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Bonding areas specifically adapted for wire connectors
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H01L2224/04042
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/04042
Bonding areas specifically adapted for wire connectors
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Patents Grants
last 30 patents
Information
Patent Grant
Signal isolator having enhanced creepage characteristics
Patent number
11,973,008
Issue date
Apr 30, 2024
ALLEGRO MICROSYSTEMS, LLC
Robert A. Briano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,973,007
Issue date
Apr 30, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
Patent number
11,967,543
Issue date
Apr 23, 2024
Rohm Co., Ltd.
Toshio Hanada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated high voltage capacitor
Patent number
11,967,610
Issue date
Apr 23, 2024
Semtech Corporation
Christopher David Ainsworth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IC including capacitor having segmented bottom plate
Patent number
11,961,879
Issue date
Apr 16, 2024
Texas Instruments Incorporated
Jeffrey West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Centralized placement of command and address swapping in memory dev...
Patent number
11,961,585
Issue date
Apr 16, 2024
Kazuhiro Yoshida
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package
Patent number
11,961,807
Issue date
Apr 16, 2024
Silicon Works Co., Ltd.
Myoung Su Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memories and memory components with interconnected and redundant da...
Patent number
11,955,165
Issue date
Apr 9, 2024
RAMBUS INC.
Frederick A. Ware
G11 - INFORMATION STORAGE
Information
Patent Grant
Reducing loss in stacked quantum devices
Patent number
11,955,465
Issue date
Apr 9, 2024
Google LLC
Theodore Charles White
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit die pad cavity
Patent number
11,942,448
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Bo-Hsun Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having polygonal bonding pad
Patent number
11,935,851
Issue date
Mar 19, 2024
NANYA TECHNOLOGY CORPORATION
Hsih-Yang Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
Patent number
11,935,842
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having laterally offset stacked semiconductor...
Patent number
11,929,349
Issue date
Mar 12, 2024
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,916,029
Issue date
Feb 27, 2024
Sumitomo Electric Industries, Ltd.
Mitsuhiko Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding for semiconductor devices
Patent number
11,901,327
Issue date
Feb 13, 2024
Western Digital Technologies, Inc.
Yang Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods related to radio-frequency switching devices having improve...
Patent number
11,901,243
Issue date
Feb 13, 2024
Skyworks Solutions, Inc.
Guillaume Alexandre Blin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device isolators
Patent number
11,901,282
Issue date
Feb 13, 2024
Texas Instruments Incorporated
Kumar Anurag Shrivastava
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,901,328
Issue date
Feb 13, 2024
Fuji Electric Co., Ltd.
Kenshi Terashima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,901,345
Issue date
Feb 13, 2024
SK hynix Inc.
Jeong Hyun Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
Patent number
11,894,349
Issue date
Feb 6, 2024
Rohm Co., Ltd.
Keiji Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate processing and packaging
Patent number
11,894,313
Issue date
Feb 6, 2024
Texas Instruments Incorporated
Jane Qian Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad layout including floating conductive sections
Patent number
11,887,949
Issue date
Jan 30, 2024
Macronix International Co., Ltd.
Su-Chueh Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package for power electronics
Patent number
11,887,953
Issue date
Jan 30, 2024
Wolfspeed, Inc.
Brice McPherson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including conductive element on side surface of s...
Patent number
11,887,947
Issue date
Jan 30, 2024
INNOLUX CORPORATION
Shuhei Hosaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device and electronic apparatus
Patent number
11,887,950
Issue date
Jan 30, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Takuya Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for preparing semiconductor device with wire bond
Patent number
11,876,072
Issue date
Jan 16, 2024
NANYA TECHNOLOGY CORPORATION
Wei-Zhong Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
Publication number
20240136309
Publication date
Apr 25, 2024
Mitsubishi Electric Corporation
Yasunari HINO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
Publication number
20240136256
Publication date
Apr 25, 2024
NXP B.V.
Frank.zy Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PROCESSING AND PACKAGING
Publication number
20240128199
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Jane Qian Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
Publication number
20240128215
Publication date
Apr 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Takashi NOMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
Publication number
20240120322
Publication date
Apr 11, 2024
Rohm Co., Ltd.
Keiji Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE
Publication number
20240113042
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE FOR POWER ELECTRONICS
Publication number
20240105651
Publication date
Mar 28, 2024
Wolfspeed, Inc.
Brice McPherson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DISTRIBUTION NETWORK AND SEMICONDUCTOR DEVICE
Publication number
20240105616
Publication date
Mar 28, 2024
SK HYNIX INC.
Ki Bum KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240105649
Publication date
Mar 28, 2024
Innolux Corporation
Shuhei Hosaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Publication number
20240088104
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL BONDING OF OBSTRUCTIVE ELEMENTS
Publication number
20240079351
Publication date
Mar 7, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Javier A. DeLaCruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED...
Publication number
20240071979
Publication date
Feb 29, 2024
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
Publication number
20240063175
Publication date
Feb 22, 2024
NANYA TECHNOLOGY CORPORATION
WEI-ZHONG LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SE...
Publication number
20240055375
Publication date
Feb 15, 2024
Fuji Electric Co., Ltd.
Takashi TSUJI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20240047376
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
Publication number
20240047437
Publication date
Feb 8, 2024
Changxin Memory Technologies, Inc.
Mingxing ZUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus Including a Capacitor and a Coil, and a System Having Suc...
Publication number
20240038696
Publication date
Feb 1, 2024
INFINEON TECHNOLOGIES AG
Hermann Gruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240030338
Publication date
Jan 25, 2024
Ancora Semiconductors Inc.
Li-Fan LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH HYBRID WIRE BOND AND BUMP BOND CONNECTIONS
Publication number
20240030171
Publication date
Jan 25, 2024
Micron Technology, Inc.
Youngkwon JO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240021541
Publication date
Jan 18, 2024
RENESAS ELECTRONICS CORPORATION
Kazuo Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
Publication number
20240014156
Publication date
Jan 11, 2024
Fuji Electric Co., Ltd.
Yasuaki HOZUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240014159
Publication date
Jan 11, 2024
Rohm Co., Ltd.
Bungo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
Publication number
20240014155
Publication date
Jan 11, 2024
CHIPMORE TECHNOLOGY CORPORATION LIMITED
Wenjie HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE PLATING FOR PACKAGED SEMICONDUCTOR DEVICES
Publication number
20240006351
Publication date
Jan 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Katleen Fajardo Timbol
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240006354
Publication date
Jan 4, 2024
RENESAS ELECTRONICS CORPORATION
Shota OKABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL FILM AND MANUFACTURING METHOD OF THE METAL FILM, AND SEMICOND...
Publication number
20230411320
Publication date
Dec 21, 2023
RENESAS ELECTRONICS CORPORATION
Tadashi YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230411354
Publication date
Dec 21, 2023
Samsung Electronics Co., Ltd.
Chihong SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND DEVICE FOR PRODUCING A SEMICONDUCTOR COMPONENT
Publication number
20230402412
Publication date
Dec 14, 2023
ROBERT BOSCH GmbH
Daniel Monteiro Diniz Reis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230402431
Publication date
Dec 14, 2023
KIOXIA Corporation
Haruo MIKI
H01 - BASIC ELECTRIC ELEMENTS