Bonding techniques

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CPC
H01L2224/828

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/828Bonding techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method to electrically connect chip with top connectors using 3D pr...
- Patent number 12,046,575
- Issue date Jul 23, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 12,021,054
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electrically conductive connection on a sub...
- Patent number 11,855,037
- Issue date Dec 26, 2023
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,848,304
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) layouts for integrated circuits
- Patent number 11,791,299
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting and packetising a semiconductor chip
- Patent number 11,749,638
- Issue date Sep 5, 2023
- Technische Universität Chemnitz
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip scale packaging structure having a rewiring layer...
- Patent number 11,735,554
- Issue date Aug 22, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Chenguang Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bridged fanout chiplet connectivity
- Patent number 11,658,123
- Issue date May 23, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,631,594
- Issue date Apr 18, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out structure for light-emitting diode (LED) device and lightin...
- Patent number 11,621,173
- Issue date Apr 4, 2023
- Lumileds LLC
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,410,968
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,362,057
- Issue date Jun 14, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
- Patent number 11,355,443
- Issue date Jun 7, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for wafer to wafer bonding
- Patent number 11,335,607
- Issue date May 17, 2022
- Tokyo Electron Limited
- Nathan Ip
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 11,282,771
- Issue date Mar 22, 2022
- Shinko Electric Industries Co., Ltd.
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engineered substrate with embedded mirror
- Patent number 11,251,321
- Issue date Feb 15, 2022
- Soitec
- Eric Guiot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcontroller unit and fabrication method thereof
- Patent number 11,056,476
- Issue date Jul 6, 2021
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Ying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing same
- Patent number 10,932,386
- Issue date Feb 23, 2021
- Dyconex AG
- Marc Hauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic device having an under-fill element, a mounting method o...
- Patent number 10,910,338
- Issue date Feb 2, 2021
- Samsung Display Co., Ltd.
- Jeonghun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,854,574
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and fixture for chip attachment to physical objects
- Patent number 10,847,384
- Issue date Nov 24, 2020
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 10,734,351
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal bonds with recesses
- Patent number 10,685,935
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,586,746
- Issue date Mar 10, 2020
- CHIP SOLUTIONS, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20240063177
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer (RDL) Layouts for Integrated Circuits
- Publication number 20230378116
- Publication date Nov 23, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...
- Publication number 20230369292
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Shan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING THREE-DIMENSIONAL SYSTEM-ON-CHIP AND THREE-...
- Publication number 20220375918
- Publication date Nov 24, 2022
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20220359460
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20220278048
- Publication date Sep 1, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND BONDED WAFER
- Publication number 20220189822
- Publication date Jun 16, 2022
- Yangtze Memory Technologies Co., Ltd.
- Chao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Contacting and Packetising a Semiconductor Chip
- Publication number 20220181291
- Publication date Jun 9, 2022
- TECHNISCHE UNIVERSITAT CHEMNITZ
- Johannes Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY
- Publication number 20220102276
- Publication date Mar 31, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220102604
- Publication date Mar 31, 2022
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGING STRUCTURE AND METHOD FOR MANUFACTU...
- Publication number 20220052011
- Publication date Feb 17, 2022
- SJ Semiconductor (Jiangyin) Corporation
- Chenguang YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Wafer to Wafer Bonding
- Publication number 20220013416
- Publication date Jan 13, 2022
- TOKYO ELECTRON LIMITED
- Nathan Ip
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...
- Publication number 20210358880
- Publication date Nov 18, 2021
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210118839
- Publication date Apr 22, 2021
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20210118844
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Cimpany, Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...
- Publication number 20200350275
- Publication date Nov 5, 2020
- IO TECH GROUP LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROCONTROLLER UNIT AND FABRICATION METHOD THEREOF
- Publication number 20200212028
- Publication date Jul 2, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Ying Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20200152556
- Publication date May 14, 2020
- Shinko Electric Industries Co., Ltd.
- Takayuki Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal Bonds with Recesses
- Publication number 20200006288
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20190341350
- Publication date Nov 7, 2019
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) LAYOUTS FOR INTEGRATED CIRCUITS
- Publication number 20190164924
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Metal Bonds with Recesses
- Publication number 20190148336
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS
- Publication number 20190057950
- Publication date Feb 21, 2019
- Intel Corporation
- Brennen K. Mueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190058241
- Publication date Feb 21, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Won Wook SO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20180358326
- Publication date Dec 13, 2018
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE CARRIER METHOD
- Publication number 20180261489
- Publication date Sep 13, 2018
- Chip Solutions, LLC
- Sukianto Rusli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip assembling on adhesion layer or dielectric layer, extending be...
- Publication number 20170294403
- Publication date Oct 12, 2017
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS

Bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method to electrically connect chip with top connectors using 3D pr...

Redistribution layer (RDL) layouts for integrated circuits

Method for producing an electrically conductive connection on a sub...

Semiconductor device and method of forming the same

Redistribution layer (RDL) layouts for integrated circuits

Method for contacting and packetising a semiconductor chip

Wafer-level chip scale packaging structure having a rewiring layer...

Hybrid bridged fanout chiplet connectivity

Fan out structure for light-emitting diode (LED) device and lightin...

Fan out structure for light-emitting diode (LED) device and lightin...

Multi-die package with bridge layer

Semiconductor device and method of forming the same

Chip package structure and manufacturing method thereof

Dielets on flexible and stretchable packaging for microelectronics

Apparatus and methods for wafer to wafer bonding

Chip assembling on adhesion layer or dielectric layer, extending be...

Electronic component and method of manufacturing electronic component

Engineered substrate with embedded mirror

Bare die integration with printed components on flexible substrate...

Method for producing an electric circuit comprising a circuit carri...

Microcontroller unit and fabrication method thereof

Electronic module and method for producing same

Electronic device having an under-fill element, a mounting method o...

Forming metal bonds with recesses

Method and fixture for chip attachment to physical objects

Chip assembling on adhesion layer or dielectric layer, extending be...

Forming metal bonds with recesses

Methods for making multi-die package with bridge layer

Semiconductor device and method

System and method for the fluidic assembly of micro-LEDs utilizing...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming the Same

Redistribution Layer (RDL) Layouts for Integrated Circuits

CHIP STACKING STRUCTURE AND PREPARATION METHOD THEREOF, CHIP STACKI...

METHOD OF MANUFACTURING THREE-DIMENSIONAL SYSTEM-ON-CHIP AND THREE-...

Semiconductor Device and Method of Forming the Same

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

WAFER BONDING METHOD AND BONDED WAFER

Method for Contacting and Packetising a Semiconductor Chip

HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

WAFER-LEVEL CHIP SCALE PACKAGING STRUCTURE AND METHOD FOR MANUFACTU...

Apparatus and Methods for Wafer to Wafer Bonding

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...

Methods for Making Multi-Die Package With Bridge Layer

MICROCONTROLLER UNIT AND FABRICATION METHOD THEREOF

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

Forming Metal Bonds with Recesses

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

REDISTRIBUTION LAYER (RDL) LAYOUTS FOR INTEGRATED CIRCUITS

Forming Metal Bonds with Recesses

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

PERMANENT FUNCTIONAL CARRIER SYSTEMS AND METHODS

FAN-OUT SEMICONDUCTOR PACKAGE

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

RELEASABLE CARRIER METHOD

Chip assembling on adhesion layer or dielectric layer, extending be...