Membership
Tour
Register
Log in
Bonding techniques
Follow
Industry
CPC
H01L2224/818
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/818
Bonding techniques
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
12,255,167
Issue date
Mar 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical transceiver and manufacturing method thereof
Patent number
12,253,729
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding using metastable gas atoms
Patent number
12,245,379
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
Patent number
12,245,380
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
Patent number
12,243,840
Issue date
Mar 4, 2025
Samtec, Inc.
Edwin Loy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,243,843
Issue date
Mar 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
Patent number
12,245,381
Issue date
Mar 4, 2025
SET North America, LLC
Eric Frank Schulte
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible electronic structure including a support element
Patent number
12,237,289
Issue date
Feb 25, 2025
PRAGMATIC SEMICONDUCTOR LIMITED
Brian Cobb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flip chip laser bonding system
Patent number
12,237,295
Issue date
Feb 25, 2025
PROTEC CO., LTD.
Geunsik Ahn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrates with solder barriers on leads
Patent number
12,237,249
Issue date
Feb 25, 2025
Texas Instruments Incorporated
Bernardo Gallegos
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board with bridge chiplets
Patent number
12,238,872
Issue date
Feb 25, 2025
Advanced Micro Devices, Inc.
Robert N. McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,237,239
Issue date
Feb 25, 2025
Amkor Technology Singapore Holding Pte Ltd.
Jin Young Khim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having through parts of different shapes
Patent number
12,230,600
Issue date
Feb 18, 2025
Fuji Electric Co., Ltd.
Narumi Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package device
Patent number
12,230,558
Issue date
Feb 18, 2025
Innolux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
Patent number
12,224,182
Issue date
Feb 11, 2025
Lumileds, LLC
Tze Yang Hin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mixed hybrid bonding structures and methods of forming the same
Patent number
12,224,261
Issue date
Feb 11, 2025
Intel Corporation
Shawna Liff
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for transferring electronic device
Patent number
12,224,263
Issue date
Feb 11, 2025
MICRAFT SYSTEM PLUS CO., LTD.
Yu-Min Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip package structure having molding layer
Patent number
12,218,095
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier structures between external electrical connectors
Patent number
12,218,035
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chun Miao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive member cavities
Patent number
12,205,871
Issue date
Jan 21, 2025
Texas Instruments Incorporated
Rafael Jose Lizares Guevara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with intermetallic-compound solder-joint comp...
Patent number
12,206,056
Issue date
Jan 21, 2025
Electronics and Telecommunications Research Institute
Kwang-Seong Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
Patent number
12,207,569
Issue date
Jan 21, 2025
Rigetti & Co, LLC
Jayss Daniel Marshall
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electronic device with top side pin array and manufacturing method...
Patent number
12,205,827
Issue date
Jan 21, 2025
Amkor Technology Singapore Holding Pte Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
Patent number
12,199,064
Issue date
Jan 14, 2025
NXP USA, INC.
Kabir Mirpuri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering a nanoparticle paste for semiconductor chip join
Patent number
12,199,059
Issue date
Jan 14, 2025
International Business Machines Corporation
Katsuyuki Sakuma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fine pitch copper pillar package and method
Patent number
12,191,241
Issue date
Jan 7, 2025
Amkor Technology Singapore Holding Pte Ltd.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-molded leadframes in semiconductor devices
Patent number
12,191,273
Issue date
Jan 7, 2025
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of an electronic apparatus
Patent number
12,191,277
Issue date
Jan 7, 2025
INNOLUX CORPORATION
Ming-Chang Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna with graded dielectirc and method of making the same
Patent number
12,191,571
Issue date
Jan 7, 2025
Intel Corporation
Saravana Maruthamuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframes in semiconductor devices
Patent number
12,183,703
Issue date
Dec 31, 2024
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...
Publication number
20250105162
Publication date
Mar 27, 2025
JCET STATS ChipPAC Korea Limited
SeungHyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250105169
Publication date
Mar 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Leu-Jen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE...
Publication number
20250105203
Publication date
Mar 27, 2025
Samsung Electronics Co., Ltd.
Kyung Deuk MIN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY MODULE COMPRISING MICRO LIGHT EMITTING DIODE
Publication number
20250096177
Publication date
Mar 20, 2025
SAMSUNG ELECTRONICS CO,. LTD.
Yoonsuk LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
Publication number
20250096009
Publication date
Mar 20, 2025
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
Publication number
20250087611
Publication date
Mar 13, 2025
QUALCOMM Incorporated
Yujen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
Publication number
20250087625
Publication date
Mar 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Young WANG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC CHIP WITH CONNECTING PILLARS FOR SINTERING ASSEMBLY
Publication number
20250087610
Publication date
Mar 13, 2025
Commissariat a I'Energie Atomique et aux Energies Alternatives
Céline Feautrier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...
Publication number
20250087626
Publication date
Mar 13, 2025
ASTI GLOBAL INC., TAIWAN
Chien-Shou Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20250087618
Publication date
Mar 13, 2025
Advanced Semiconductor Engineering, Inc.
Shih-Chieh TANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
Publication number
20250079376
Publication date
Mar 6, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
Publication number
20250079290
Publication date
Mar 6, 2025
Shinko Electric Industries Co., Ltd.
Yuki KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REFLOW METHOD AND SYSTEM
Publication number
20250070077
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Shiuan Wong
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250069995
Publication date
Feb 27, 2025
Realtek Semiconductor Corp.
Nai-Jen Hsuan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE WITH EMBEDDED INTERCONNECT STRUCTURE
Publication number
20250070034
Publication date
Feb 27, 2025
QUALCOMM Incorporated
Kuiwon KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
Publication number
20250070071
Publication date
Feb 27, 2025
LAPIS Technology Co., Ltd.
Daisuke TAKAGI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME
Publication number
20250069965
Publication date
Feb 27, 2025
QUALCOMM Incorporated
Ryan LANE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...
Publication number
20250062300
Publication date
Feb 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chan-Hong CHERN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL INTERCONNECT FOR INTEGRATED CIRCUITRY
Publication number
20250062182
Publication date
Feb 20, 2025
Telefonaktiebolaget LM Ericsson (publ)
Emil NYLANDER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
Publication number
20250062263
Publication date
Feb 20, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. SEDDON
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...
Publication number
20250054914
Publication date
Feb 13, 2025
MICROCHIP TECHNOLOGY INCORPORATED
Mankit Lam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20250054915
Publication date
Feb 13, 2025
Samsung Electronics Co., Ltd.
HYUNSOO CHUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYERED OBJECT, IMAGING...
Publication number
20250054895
Publication date
Feb 13, 2025
Sekisui Chemical Co., Ltd
Taro SHIOJIMA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20250046753
Publication date
Feb 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PROCESS WITH CRACK REDUCTION
Publication number
20250046733
Publication date
Feb 6, 2025
TEXAS INSTRUMENTS INCORPORATED
Jaimal Mallory Willamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
Publication number
20250046750
Publication date
Feb 6, 2025
Samsung Electronics Co., Ltd.
Youngja KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Publication number
20250033132
Publication date
Jan 30, 2025
Samsung Electronics Co., Ltd.
Youngja KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Advanced Device Assembly Structures And Methods
Publication number
20250033138
Publication date
Jan 30, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
Publication number
20250038059
Publication date
Jan 30, 2025
JCET STATS ChipPAC Korea Limited
HyeonChul LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250038042
Publication date
Jan 30, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Michael G. Kelly
H01 - BASIC ELECTRIC ELEMENTS