Bonding techniques

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CPC
H01L2224/818

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/818Bonding techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,170,260
- Issue date Dec 17, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,159,858
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device assembly with die support structures
- Patent number 12,148,727
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for embedded integrated circuit devices
- Patent number 12,142,543
- Issue date Nov 12, 2024
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of soldering a semiconductor chip to a chip carrier
- Patent number 12,132,017
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge interconnection with layered interconnect structures
- Patent number 12,132,002
- Issue date Oct 29, 2024
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pre-reflowed solder
- Patent number 12,132,027
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package structure
- Patent number 12,125,760
- Issue date Oct 22, 2024
- Richwave Technology Corp.
- Yu-Lung Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for fabricating the same
- Patent number 12,125,838
- Issue date Oct 22, 2024
- Samsung Display Co., Ltd.
- Seung Geun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low pressure sintering powder
- Patent number 12,113,039
- Issue date Oct 8, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
- Patent number 12,107,065
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,064
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 12,107,035
- Issue date Oct 1, 2024
- Amkor Technology Singapore Holdings Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing same
- Patent number 12,100,680
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members for die attach in flip chip packages
- Patent number 12,100,678
- Issue date Sep 24, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20240421113
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421130
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PRESSURE SINTERING POWDER
- Publication number 20240413117
- Publication date Dec 12, 2024
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES
- Publication number 20240413105
- Publication date Dec 12, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
- Publication number 20240413114
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240413028
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-LAYER INTERCONNECT PILLAR
- Publication number 20240413112
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE PACKAGE DATA STORAGE DEVICE
- Publication number 20240407180
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- Fei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Interconnect Bridge wi...
- Publication number 20240404956
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- YongTaek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF
- Publication number 20240404958
- Publication date Dec 5, 2024
- Nexperia Technology (Shanghai) Ltd.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH STACKED INTERPOSER
- Publication number 20240395787
- Publication date Nov 28, 2024
- Microsoft Technology Licensing, LLC
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION
- Publication number 20240395768
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Jiexiong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395744
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20240387496
- Publication date Nov 21, 2024
- 1372934 B.C. Ltd.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
- Publication number 20240387491
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...
- Publication number 20240387785
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF
- Publication number 20240385398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
- Publication number 20240387386
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package and method of fabricating the same

Semiconductor wafer and method of ball drop on thin wafer with edge...

Solder reflow apparatus and method of manufacturing an electronic d...

Semiconductor device assembly with die support structures

Light-emitting device and displayer

Thermal management solutions for embedded integrated circuit devices

Warpage control in the packaging of integrated circuits

Semiconductor packages and methods of forming same

Tools and systems for processing semiconductor devices, and methods...

Integrated chip for standard logic performance improvement having a...

Semiconductor device package and manufacturing method thereof

Method of soldering a semiconductor chip to a chip carrier

Bridge interconnection with layered interconnect structures

Semiconductor device assembly with pre-reflowed solder

Method for fabricating electronic package structure

Display device and method for fabricating the same

Patterned and planarized under-bump metallization

Semiconductor bonding structures and methods

Semiconductor device and method of manufacturing semiconductor device

Multi-chip package and method of providing die-to-die interconnects...

Semiconductor package and manufacturing method thereof

Low pressure sintering powder

Semiconductor package with dual sides of metal routing

Method for manufacturing a structure

Uniform chip gaps via injection-molded solder pillars

Semiconductor package and manufacturing method thereof

Semiconductor device with a semiconductor die embedded between an e...

Semiconductor structure and method for preparing same

Conductive members for die attach in flip chip packages

Patents Applicationslast 30 patents

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

LOW PRESSURE SINTERING POWDER

CONDUCTIVE LINES FOR INTERCONNECTION IN STACKED DEVICE STRUCTURES

CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES

DIE STRUCTURES AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-LAYER INTERCONNECT PILLAR

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

SINGLE PACKAGE DATA STORAGE DEVICE

Semiconductor Device and Method of Making an Interconnect Bridge wi...

POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

THROUGH-HOLE ELECTRODE SUBSTRATE

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

INTEGRATED CIRCUIT WITH STACKED INTERPOSER

MULTI-VIEW DEPTH ESTIMATION LEVERAGING OFFLINE STRUCTURE-FROM-MOTION

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

SEMICONDUCTOR DEVICE WITH TRANSMISSIVE LAYER AND MANUFACTURING METH...

OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF

Fingerprint Sensor Device and Method

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

Method for Forming a Semiconductor Device Having TSV Formed Through...

INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...