Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer

Industry

CPC
H01L21/2007

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/2007Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,955,339
- Issue date Apr 9, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,950,399
- Issue date Apr 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-assisted method for parting crystalline material along lase...
- Patent number 11,901,181
- Issue date Feb 13, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for collectively fabricating a plurality of semiconductor s...
- Patent number 11,876,073
- Issue date Jan 16, 2024
- Soitec
- David Sotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,862,487
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,864,367
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding substrates
- Patent number 11,862,466
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Kurt Hingerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,862,510
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,854,810
- Issue date Dec 26, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,855,036
- Issue date Dec 26, 2023
- Kioxia Corporation
- Masaharu Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave resonator and method of manufacturing the same
- Patent number 11,838,001
- Issue date Dec 5, 2023
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded native interconnects and active base die
- Patent number 11,823,906
- Issue date Nov 21, 2023
- Xcelsis Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated decoupling capacitors
- Patent number 11,810,877
- Issue date Nov 7, 2023
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for surface treatment of substrates
- Patent number 11,776,842
- Issue date Oct 3, 2023
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming SOI substrates
- Patent number 11,764,054
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for bonding of substrates
- Patent number 11,742,205
- Issue date Aug 29, 2023
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress compensation for wafer to wafer bonding
- Patent number 11,721,554
- Issue date Aug 8, 2023
- Intel Corporation
- Anant Jahagirdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding method, and method for manufacturing sem...
- Patent number 11,710,649
- Issue date Jul 25, 2023
- Kioxia Corporation
- Yoshio Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method, imaging element, and el...
- Patent number 11,688,757
- Issue date Jun 27, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hidenobu Tsugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,659,702
- Issue date May 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method
- Patent number 11,631,586
- Issue date Apr 18, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,631,587
- Issue date Apr 18, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of metasurface lens on wafer level substrate
- Patent number 11,626,437
- Issue date Apr 11, 2023
- Intel Corporation
- Prashant Majhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming thin die stack assemblies
- Patent number 11,587,860
- Issue date Feb 21, 2023
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,581,188
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid-bonded and run-out compensated light emitting diodes
- Patent number 11,569,091
- Issue date Jan 31, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Carrier-Assisted Method for Parting Crystalline Material Along Lase...
- Publication number 20240128085
- Publication date Apr 18, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...
- Publication number 20240112908
- Publication date Apr 4, 2024
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240099009
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC C...
- Publication number 20240079238
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240072752
- Publication date Feb 29, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SOI SUBSTRATES
- Publication number 20230369038
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...
- Publication number 20230360962
- Publication date Nov 9, 2023
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Kurt Moen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20230282678
- Publication date Sep 7, 2023
- Sony Semiconductor Solutions Corporation
- Hidenobu TSUGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20230207322
- Publication date Jun 29, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20230117625
- Publication date Apr 20, 2023
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A BURIED HIGH RESIS...
- Publication number 20230072964
- Publication date Mar 9, 2023
- GLOBALWAFERS CO., LTD.
- Igor Peidous
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOROD PRODUCTION METHOD AND NANOROD PRODUCED THEREBY
- Publication number 20230056417
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20230026661
- Publication date Jan 26, 2023
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID BONDING BASED MANUFACTURE OF LIGHT EMITTING DIODES
- Publication number 20220399203
- Publication date Dec 15, 2022
- Meta Platforms Technologies, LLC
- Stephan LUTGEN
- G02 - OPTICS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURES
- Publication number 20220277954
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHODS FOR LIGHT EMITTING DIODES
- Publication number 20220262637
- Publication date Aug 18, 2022
- Facebook Technologies, LLC
- Stephan LUTGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct-Bonded Native Interconnects And Active Base Die
- Publication number 20220238339
- Publication date Jul 28, 2022
- Xcelsis Corporation
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES
- Publication number 20220216098
- Publication date Jul 7, 2022
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFLECTABLE PLATENS AND ASSOCIATED METHODS
- Publication number 20220189784
- Publication date Jun 16, 2022
- Applied Materials, Inc.
- Ming Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...
- Publication number 20220181161
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Sungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
- Publication number 20220139735
- Publication date May 5, 2022
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20220130674
- Publication date Apr 28, 2022
- EV GROUP E. THALLNER GMBH
- Florian Kurz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20220130807
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20220102146
- Publication date Mar 31, 2022
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DECOUPLING CAPACITORS
- Publication number 20220077084
- Publication date Mar 10, 2022
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...
- Publication number 20220068941
- Publication date Mar 3, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WAFER ASSEMBLY BY MOLECULAR BONDING
- Publication number 20220037157
- Publication date Feb 3, 2022
- STMicroelectronics S.A.
- Francois GUYADER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COLLECTIVE PRODUCTION OF A PLURALITY OF SEMICONDUCTOR ST...
- Publication number 20220005785
- Publication date Jan 6, 2022
- SOITEC
- David Sotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20210366958
- Publication date Nov 25, 2021
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20210343584
- Publication date Nov 4, 2021
- Toshiba Memory Corporation
- Mie MATSUO
- H01 - BASIC ELECTRIC ELEMENTS

Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for bonding of substrates

Bonded semiconductor devices having processor and static random-acc...

Semiconductor device including binding agent adhering an integrated...

Carrier-assisted method for parting crystalline material along lase...

Discontinuous patterned bonds for semiconductor devices and associa...

Process for collectively fabricating a plurality of semiconductor s...

Device and method for bonding of two substrates

Bonded semiconductor devices having processor and NAND flash memory...

Method and device for bonding substrates

Semiconductor device manufacturing method and semiconductor device

Bonding methods for light emitting diodes

Bonding apparatus and bonding method

Bulk acoustic wave resonator and method of manufacturing the same

Direct-bonded native interconnects and active base die

Integrated decoupling capacitors

Method and device for surface treatment of substrates

Methods of forming SOI substrates

Apparatus for bond wave propagation control

Method and device for bonding of substrates

Stress compensation for wafer to wafer bonding

Bonding apparatus, bonding method, and method for manufacturing sem...

Semiconductor device, manufacturing method, imaging element, and el...

Bonded semiconductor devices having processor and static random-acc...

Heterogeneous annealing method

Bonded unified semiconductor chips and fabrication and operation me...

Bonding methods for light emitting diodes

Integration of metasurface lens on wafer level substrate

Method of forming thin die stack assemblies

Substrate bonding apparatus

Hybrid-bonded and run-out compensated light emitting diodes

Patents Applicationslast 30 patents

Carrier-Assisted Method for Parting Crystalline Material Along Lase...

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC C...

BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME

METHODS OF FORMING SOI SUBSTRATES

SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...

IMAGING DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A BURIED HIGH RESIS...

NANOROD PRODUCTION METHOD AND NANOROD PRODUCED THEREBY

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

HYBRID BONDING BASED MANUFACTURE OF LIGHT EMITTING DIODES

BONDED SEMICONDUCTOR STRUCTURES

BONDING METHODS FOR LIGHT EMITTING DIODES

Direct-Bonded Native Interconnects And Active Base Die

METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES

DEFLECTABLE PLATENS AND ASSOCIATED METHODS

METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS...

DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

INTEGRATED DECOUPLING CAPACITORS

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...

METHOD OF WAFER ASSEMBLY BY MOLECULAR BONDING

METHOD FOR COLLECTIVE PRODUCTION OF A PLURALITY OF SEMICONDUCTOR ST...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE