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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Patents Grants
last 30 patents
Information
Patent Grant
Joint structure in semiconductor package and manufacturing method t...
Patent number
12,368,132
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid integrated circuit packages
Patent number
12,368,146
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package having underfill material surrounding a...
Patent number
12,368,127
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated silver-based contacting m...
Patent number
12,363,878
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
12,362,309
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die dipping structure
Patent number
12,362,317
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Chun Peng
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package structure with underfill
Patent number
12,362,196
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated gold contacting metal
Patent number
12,363,877
Issue date
Jul 15, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with ball grid array connection having improv...
Patent number
12,362,307
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit (IC) package substrate with embedded trace subst...
Patent number
12,354,935
Issue date
Jul 8, 2025
QUALCOMM Incorporated
Kuiwon Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermocompression bonding with passivated tin-based contacting metal
Patent number
12,356,553
Issue date
Jul 8, 2025
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
12,347,802
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a conductive layer on an IC using non-lithogr...
Patent number
12,347,800
Issue date
Jul 1, 2025
PRAGMATIC SEMICONDUCTOR LIMITED
Ken Williamson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump to package substrate solder joint
Patent number
12,341,126
Issue date
Jun 24, 2025
Texas Instruments Incorporated
Dolores Milo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
12,341,106
Issue date
Jun 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Wen Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die RF circuits and package method thereof
Patent number
12,341,133
Issue date
Jun 24, 2025
Chengdu Sicore Semiconductor Corp. Ltd.
Cemin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure, preparation method, and electronic device
Patent number
12,341,116
Issue date
Jun 24, 2025
Huawei Technologies Co., Ltd.
Chaojun Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging structure and related inner lead bonding method
Patent number
12,334,470
Issue date
Jun 17, 2025
Sitronix Technology Corp.
Ying-Chen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture for computing system package
Patent number
12,327,796
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming microelectromechanical s...
Patent number
12,319,564
Issue date
Jun 3, 2025
STATS ChipPAC Pte. Ltd.
Yaojian Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Circuit packages and fabrication methods using bond-on-pad (BoP) su...
Patent number
12,322,690
Issue date
Jun 3, 2025
Avago Technologies International Sales Pte. Limited
Wen-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package
Patent number
12,315,785
Issue date
May 27, 2025
Advanced Semiconductor Engineering, Inc.
Yu-Ying Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
Patent number
12,317,416
Issue date
May 27, 2025
Kioxia Corporation
Tomonori Kawata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing electronic device with reduced substrate wa...
Patent number
12,315,741
Issue date
May 27, 2025
Innolux Corporation
Chuan-Ming Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method for manufacturing the same
Patent number
12,315,855
Issue date
May 27, 2025
Japan Display Inc.
Kenichi Takemasa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices with conductive or magnetic nanowires for localized heating...
Patent number
12,300,591
Issue date
May 13, 2025
Regents of The University of Minnesota
Bethanie J Stadler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device, package structure and electronic manufacturing m...
Patent number
12,300,651
Issue date
May 13, 2025
Advanced Semiconductor Engineering, Inc.
Pei-Jen Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless semiconductor package with internal gull wing lead structures
Patent number
12,300,586
Issue date
May 13, 2025
NXP USA, INC.
Pat Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive pillar, method for manufacturing the same, and method fo...
Patent number
12,293,983
Issue date
May 6, 2025
DIC Corporation
Ryota Yamaguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
12,294,002
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20250233115
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20250233119
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Shang-Yun Hou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
Publication number
20250226334
Publication date
Jul 10, 2025
STATS ChipPAC Pte Ltd.
Kai Chong Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-ATTACHED ENGINEERED SOLDERS FOR ULTRA-LOW RESIDUE SOLDERING
Publication number
20250226358
Publication date
Jul 10, 2025
The Indium Corporation of America
Joseph M. Hertline
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING IMPEDANCE ADAPTER
Publication number
20250226365
Publication date
Jul 10, 2025
QUALCOMM Incorporated
Je-Hsiung LAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
Publication number
20250226269
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing company Ltd.
MING-CHUNG WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
Publication number
20250218998
Publication date
Jul 3, 2025
Intel Corporation
Bohan SHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20250219010
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
Publication number
20250219018
Publication date
Jul 3, 2025
Yibu Semiconductor Co., Ltd.
Yifan Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
Publication number
20250219001
Publication date
Jul 3, 2025
STATS ChipPAC Pte Ltd.
JongTae KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP PACKAGE ASSEMBLY HAVING POST CONNECTS WITH SOLDER-BASED J...
Publication number
20250218991
Publication date
Jul 3, 2025
TEXAS INSTRUMENTS INCORPORATED
Rafael Jose Lizares GUEVARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
Publication number
20250210608
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Lipu Kris Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250210576
Publication date
Jun 26, 2025
Samsung Electronics Co., Ltd.
Youngbae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
Publication number
20250201762
Publication date
Jun 19, 2025
Samsung Electronics Co., Ltd.
Sungmin MOON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Reflowable Vapor Chamber Lid
Publication number
20250201663
Publication date
Jun 19, 2025
Marvell Asia Pte Ltd.
Alaba Bamido
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNING SEMICONDUCTOR CONSTRUCTION
Publication number
20250201761
Publication date
Jun 19, 2025
Intel Corporation
Carlton Hanna
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250201753
Publication date
Jun 19, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE...
Publication number
20250201720
Publication date
Jun 19, 2025
Intel Corporation
Minglu Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250201747
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzu-Shiun Sheu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
Publication number
20250203773
Publication date
Jun 19, 2025
Micron Technology, Inc.
Kelvin Aik Boo TAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250192071
Publication date
Jun 12, 2025
Samsung Electronics Co.,Ltd.
Chengjing ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER WITH MIM CAPACITOR AND FABRICATING METHOD OF THE SAME
Publication number
20250194118
Publication date
Jun 12, 2025
UNITED MICROELECTRONICS CORP.
Da-Jun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
Publication number
20250183217
Publication date
Jun 5, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING
Publication number
20250183090
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Jezreel Duane Aquino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER-ELECTRONICS PACKAGING, INTERFACE AND CONFIGURATION
Publication number
20250183111
Publication date
Jun 5, 2025
Joby Aero, Inc.
Robert Ramm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE
Publication number
20250183129
Publication date
Jun 5, 2025
TEXAS INSTRUMENTS INCORPORATED
Ashok Prabhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS
Publication number
20250174590
Publication date
May 29, 2025
Canon Kabushiki Kaisha
HIROSHI FUSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
Publication number
20250167007
Publication date
May 22, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Devarajan Balaraman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
Publication number
20250167158
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu JENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
Publication number
20250167142
Publication date
May 22, 2025
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS