557
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Yo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352376
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20230317649
- Publication date Oct 5, 2023
- Fuji Electric Co., Ltd.
- Masahide GOTOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STOP FEATURE FOR ELECTRONIC DEVICES
- Publication number 20230170316
- Publication date Jun 1, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE B...
- Publication number 20230154883
- Publication date May 18, 2023
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230078259
- Publication date Mar 16, 2023
- Kabushiki Kaisha Toshiba
- Yuchen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20210035891
- Publication date Feb 4, 2021
- UTAC Headquarters Pte. Ltd.
- Wing Keung LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200343207
- Publication date Oct 29, 2020
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
- Publication number 20200266174
- Publication date Aug 20, 2020
- LITTELFUSE, INC.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20200243480
- Publication date Jul 30, 2020
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20190326202
- Publication date Oct 24, 2019
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...
- Publication number 20190148306
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION
- Publication number 20190035764
- Publication date Jan 31, 2019
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20180138109
- Publication date May 17, 2018
- Semiconductor Components Industries, LLC
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS
- Publication number 20170365518
- Publication date Dec 21, 2017
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140374926
- Publication date Dec 25, 2014
- Kabushiki Kaisha Toshiba
- Takeshi MIYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140332866
- Publication date Nov 13, 2014
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Rectifier Package
- Publication number 20140327014
- Publication date Nov 6, 2014
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291828
- Publication date Oct 2, 2014
- Rohm Co., Ltd.
- Koji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20140264806
- Publication date Sep 18, 2014
- Roger M. Arbuthnot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR
- Publication number 20140264452
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140231829
- Publication date Aug 21, 2014
- Takamitsu KANAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140217596
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR CO-PACKAGING GALLIUM NITRIDE ELECTRONICS
- Publication number 20140183543
- Publication date Jul 3, 2014
- AVOGY, INC.
- Donald R. Disney
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas specifically adapted for strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device having a bond wire o...

Semiconductor package with elastic coupler and related methods

Semiconductor devices and methods of making the same

Semiconductor device and method of manufacturing the same

Soldering a conductor to an aluminum metallization

Method of forming an aluminum oxide layer, metal surface with alumi...

Semiconductor arrangement

Stacked dies electrically connected to a package substrate by lead...

Method for electrically contacting a component by galvanic connecti...

Soldering a conductor to an aluminum metallization

Soldering a conductor to an aluminum metallization

Die stack assembly using an edge separation structure for connectiv...

Power MOSFET device and manufacturing process thereof

Die stack assembly using an edge separation structure for connectiv...

Semiconductor devices and methods of making the same

Electrode terminal, semiconductor device, and power conversion appa...

Soldering a conductor to an aluminum metallization

Semiconductor package with elastic coupler and related methods

Semiconductor backmetal (BM) and over pad metallization (OPM) struc...

Semiconductor devices and methods of making the same

Semiconductor devices and methods of making the same

Semiconductor package with elastic coupler and related methods

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Semiconductor device having low on resistance

Semiconductor package with elastic coupler and related methods

Common drain semiconductor device structure and method

Switching element with a series-connected junction FET (JFET) and M...

Semiconductor device and automobile

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Power Half-Bridge Module, Power Inverter, and Method for Producing...

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SOLDER STOP FEATURE FOR ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE B...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...

SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES WITH SUB-TERMINALS AND RELATED METHODS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

III-Nitride Rectifier Package

Molding Material and Method for Packaging Semiconductor Chips

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

METHOD OF FORMING A HEMT SEMICONDUCTOR DEVICE AND STRUCTURE THEREFOR

Semiconductor Modules and Methods of Formation Thereof

SEMICONDUCTOR DEVICE

POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME

METHOD AND SYSTEM FOR CO-PACKAGING GALLIUM NITRIDE ELECTRONICS