Bonding interfaces of the semiconductor or solid state body

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H01L2224/8336

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8336Bonding interfaces of the semiconductor or solid state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a device fixed on a substrate with an a...
- Patent number 11,233,029
- Issue date Jan 25, 2022
- Mitsubishi Electric Corporation
- Kazuo Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating the electronic component, and method for tra...
- Patent number 11,069,638
- Issue date Jul 20, 2021
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, transposing component, method for fabricating...
- Patent number 10,438,911
- Issue date Oct 8, 2019
- AU OPTRONICS CORPORATION
- Yi-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanisms for forming package structure
- Patent number 10,128,226
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a hermetic module to an electrode array
- Patent number 9,984,994
- Issue date May 29, 2018
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device
- Patent number 9,905,536
- Issue date Feb 27, 2018
- J-DEVICES CORPORATION
- Makoto Moda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointed body, method for manufacturing same and jointed member
- Patent number 9,821,406
- Issue date Nov 21, 2017
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,805,937
- Issue date Oct 31, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly including a chip carrier, semiconduct...
- Patent number 9,768,120
- Issue date Sep 19, 2017
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint structure for ball grid array in wafer level package
- Patent number 9,761,551
- Issue date Sep 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias for semiconductor devices and manufacturing me...
- Patent number 9,728,451
- Issue date Aug 8, 2017
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming 3-D circuits with integrated passive devices
- Patent number 9,698,131
- Issue date Jul 4, 2017
- Invensas Corporation
- Paul W. Sanders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming package structure
- Patent number 9,698,135
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 9,691,805
- Issue date Jun 27, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint structure for ball grid array in wafer level package
- Patent number 9,449,934
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with mechanical lock features between a semico...
- Patent number 9,425,161
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element, semiconductor element manufacturing method,...
- Patent number 9,362,366
- Issue date Jun 7, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuyuki Yanase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure including metal nano particle
- Patent number 9,362,242
- Issue date Jun 7, 2016
- Mitsubishi Electric Corporation
- Aya Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems
- Patent number 9,355,896
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a low-Rdson vertical power MOSFET device
- Patent number 9,318,603
- Issue date Apr 19, 2016
- Alpha and Omega Semiconductor Incorporated
- Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 9,275,922
- Issue date Mar 1, 2016
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged nano-structured component and method of making a packaged...
- Patent number 9,249,014
- Issue date Feb 2, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mechanisms for forming package structure
- Patent number 9,252,065
- Issue date Feb 2, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming 3-D circuits with integrated passive devices
- Patent number 9,236,365
- Issue date Jan 12, 2016
- Invensas Corporation
- Paul W. Sanders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform including a groove extending to an edge of the preform
- Patent number 9,190,384
- Issue date Nov 17, 2015
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising a nanotube-based interface connection...
- Patent number 9,145,294
- Issue date Sep 29, 2015
- STMicroelectronics S.R.L.
- Davide Giuseppe Patti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Package systems and manufacturing methods thereof
- Patent number 9,112,001
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402424
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230005961
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dae Hwan JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Supporting Thin Semiconductor Chips with a...
- Publication number 20200395334
- Publication date Dec 17, 2020
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170372907
- Publication date Dec 28, 2017
- Renesas Electronics Corporation
- Tomoya Kashiwazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING PACKAGE STRUCTURE
- Publication number 20170301663
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY
- Publication number 20170154867
- Publication date Jun 1, 2017
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
THERMOCOMPRESSION BONDING WITH RAISED FEATURE
- Publication number 20160343684
- Publication date Nov 24, 2016
- Innovative Micro Technology
- Christopher S. GUDEMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS FOR SEMICONDUCTOR DEVICES AND MANUFACTURING ME...
- Publication number 20140363967
- Publication date Dec 11, 2014
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES
- Publication number 20140332980
- Publication date Nov 13, 2014
- Invensas Corporation
- Paul W. Sanders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...
- Publication number 20140284749
- Publication date Sep 25, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE
- Publication number 20140225185
- Publication date Aug 14, 2014
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS FOR SEMICONDUCTOR DEVICES AND MANUFACTURING ME...
- Publication number 20140203412
- Publication date Jul 24, 2014
- ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM
- Publication number 20140206149
- Publication date Jul 24, 2014
- TriQuint Semiconductor, Inc.
- Shixi Louis Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF
- Publication number 20140170849
- Publication date Jun 19, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chia-Pao SHU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Producing the Same
- Publication number 20140167224
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...
- Publication number 20140154867
- Publication date Jun 5, 2014
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...
- Publication number 20140138833
- Publication date May 22, 2014
- Infineon Technologies Austria AG
- Philipp Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Nano-Structured Component and Method of Making a Packaged...
- Publication number 20140126165
- Publication date May 8, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Unit with Submount for Semiconductor Device
- Publication number 20140110843
- Publication date Apr 24, 2014
- IIPG Photonics Corporation
- Alexander Ovtchinnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE
- Publication number 20130207263
- Publication date Aug 15, 2013
- International Business Machines Corporation
- Deepak Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES
- Publication number 20130143367
- Publication date Jun 6, 2013
- FREESCALE SEMICONDUCTOR, INC.
- PAUL W. SANDERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FASTENING DEVICE
- Publication number 20130140702
- Publication date Jun 6, 2013
- Micronas GmbH
- Christoph WILBERTZ
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE
- Publication number 20130049100
- Publication date Feb 28, 2013
- Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...
- Publication number 20130001803
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20120218715
- Publication date Aug 30, 2012
- Fujitsu Limited
- Shinichi HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTUR...
- Publication number 20120218713
- Publication date Aug 30, 2012
- Fujitsu Limited
- Yoshitaka Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interfaces of the semiconductor or solid state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a device fixed on a substrate with an a...

Method for fabricating the electronic component, and method for tra...

Method and apparatus for creating a bond between objects based on f...

Electronic component, transposing component, method for fabricating...

Method for permanently bonding wafers by a connecting layer by mean...

Mechanisms for forming package structure

Method for bonding a hermetic module to an electrode array

Semiconductor device

Jointed body, method for manufacturing same and jointed member

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device assembly including a chip carrier, semiconduct...

Solder joint structure for ball grid array in wafer level package

Through silicon vias for semiconductor devices and manufacturing me...

Methods of forming 3-D circuits with integrated passive devices

Mechanisms for forming package structure

Semiconductor device, method for manufacturing the same, and electr...

Solder fatigue arrest for wafer level package

Solder joint structure for ball grid array in wafer level package

Semiconductor device with mechanical lock features between a semico...

Semiconductor element, semiconductor element manufacturing method,...

Bonding structure including metal nano particle

Package systems

Method of making a low-Rdson vertical power MOSFET device

Semiconductor device, method for manufacturing the same, and electr...

Packaged nano-structured component and method of making a packaged...

Mechanisms for forming package structure

Methods of forming 3-D circuits with integrated passive devices

Preform including a groove extending to an edge of the preform

Electronic device comprising a nanotube-based interface connection...

Package systems and manufacturing methods thereof

Patents Applicationslast 30 patents

CONNECTING ARRANGEMENT

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

Method and Structure for Supporting Thin Semiconductor Chips with a...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

MECHANISMS FOR FORMING PACKAGE STRUCTURE

METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY

THERMOCOMPRESSION BONDING WITH RAISED FEATURE

THROUGH SILICON VIAS FOR SEMICONDUCTOR DEVICES AND MANUFACTURING ME...

METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...

METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE

THROUGH SILICON VIAS FOR SEMICONDUCTOR DEVICES AND MANUFACTURING ME...

PREFORM INCLUDING A GROOVE EXTENDING TO AN EDGE OF THE PREFORM

PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF

Semiconductor Device and Method of Producing the Same

METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEAN...

Semiconductor Device Assembly Including a Chip Carrier, Semiconduct...

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

Packaged Nano-Structured Component and Method of Making a Packaged...

Semiconductor Unit with Submount for Semiconductor Device

SEMICONDUCTOR CHIPS INCLUDING PASSIVATION LAYER TRENCH STRUCTURE

METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES

FASTENING DEVICE

METHOD OF MAKING A LOW-RDSON VERTICAL POWER MOSFET DEVICE

METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...

Micromechanical Method and Corresponding Assembly for Bonding Semic...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

HEAT RADIATION MATERIAL, ELECTRONIC DEVICE AND METHOD OF MANUFACTUR...