Bonding areas specifically adapted for wire connectors

Industry

CPC
H01L2224/04042

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/04042Bonding areas specifically adapted for wire connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory device including circuitry under bond pads
- Patent number 12,362,244
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Chiara Cerafogli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packages having connecting structure
- Patent number 12,315,832
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Kijong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including conductive element on side surface of s...
- Patent number 12,300,641
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Shuhei Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,288,760
- Issue date Apr 29, 2025
- Renesas Electronics Corporation
- Takayuki Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, apparatus, and chip
- Patent number 12,278,200
- Issue date Apr 15, 2025
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical element and optical concentration measuring apparatus
- Patent number 12,272,721
- Issue date Apr 8, 2025
- Asahi Kasei Microdevices Corporation
- Daiki Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top hat structure for isolation capacitors
- Patent number 12,272,633
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Thomas C. Fowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with isolated semiconductor die and el...
- Patent number 12,266,595
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor component and method of fabrica...
- Patent number 12,255,162
- Issue date Mar 18, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed package and method of making the same
- Patent number 12,230,594
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a thermally and electrically conductiv...
- Patent number 12,224,222
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 12,183,662
- Issue date Dec 31, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level bonding of obstructive elements
- Patent number 12,176,303
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cantilevered dies in ceramic packages
- Patent number 12,176,255
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Ramlah Binte Abdul Razak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250241056
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Karl GRANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250239549
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Pierre-Yves PICHON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LIN...
- Publication number 20250239550
- Publication date Jul 24, 2025
- SK HYNIX INC.
- Jae Yong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233100
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Youn Jo MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
- Publication number 20250210554
- Publication date Jun 26, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210580
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hee Woo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210515
- Publication date Jun 26, 2025
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS
- Publication number 20250204125
- Publication date Jun 19, 2025
- ASAHI KASEI MICRODEVICES CORPORATION
- Daiki YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192081
- Publication date Jun 12, 2025
- REALTEK SEMICONDUCTOR CORPORATION
- Wen Cheng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20250192084
- Publication date Jun 12, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20250191916
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Kazuhiro NISHIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
- Publication number 20250183210
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157961
- Publication date May 15, 2025
- DENSO CORPORATION
- Shiro MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...
- Publication number 20250151392
- Publication date May 8, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre BLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR A WIRE BONDING MACHINE HAVING A DYNAMICALLY ADJUSTABL...
- Publication number 20250149502
- Publication date May 8, 2025
- SANDISK TECHNOLOGIES, INC.
- Nur Syazwani Mohd Najman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES
- Publication number 20250140735
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jomari AUSTRIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED DIES IN CERAMIC PACKAGES
- Publication number 20250125203
- Publication date Apr 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ramlah Binte ABDUL RAZAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
- Publication number 20250118689
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
- Publication number 20250112182
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250105804
- Publication date Mar 27, 2025
- RICHWAVE TECHNOLOGY CORP.
- Po-Yen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250105179
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Chikara INADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105177
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS

Bonding areas specifically adapted for wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory device including circuitry under bond pads

Semiconductor device and method for manufacturing the same

Semiconductor device comprising PN junction diode and Schottky barr...

Inverted leads for packaged isolation devices

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device and method of forming microelectromechanical s...

Semiconductor packages having connecting structure

Electronic device including conductive element on side surface of s...

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor element, apparatus, and chip

Optical element and optical concentration measuring apparatus

Top hat structure for isolation capacitors

Semiconductor device package with isolated semiconductor die and el...

Info structure with copper pillar having reversed profile

Wire bond wires for interference shielding

Semiconductor device, semiconductor component and method of fabrica...

Palladium-coated copper bonding wire, manufacturing method of palla...

Integrated circuit package having wirebonded multi-die stack

Semiconductor device and method of forming micro interconnect struc...

Printed package and method of making the same

Semiconductor package having a thermally and electrically conductiv...

Radio-frequency switching devices having improved voltage handling...

Semiconductor packages

Package structure

Semiconductor device

Signal isolator having enhanced creepage characteristics

Wafer-level bonding of obstructive elements

Cantilevered dies in ceramic packages

Semiconductor device

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION LIN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

OPTICAL ELEMENT AND OPTICAL CONCENTRATION MEASURING APPARATUS

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

RADIO-FREQUENCY SWITCHING DEVICES HAVING IMPROVED VOLTAGE HANDLING...

CAPILLARY FOR A WIRE BONDING MACHINE HAVING A DYNAMICALLY ADJUSTABL...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES

ELECTRONIC DEVICE

CANTILEVERED DIES IN CERAMIC PACKAGES

SEMICONDUCTOR PACKAGE HAVING A CONTROLLER

SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER

AMPLIFY DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE