Bonding techniques

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H01L2224/838

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/838Bonding techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pressing group for a sintering press for sintering electronic compo...
- Patent number 12,257,801
- Issue date Mar 25, 2025
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 12,261,144
- Issue date Mar 25, 2025
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joined structure, joining method, and joining material
- Patent number 12,257,650
- Issue date Mar 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiro Kumakawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,249,578
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,249,591
- Issue date Mar 11, 2025
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device including an optical path structure aligned to an o...
- Patent number 12,248,178
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,243,861
- Issue date Mar 4, 2025
- LG Electronics Inc.
- Dohan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuits including micropatterns and using partial curing to adhere...
- Patent number 12,237,292
- Issue date Feb 25, 2025
- 3M Innovative Properties Company
- Teresa M. Goeddel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic structure including a support element
- Patent number 12,237,289
- Issue date Feb 25, 2025
- PRAGMATIC SEMICONDUCTOR LIMITED
- Brian Cobb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,237,240
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method therefor
- Patent number 12,218,295
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,088
- Issue date Feb 4, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and method
- Patent number 12,211,820
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-I Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient liquid phase bonding compositions and power electronics a...
- Patent number 12,208,448
- Issue date Jan 28, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogenous bonding layers for direct semiconductor bonding
- Patent number 12,205,921
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal control of a hybrid chip assembly
- Patent number 12,205,920
- Issue date Jan 21, 2025
- Ciena Corporation
- Raphael Beaupré-Laflamme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 12,191,267
- Issue date Jan 7, 2025
- Adeia Semiconductor Technologies, LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 12,183,655
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 12,176,334
- Issue date Dec 24, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...
- Publication number 20250105103
- Publication date Mar 27, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105198
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Heiming Shiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT
- Publication number 20250096082
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Mei Yih Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...
- Publication number 20250092293
- Publication date Mar 20, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroshi OGINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...
- Publication number 20250096035
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Chiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20250096168
- Publication date Mar 20, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20250084286
- Publication date Mar 13, 2025
- OSAKA SODA CO., LTD.
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
- Publication number 20250087628
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20250087553
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250087618
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Shih-Chieh TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...
- Publication number 20250079357
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250079414
- Publication date Mar 6, 2025
- Universal Global Technology (Kunshan) Co., Ltd.
- KUO-HSIEN LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MATERIAL SYSTEM FOR HIGH STRENGTH SELECTIVE DIELECTRIC I...
- Publication number 20250079356
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079369
- Publication date Mar 6, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES AND RELATED METHODS
- Publication number 20250081647
- Publication date Mar 6, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Soon Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...
- Publication number 20250065400
- Publication date Feb 27, 2025
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- DOMINIC BIRKICHT
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT ASSEMBLY, AND A...
- Publication number 20250069987
- Publication date Feb 27, 2025
- Arieca Inc.
- Navid Kazem
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...
- Publication number 20250062169
- Publication date Feb 20, 2025
- Infineon Technologies Austria AG
- Frederik Otto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250062188
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIPPING ADHESIVE MATERIAL
- Publication number 20250062276
- Publication date Feb 20, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jung Ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING ADHESIVE REFLOW FOR TRANSFER PRINTING
- Publication number 20250046751
- Publication date Feb 6, 2025
- X Display Company Technology Limited
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BONDING ON AuSn BASIS WITH LOW BONDING TEMPERATURE
- Publication number 20250046748
- Publication date Feb 6, 2025
- ams-OSRAM International GmbH
- Klaus MUELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressing group for a sintering press for sintering electronic compo...

Semiconductor device and method for fabricating a semiconductor device

Joined structure, joining method, and joining material

Semiconductor packages with an intermetallic layer

Electronic device with multi-layer contact and system

Semiconductor package structure and method for manufacturing the same

Display device and method of manufacturing the same

Packaged device including an optical path structure aligned to an o...

Packaged electronic device with film isolated power stack

Integrated circuit package and method of forming same

Display device using micro LED, and manufacturing method therefor

3D semiconductor device and structure with metal layers and memory...

Circuits including micropatterns and using partial curing to adhere...

Flexible electronic structure including a support element

Semiconductor package and method of manufacturing semiconductor pac...

Mixed hybrid bonding structures and methods of forming the same

Micro LED display and manufacturing method therefor

Semiconductor device

Wafer bonding apparatus and method

Transient liquid phase bonding compositions and power electronics a...

Submodule semiconductor package

Heterogenous bonding layers for direct semiconductor bonding

Semiconductor package and method for fabricating a semiconductor pa...

Enhanced thermal control of a hybrid chip assembly

Selective micro device transfer to receiver substrate

Nanowire bonding interconnect for fine-pitch microelectronics

Semiconductor package having a high reliability

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor device

Method for manufacturing display panel, display panel, and display...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING ONE OR MORE SOLDER JOINTS ELECTRICA...

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CLIP

INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT

METHOD FOR PRODUCING AN ADHESIVE COMPOSITION FOR OPTICAL IRRADIATIO...

FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

ELECTROCONDUCTIVE ADHESIVE

METHOD OF SURFACE MODIFICATION FOR WAFER BONDING

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

PACKAGE STRUCTURE

METHODS AND STRUCTURES FOR HIGH STRENGTH ASYMMETRIC DIELECTRIC IN H...

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

METHOD AND MATERIAL SYSTEM FOR HIGH STRENGTH SELECTIVE DIELECTRIC I...

SEMICONDUCTOR DEVICE

IMAGE SENSOR PACKAGES AND RELATED METHODS

SINTERING PRESS AND PRESSURE SINTERING METHOD FOR PRODUCING A SINTE...

DUAL SWITCHING POWER DEVICE

A THERMAL INTERFACE MATERIAL, AN INTEGRATED CIRCUIT ASSEMBLY, AND A...

APPLICATION OF A PROTECTIVE ATOMIC LAYER DEPOSITION (ALD) OR PLASMA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD OF THE SAME

METHOD FOR DIPPING ADHESIVE MATERIAL

CONTROLLING ADHESIVE REFLOW FOR TRANSFER PRINTING

SOLDER BONDING ON AuSn BASIS WITH LOW BONDING TEMPERATURE

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

Heat Dissipating Structure and Methods of Forming The Same

SEMICONDUCTOR PACKAGE

Advanced Device Assembly Structures And Methods