Bonding techniques

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H01L2224/818

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/818Bonding techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having through parts of different shapes
- Patent number 12,230,600
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Narumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 12,224,182
- Issue date Feb 11, 2025
- Lumileds, LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive member cavities
- Patent number 12,205,871
- Issue date Jan 21, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 12,207,569
- Issue date Jan 21, 2025
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
- Patent number 12,206,056
- Issue date Jan 21, 2025
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with top side pin array and manufacturing method...
- Patent number 12,205,827
- Issue date Jan 21, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 12,199,064
- Issue date Jan 14, 2025
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering a nanoparticle paste for semiconductor chip join
- Patent number 12,199,059
- Issue date Jan 14, 2025
- International Business Machines Corporation
- Katsuyuki Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 12,191,273
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 12,183,703
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 12,183,595
- Issue date Dec 31, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow method and system
- Patent number 12,176,319
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,170,260
- Issue date Dec 17, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,159,858
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for embedded integrated circuit devices
- Patent number 12,142,543
- Issue date Nov 12, 2024
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERCONNECT FOR INTEGRATED CIRCUITRY
- Publication number 20250062182
- Publication date Feb 20, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Emil NYLANDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...
- Publication number 20250062300
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chan-Hong CHERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...
- Publication number 20250054914
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054915
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...
- Publication number 20250054895
- Publication date Feb 13, 2025
- Sekisui Chemical Co., Ltd
- Taro SHIOJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250046753
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS WITH CRACK REDUCTION
- Publication number 20250046733
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Willamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250033132
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR
- Publication number 20250038092
- Publication date Jan 30, 2025
- NXP USA, Inc.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250029902
- Publication date Jan 23, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inter-Terminal Die-to-Die Attachment
- Publication number 20250029953
- Publication date Jan 23, 2025
- MURATA MANUFACTURING CO., LTD.
- Kazunori Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20250022784
- Publication date Jan 16, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER
- Publication number 20250022841
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS
- Publication number 20250022858
- Publication date Jan 16, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022758
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...
- Publication number 20250022836
- Publication date Jan 16, 2025
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006686
- Publication date Jan 2, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Hun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...
- Publication number 20250006661
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Guangxu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...
- Publication number 20250006690
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING
- Publication number 20250006683
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS

Bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having through parts of different shapes

Package device

Mixed hybrid bonding structures and methods of forming the same

Method for transferring electronic device

Fan out structure for light-emitting diode (LED) device and lightin...

Chip package structure having molding layer

Barrier structures between external electrical connectors

Conductive member cavities

Microwave integrated quantum circuits with cap wafers and their met...

Semiconductor package with intermetallic-compound solder-joint comp...

Electronic device with top side pin array and manufacturing method...

Substrate pad and die pillar design modifications to enable extreme...

Sintering a nanoparticle paste for semiconductor chip join

Fine pitch copper pillar package and method

Pre-molded leadframes in semiconductor devices

Manufacturing method of an electronic apparatus

Antenna with graded dielectirc and method of making the same

Leadframes in semiconductor devices

Selective underfill assembly and method therefor

Low cost package warpage solution

Reflow method and system

Method for manufacturing display panel, display panel, and display...

Semiconductor package and method of manufacturing the same

Semiconductor package and method of fabricating the same

Semiconductor wafer and method of ball drop on thin wafer with edge...

Solder reflow apparatus and method of manufacturing an electronic d...

Semiconductor device assembly with die support structures

Light-emitting device and displayer

Thermal management solutions for embedded integrated circuit devices

Warpage control in the packaging of integrated circuits

Patents Applicationslast 30 patents

THERMAL INTERCONNECT FOR INTEGRATED CIRCUITRY

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...

INTEGRATED CIRCUIT PACKAGE AND METHOD

SEMICONDUCTOR DEVICE AND PROCESS WITH CRACK REDUCTION

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

Advanced Device Assembly Structures And Methods

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Inter-Terminal Die-to-Die Attachment

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR DEVICE ASSEMBLY WITH PRE-REFLOWED SOLDER

DEVICE COMPRISING STACKED THROUGH ENCAPSULATION VIA INTERCONNECTS

SEMICONDUCTOR DEVICE

APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTILEVEL PACKAGE SUBSTRATE FOR INTERLEVEL DIELECTRIC CRACK MITIGA...

POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

BUMP LANDING WITH BOND WIRES FOR IMPROVED SOLDER WETTING

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS