Bonding interfaces outside the semiconductor or solid-state body

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H01L2224/8138

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8138Bonding interfaces outside the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 12,015,000
- Issue date Jun 18, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device multilevel package substrate for improved electro...
- Patent number 11,978,699
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 11,875,988
- Issue date Jan 16, 2024
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,862,606
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component, wherein a semiconduct...
- Patent number 11,842,980
- Issue date Dec 12, 2023
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device integration into system substrate
- Patent number 11,735,623
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device package including a lead frame
- Patent number 11,677,059
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Ji-hoon Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip curved sidewall self-alignment features for substrate and...
- Patent number 11,658,099
- Issue date May 23, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding interposer and integrated circuit chip, and ultrasound prob...
- Patent number 11,631,798
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kyung-moo Choi
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Integrated mechanical aids for high accuracy alignable-electrical c...
- Patent number 11,562,984
- Issue date Jan 24, 2023
- HRL Laboratories, LLC
- Peter Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secondary electron generating composition
- Patent number 11,487,199
- Issue date Nov 1, 2022
- The University of Manchester
- Scott Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect using nanoporous metal locking structures
- Patent number 11,469,199
- Issue date Oct 11, 2022
- Meta Platforms Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element mounting structure, and combination of semico...
- Patent number 11,444,054
- Issue date Sep 13, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hitoshi Onozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an inductor
- Patent number 11,393,782
- Issue date Jul 19, 2022
- Renesas Electronics Corporation
- Yasutaka Nakashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power decoupling attachment
- Patent number 11,297,717
- Issue date Apr 5, 2022
- ELPIS TECHNOLOGIES INC.
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,289,346
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,244,883
- Issue date Feb 8, 2022
- Renesas Electronics Corporation
- Hidenori Egawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip on leadframe having partially etched landing sites
- Patent number 11,233,031
- Issue date Jan 25, 2022
- Texas Instruments Incorporated
- Ronaldo Marasigan Arguelles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip for an electronic device and manufacturing method thereof
- Patent number 11,172,569
- Issue date Nov 9, 2021
- Tai-Saw Technology Co., Ltd.
- Yu-Tung Huang
- G01 - MEASURING TESTING
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking dual leadframe for flip chip on leadframe packages
- Patent number 11,056,462
- Issue date Jul 6, 2021
- Texas Instruments Incorporated
- Lee Han Meng @ Eugene Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with metal line crack prevention design
- Patent number 11,056,464
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with chamfered pads
- Patent number 11,056,435
- Issue date Jul 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor product with interlocking metal-to-metal bonds and me...
- Patent number 11,018,102
- Issue date May 25, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421054
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Seongho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20240332157
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Sangjin Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...
- Publication number 20240297109
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282689
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chan-Yu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240258218
- Publication date Aug 1, 2024
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240250010
- Publication date Jul 25, 2024
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240162185
- Publication date May 16, 2024
- InnoLux Corporation
- Chin-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20240113069
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
- Publication number 20240088104
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...
- Publication number 20230411269
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20230369182
- Publication date Nov 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230352460
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Eunsu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUBSTRATE TO OPTIMIZE SIGNAL ROUTING
- Publication number 20230317586
- Publication date Oct 5, 2023
- NVIDIA Corporation
- Shuanghu Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECONDARY ELECTRON GENERATING COMPOSITION
- Publication number 20230266665
- Publication date Aug 24, 2023
- The University of Manchester
- Scott LEWIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20230253358
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20230207611
- Publication date Jun 29, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...
- Publication number 20220392869
- Publication date Dec 8, 2022
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...
- Publication number 20220369455
- Publication date Nov 17, 2022
- TECHNISCHE HOCHSCHULE ASCHAFFENBURG
- Stefan Rung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20220352115
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES
- Publication number 20220149003
- Publication date May 12, 2022
- TEXAS INSTRUMENTS INCORPORATED
- RONALDO MARASIGAN ARGUELLES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Electronic Component, Wherein a Semiconduct...
- Publication number 20210351156
- Publication date Nov 11, 2021
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Metal Line Crack Prevention Design
- Publication number 20210327854
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20210265247
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20210098402
- Publication date Apr 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200335447
- Publication date Oct 22, 2020
- Siliconware Precision Industries Co., Ltd.
- Chen-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20200328249
- Publication date Oct 15, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...
- Publication number 20200273837
- Publication date Aug 27, 2020
- Hitachi Chemical Company, Ltd.
- Hitoshi ONOZEKI
- H01 - BASIC ELECTRIC ELEMENTS

Bonding interfaces outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor product with interlocking metal-to-metal bonds and me...

Methods of manufacturing semiconductor device with bump interconnec...

Electronic device multilevel package substrate for improved electro...

Method of manufacturing substrate structure with filling material f...

Substrate pad and die pillar design modifications to enable extreme...

Packages with metal line crack prevention design

Method for producing an electronic component, wherein a semiconduct...

Micro device integration into system substrate

Light-emitting device package including a lead frame

Bump-on-trace design for enlarge bump-to-trace distance

Flip chip curved sidewall self-alignment features for substrate and...

Bonding interposer and integrated circuit chip, and ultrasound prob...

Integrated mechanical aids for high accuracy alignable-electrical c...

Secondary electron generating composition

Interconnect using nanoporous metal locking structures

Semiconductor element mounting structure, and combination of semico...

Semiconductor device having an inductor

Power decoupling attachment

Method for fabricating electronic package

System and method to enhance reliability in connection with arrange...

Semiconductor device

Flip-chip on leadframe having partially etched landing sites

Strip for an electronic device and manufacturing method thereof

System and method to enhance solder joint reliability

Bonded structures for package and substrate

Locking dual leadframe for flip chip on leadframe packages

Packages with metal line crack prevention design

Semiconductor package with chamfered pads

Lead-free solder joining of electronic structures

Semiconductor product with interlocking metal-to-metal bonds and me...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTRO...

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

SEMICONDUCTOR PACKAGE

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

DIE SUBSTRATE TO OPTIMIZE SIGNAL ROUTING

SECONDARY ELECTRON GENERATING COMPOSITION

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

DISPLAY PANEL, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF MAN...

ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

FLIP-CHIP ON LEADFRAME HAVING PARTIALLY ETCHED LANDING SITES

Method for Producing an Electronic Component, Wherein a Semiconduct...

Packages with Metal Line Crack Prevention Design

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

METHOD FOR FABRICATING ELECTRONIC PACKAGE

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICO...