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SEMICONDUCTOR PACKAGE
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Publication number 20240162184
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Publication date May 16, 2024
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Samsung Electronics Co., Ltd.
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Sang-Sick Park
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H01 - BASIC ELECTRIC ELEMENTS
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CONNECTING ARRANGEMENT
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Publication number 20240155766
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Publication date May 9, 2024
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ROBERT BOSCH GmbH
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Guenter Gera
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H01 - BASIC ELECTRIC ELEMENTS
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JOINT STRUCTURE
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Publication number 20240149340
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Publication date May 9, 2024
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Mitsui Mining and Smelting Co., Ltd.
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Shinichi YAMAUCHI
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B22 - CASTING POWDER METALLURGY
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HOT VIA DIE ATTACH JETTING
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Publication number 20240153909
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Publication date May 9, 2024
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MACOM Technology Solutions Holdings, Inc.
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Novak Farrington
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H01 - BASIC ELECTRIC ELEMENTS
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COMPOSITE COMPONENT
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Publication number 20240136268
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Publication date Apr 25, 2024
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Murata Manufacturing Co., Ltd.
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Yoshiaki SATAKE
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H01 - BASIC ELECTRIC ELEMENTS
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-
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-
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SEMICONDUCTOR PACKAGE
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Publication number 20240120354
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Publication date Apr 11, 2024
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SAMSUNG ELECTRONICS CO,. LTD.
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Kyong Soon CHO
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H01 - BASIC ELECTRIC ELEMENTS
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-
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SEMICONDUCTOR DEVICE
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Publication number 20240105561
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Publication date Mar 28, 2024
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Kabushiki Kaisha Toshiba
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Fumiyoshi KAWASHIRO
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H01 - BASIC ELECTRIC ELEMENTS
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DOCUMENT STRUCTURE FORMATION
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Publication number 20240105669
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Publication date Mar 28, 2024
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INFINEON TECHNOLOGIES AG
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Jens Pohl
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H01 - BASIC ELECTRIC ELEMENTS
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-
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Integrated Circuit Package and Method
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Publication number 20240088123
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Chen-Hua Yu
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H01 - BASIC ELECTRIC ELEMENTS