Bonding interfaces of the semiconductor or solid state body

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H01L2224/8136

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8136Bonding interfaces of the semiconductor or solid state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Adapter board and method for forming same, packaging method, and pa...
- Patent number 12,068,233
- Issue date Aug 20, 2024
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adapter board and method for forming same, packaging method, and pa...
- Patent number 11,637,059
- Issue date Apr 25, 2023
- SEMICONDUCTOR MANUFACTURING NORTH CHINA (BEIJING) CORPORATION
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity coupling interconnect packaging systems and methods
- Patent number 11,398,465
- Issue date Jul 26, 2022
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 10,847,504
- Issue date Nov 24, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity coupling interconnect packaging systems and methods
- Patent number 10,381,336
- Issue date Aug 13, 2019
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 10,319,706
- Issue date Jun 11, 2019
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Proximity coupling of interconnect packaging systems and methods
- Patent number 10,062,678
- Issue date Aug 28, 2018
- Micron Technologies, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure for yield improvement
- Patent number 10,056,347
- Issue date Aug 21, 2018
- Taiwan Semiconductor Manufacturing Company
- Tzu-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball height control in bonding process
- Patent number 10,037,962
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside interconnect structure connected to TSVs
- Patent number 9,978,708
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jointed body, method for manufacturing same and jointed member
- Patent number 9,821,406
- Issue date Nov 21, 2017
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Tadashi Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out pop stacking process
- Patent number 9,754,924
- Issue date Sep 5, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside interconnect structure connected to TSVs
- Patent number 9,716,074
- Issue date Jul 25, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,691,739
- Issue date Jun 27, 2017
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for package on package through mold interconnects
- Patent number 9,659,908
- Issue date May 23, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding
- Patent number 9,576,929
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out PoP stacking process
- Patent number 9,379,097
- Issue date Jun 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with at least one voltage-guided conductive fi...
- Patent number 9,356,001
- Issue date May 31, 2016
- HGST Netherlands B.V.
- Luiz M. Franca-Neto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,318,418
- Issue date Apr 19, 2016
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 9,076,700
- Issue date Jul 7, 2015
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,816,506
- Issue date Aug 26, 2014
- Tessera Advanced Technologies, Inc.
- Michihiro Kawashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with mounting structure
- Patent number 8,803,330
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with coupling features and meth...
- Patent number 8,710,670
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- MinJung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PA...
- Publication number 20230223329
- Publication date Jul 13, 2023
- Semiconductor Manufacturing North China (Beijing) Corporation
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PA...
- Publication number 20210398892
- Publication date Dec 23, 2021
- Semiconductor Manufacturing North China (Beijing) Corporation
- Cai Qiaoming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS
- Publication number 20190296003
- Publication date Sep 26, 2019
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190252360
- Publication date Aug 15, 2019
- LUMENS CO., LTD
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS
- Publication number 20180331089
- Publication date Nov 15, 2018
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20180132397
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Silver-Based Contacting M...
- Publication number 20180132398
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Indium-Based Contacting M...
- Publication number 20180132395
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20180132396
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20180132394
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
System for Low-Force Thermocompression Bonding
- Publication number 20180132393
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20180132399
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Ball Height Control in Bonding Process
- Publication number 20170236797
- Publication date Aug 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRES FOR PILLAR INTERCONNECTS
- Publication number 20170162536
- Publication date Jun 8, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY COUPLING OF INTERCONNECT PACKAGING SYSTEMS AND METHODS
- Publication number 20170141096
- Publication date May 18, 2017
- Micron Technology, Inc.
- Rich Fogal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS
- Publication number 20170133350
- Publication date May 11, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure for Yield Improvement
- Publication number 20170133346
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Backside Interconnect Structure Connected to TSVs
- Publication number 20170005069
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT
- Publication number 20160099228
- Publication date Apr 7, 2016
- HGST NETHERLANDS B.V.
- Luiz M. FRANCA-NETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT POP STACKING PROCESS
- Publication number 20160027766
- Publication date Jan 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20150187722
- Publication date Jul 2, 2015
- Siliconware Precision Industries Co., Ltd.
- Cheng-Chia Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE
- Publication number 20140335655
- Publication date Nov 13, 2014
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interfaces of the semiconductor or solid state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adapter board and method for forming same, packaging method, and pa...

Display device

Adapter board and method for forming same, packaging method, and pa...

Proximity coupling interconnect packaging systems and methods

3D packaging with low-force thermocompression bonding of oxidizable...

Micro-LED module and method for fabricating the same

Proximity coupling interconnect packaging systems and methods

Micro-LED module and method for fabricating the same

Multi-strike process for bonding packages and the packages thereof

Proximity coupling of interconnect packaging systems and methods

Bump structure for yield improvement

Ball height control in bonding process

Wafer backside interconnect structure connected to TSVs

Jointed body, method for manufacturing same and jointed member

Fan-out pop stacking process

Wafer backside interconnect structure connected to TSVs

Semiconductor device and method of manufacturing same

Systems and methods for package on package through mold interconnects

Solder fatigue arrest for wafer level package

Multi-strike process for bonding

Fan-out PoP stacking process

Semiconductor device with at least one voltage-guided conductive fi...

Semiconductor device and method of manufacturing same

Interconnect structures for stacked dies, including penetrating str...

Semiconductor device and method of manufacturing same

Semiconductor device and method of manufacturing the same

Integrated circuit package system with mounting structure

Integrated circuit packaging system with coupling features and meth...

Interconnect structures for stacked dies, including penetrating str...

Interconnect structures for stacked dies, including penetrating str...

Patents Applicationslast 30 patents

ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PA...

ADAPTER BOARD AND METHOD FOR FORMING SAME, PACKAGING METHOD, AND PA...

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS

MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME

PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Silver-Based Contacting M...

Thermocompression Bonding with Passivated Indium-Based Contacting M...

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

System for Low-Force Thermocompression Bonding

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

Ball Height Control in Bonding Process

NANOWIRES FOR PILLAR INTERCONNECTS

PROXIMITY COUPLING OF INTERCONNECT PACKAGING SYSTEMS AND METHODS

SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS

Bump Structure for Yield Improvement

Wafer Backside Interconnect Structure Connected to TSVs

METHOD AND APPARATUS FOR DIE-TO-DIE PAD CONTACT

FAN-OUT POP STACKING PROCESS

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE