Bonding techniques

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H01L2224/818

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/818Bonding techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,368,132
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit packages
- Patent number 12,368,146
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
- Patent number 12,363,878
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die dipping structure
- Patent number 12,362,317
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Chun Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with underfill
- Patent number 12,362,196
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated gold contacting metal
- Patent number 12,363,877
- Issue date Jul 15, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with ball grid array connection having improv...
- Patent number 12,362,307
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package substrate with embedded trace subst...
- Patent number 12,354,935
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
- Patent number 12,356,553
- Issue date Jul 8, 2025
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 12,347,802
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
- Patent number 12,347,800
- Issue date Jul 1, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Ken Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump to package substrate solder joint
- Patent number 12,341,126
- Issue date Jun 24, 2025
- Texas Instruments Incorporated
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,341,106
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die RF circuits and package method thereof
- Patent number 12,341,133
- Issue date Jun 24, 2025
- Chengdu Sicore Semiconductor Corp. Ltd.
- Cemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, preparation method, and electronic device
- Patent number 12,341,116
- Issue date Jun 24, 2025
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and related inner lead bonding method
- Patent number 12,334,470
- Issue date Jun 17, 2025
- Sitronix Technology Corp.
- Ying-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,327,796
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit packages and fabrication methods using bond-on-pad (BoP) su...
- Patent number 12,322,690
- Issue date Jun 3, 2025
- Avago Technologies International Sales Pte. Limited
- Wen-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,315,785
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic device with reduced substrate wa...
- Patent number 12,315,741
- Issue date May 27, 2025
- Innolux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 12,315,855
- Issue date May 27, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
- Patent number 12,300,591
- Issue date May 13, 2025
- Regents of The University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
- Patent number 12,300,651
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Pei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package with internal gull wing lead structures
- Patent number 12,300,586
- Issue date May 13, 2025
- NXP USA, INC.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar, method for manufacturing the same, and method fo...
- Patent number 12,293,983
- Issue date May 6, 2025
- DIC Corporation
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250233119
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ATTACHED ENGINEERED SOLDERS FOR ULTRA-LOW RESIDUE SOLDERING
- Publication number 20250226358
- Publication date Jul 10, 2025
- The Indium Corporation of America
- Joseph M. Hertline
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
- Publication number 20250226365
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250219018
- Publication date Jul 3, 2025
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250219001
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JongTae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY HAVING POST CONNECTS WITH SOLDER-BASED J...
- Publication number 20250218991
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
- Publication number 20250210608
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210576
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250201762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflowable Vapor Chamber Lid
- Publication number 20250201663
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Alaba Bamido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
- Publication number 20250201761
- Publication date Jun 19, 2025
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...
- Publication number 20250201720
- Publication date Jun 19, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201747
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Shiun Sheu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192071
- Publication date Jun 12, 2025
- Samsung Electronics Co.,Ltd.
- Chengjing ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
- Publication number 20250194118
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
- Publication number 20250183090
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jezreel Duane Aquino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION
- Publication number 20250183111
- Publication date Jun 5, 2025
- Joby Aero, Inc.
- Robert Ramm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE
- Publication number 20250183129
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ashok Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS
- Publication number 20250174590
- Publication date May 29, 2025
- Canon Kabushiki Kaisha
- HIROSHI FUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
- Publication number 20250167007
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
- Publication number 20250167142
- Publication date May 22, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS

Bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Joint structure in semiconductor package and manufacturing method t...

Hybrid integrated circuit packages

Semiconductor chip package having underfill material surrounding a...

Thermocompression bonding with passivated silver-based contacting m...

Package structure

Semiconductor die dipping structure

Package structure with underfill

Thermocompression bonding with passivated gold contacting metal

Semiconductor package with ball grid array connection having improv...

Integrated circuit (IC) package substrate with embedded trace subst...

Thermocompression bonding with passivated tin-based contacting metal

Die corner removal for underfill crack suppression in semiconductor...

Method of fabricating a conductive layer on an IC using non-lithogr...

Bump to package substrate solder joint

Package structure

Stacked die RF circuits and package method thereof

Chip package structure, preparation method, and electronic device

Chip packaging structure and related inner lead bonding method

Architecture for computing system package

Semiconductor device and method of forming microelectromechanical s...

Circuit packages and fabrication methods using bond-on-pad (BoP) su...

Semiconductor device package

Wiring board, semiconductor device, and method of manufacturing wir...

Method of manufacturing electronic device with reduced substrate wa...

Display device and method for manufacturing the same

Devices with conductive or magnetic nanowires for localized heating...

Electronic device, package structure and electronic manufacturing m...

Leadless semiconductor package with internal gull wing lead structures

Conductive pillar, method for manufacturing the same, and method fo...

Integrated circuit package and method of forming same

Patents Applicationslast 30 patents

Semiconductor Packages and Methods of Forming Same

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Semiconductor Device and Method of Making a Molded IPD-CoW

PRE-ATTACHED ENGINEERED SOLDERS FOR ULTRA-LOW RESIDUE SOLDERING

INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

FLIP CHIP PACKAGE ASSEMBLY HAVING POST CONNECTS WITH SOLDER-BASED J...

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

Reflowable Vapor Chamber Lid

SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGE

INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING

POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION

THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE

SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS