Bonding interfaces of the bump connector

Industry

CPC
H01L2224/8134

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8134Bonding interfaces of the bump connector

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 12,300,651
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 12,300,656
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 12,199,064
- Issue date Jan 14, 2025
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,929,316
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 11,875,988
- Issue date Jan 16, 2024
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 11,837,567
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 11,715,716
- Issue date Aug 1, 2023
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,646,260
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect using nanoporous metal locking structures
- Patent number 11,469,199
- Issue date Oct 11, 2022
- Meta Platforms Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the electrical bonding of semiconductor components
- Patent number 11,362,061
- Issue date Jun 14, 2022
- Imec VZW
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer stamp
- Patent number 11,318,663
- Issue date May 3, 2022
- X Display Company Technology Limited
- Tanya Yvette Moore
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 11,114,406
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer stamp
- Patent number 10,899,067
- Issue date Jan 26, 2021
- X Display Company Technology Limited
- Tanya Yvette Moore
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding strategies for placement of LEDs from multiple carrier subs...
- Patent number 10,854,801
- Issue date Dec 1, 2020
- Facebook Technologies, LLC
- William Padraic Henry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,833,033
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip packages with sintered interconnects formed out of pads
- Patent number 10,777,496
- Issue date Sep 15, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,763,237
- Issue date Sep 1, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic package
- Patent number 10,522,500
- Issue date Dec 31, 2019
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 10,438,910
- Issue date Oct 8, 2019
- Amkor Technology, Inc.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for mounting components in semiconductor fabricat...
- Patent number 10,438,922
- Issue date Oct 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming flipchip interconnect st...
- Patent number 10,388,626
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,388,622
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20240113069
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Thereof
- Publication number 20240021564
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, PACKAGE STRUCTURE AND ELECTRONIC MANUFACTURING M...
- Publication number 20230018031
- Publication date Jan 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20220352115
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Thereof
- Publication number 20220278066
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...
- Publication number 20220115348
- Publication date Apr 14, 2022
- Raytheon Company
- Sean F. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...
- Publication number 20220068873
- Publication date Mar 3, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangcai YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220059444
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- JONGYOUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STAMP
- Publication number 20210101329
- Publication date Apr 8, 2021
- X Display Company Technology Limited
- Tanya Yvette Moore
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20210098402
- Publication date Apr 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20210035938
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS
- Publication number 20200402950
- Publication date Dec 24, 2020
- IMEC vzw
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Packaging Structure and Related Inner Lead Bonding Method
- Publication number 20200335474
- Publication date Oct 22, 2020
- SITRONIX TECHNOLOGY CORP.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20200091109
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20190326240
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20190252344
- Publication date Aug 15, 2019
- Siliconware Precision Industries Co., Ltd.
- Yu-Min Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20190237420
- Publication date Aug 1, 2019
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDED BODY
- Publication number 20180082973
- Publication date Mar 22, 2018
- Mitsubishi Heavy Industries, Ltd.
- Masahiro KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20180053741
- Publication date Feb 22, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFORMABLE CONDUCTIVE CONTACTS
- Publication number 20170373033
- Publication date Dec 28, 2017
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MOUNTING COMPONENTS IN SEMICONDUCTOR FABRICAT...
- Publication number 20170352641
- Publication date Dec 7, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20170229421
- Publication date Aug 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES FOR PILLAR INTERCONNECTS
- Publication number 20170162436
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Yield Improvement
- Publication number 20170133346
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20170062371
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interfaces of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip packaging structure and related inner lead bonding method

Electronic device, package structure and electronic manufacturing m...

Semiconductor package and method of forming thereof

Substrate pad and die pillar design modifications to enable extreme...

Supporting backplane, manufacturing method therefor and backplane

Bump structure having a side recess and semiconductor structure inc...

Semiconductor product with interlocking metal-to-metal bonds and me...

Semiconductor package and method of fabricating the same

Substrate pad and die pillar design modifications to enable extreme...

Semiconductor package and method of forming thereof

Electronic device, package structure and electronic manufacturing m...

Connection arrangement, component carrier and method of forming a c...

Semiconductor package and method of fabricating the same

Bump structure having a side recess and semiconductor structure inc...

Interconnect using nanoporous metal locking structures

Method for the electrical bonding of semiconductor components

Multi-layer stamp

Warpage-compensated bonded structure including a support chip and a...

Semiconductor product with interlocking metal-to-metal bonds and me...

Multi-layer stamp

Bonding strategies for placement of LEDs from multiple carrier subs...

Bump structure having a side recess and semiconductor structure inc...

Chip packages with sintered interconnects formed out of pads

Method for manufacturing electronic package

Metallic interconnect, a method of manufacturing a metallic interco...

Method for manufacturing electronic package

Semiconductor product with interlocking metal-to-metal bonds and me...

Method and system for mounting components in semiconductor fabricat...

Semiconductor device and method of forming flipchip interconnect st...

Bump structure having a side recess and semiconductor structure inc...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

Semiconductor Package and Method of Forming Thereof

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

ELECTRONIC DEVICE, PACKAGE STRUCTURE AND ELECTRONIC MANUFACTURING M...

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

Semiconductor Package and Method of Forming Thereof

3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...

BACK PLATE AND MANUFACTURING METHOD THEREOF, METHOD FOR BONDING CHI...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

MULTI-LAYER STAMP

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

Connection Arrangement, Component Carrier and Method of Forming a C...

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS

Chip Packaging Structure and Related Inner Lead Bonding Method

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

BONDING METHOD AND BONDED BODY

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

DEFORMABLE CONDUCTIVE CONTACTS

METHOD AND SYSTEM FOR MOUNTING COMPONENTS IN SEMICONDUCTOR FABRICAT...

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

NANOWIRES FOR PILLAR INTERCONNECTS

Bump Structure for Yield Improvement

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...