Bonding interfaces of the connector

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CPC
H01L2224/8234

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8234Bonding interfaces of the connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of forming thereof
- Patent number 11,837,567
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,688,726
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yasunori Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,629,537
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 10,541,232
- Issue date Jan 21, 2020
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,290,584
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 10,163,863
- Issue date Dec 25, 2018
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die-down package-on-package device
- Patent number 9,812,422
- Issue date Nov 7, 2017
- Intel Corporation
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,559,078
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 9,553,075
- Issue date Jan 24, 2017
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 9,147,669
- Issue date Sep 29, 2015
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 8,742,561
- Issue date Jun 3, 2014
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package and Method of Forming Thereof
- Publication number 20240021564
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming Thereof
- Publication number 20220278066
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220085003
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Yasunori IWASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220069093
- Publication date Mar 3, 2022
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED AND EMBEDDED DIE CORELESS PACKAGE
- Publication number 20180012871
- Publication date Jan 11, 2018
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE
- Publication number 20170012020
- Publication date Jan 12, 2017
- Intel Corporation
- Toong Erh Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED AND EMBEDDED DIE CORELESS PACKAGE
- Publication number 20140357024
- Publication date Dec 4, 2014
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20130021766
- Publication date Jan 24, 2013
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Recessed and embedded die coreless package
- Publication number 20110156231
- Publication date Jun 30, 2011
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interfaces of the connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of forming thereof

Semiconductor device

Conductive vias in semiconductor packages and methods of forming same

Recessed and embedded die coreless package

Conductive vias in semiconductor packages and methods of forming same

Recessed and embedded die coreless package

Embedded die-down package-on-package device

Electronic component

Recessed and embedded die coreless package

Recessed and embedded die coreless package

Recessed and embedded die coreless package

Patents Applicationslast 30 patents

Semiconductor Package and Method of Forming Thereof

Semiconductor Package and Method of Forming Thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

RECESSED AND EMBEDDED DIE CORELESS PACKAGE

EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE

RECESSED AND EMBEDDED DIE CORELESS PACKAGE

Electronic Component

Recessed and embedded die coreless package