Bonding techniques

Industry

CPC
H01L2224/858

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/858Bonding techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
SiC semiconductor device
- Patent number 12,125,882
- Issue date Oct 22, 2024
- Rohm Co., Ltd.
- Toshio Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,027,490
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,948,911
- Issue date Apr 2, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,908,830
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a bond wire o...
- Patent number 11,837,528
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell module including solar cells
- Patent number 11,652,178
- Issue date May 16, 2023
- Panasonic Holdings Corporation
- Haruhisa Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and soldering support jig
- Patent number 11,164,846
- Issue date Nov 2, 2021
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining a micorelectronic chip to a wire element
- Patent number 11,081,466
- Issue date Aug 3, 2021
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,964,440
- Issue date Mar 30, 2021
- Dexerials Corporation
- Shinichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,531
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconducter device with filler to suppress generation of air bubb...
- Patent number 10,727,145
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Hiroyuki Harada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Bonding wire having a silver alloy core, wire bonding method using...
- Patent number 10,658,326
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Won-Gil Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing in complex quantum systems
- Patent number 10,658,340
- Issue date May 19, 2020
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for connecting inter-layer conductors and components in 3D...
- Patent number 10,660,214
- Issue date May 19, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent power module and manufacturing method thereof
- Patent number 10,615,155
- Issue date Apr 7, 2020
- Yuxiang Feng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device manufacturing method and soldering support jig
- Patent number 10,566,308
- Issue date Feb 18, 2020
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,483,446
- Issue date Nov 19, 2019
- Osram Opto Semiconductors GmbH
- Kok Eng Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink printed wire bonding
- Patent number 10,483,238
- Issue date Nov 19, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,453,771
- Issue date Oct 22, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with roughened encapsulated surface for promoting adhesion
- Patent number 10,410,949
- Issue date Sep 10, 2019
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for routing signals in complex quantum systems
- Patent number 10,347,605
- Issue date Jul 9, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Leadframe package with stable extended leads
- Patent number 10,347,569
- Issue date Jul 9, 2019
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit arrangement and method of manufacturing the same
- Patent number 10,327,333
- Issue date Jun 18, 2019
- Koninklijke Philips N.V.
- Ronald Dekker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
- Publication number 20240304607
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...
- Publication number 20240258210
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240234475
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240222349
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Kenta NAKAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20240194629
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136386
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
- Publication number 20240128215
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Takashi NOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...
- Publication number 20240079375
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hiroaki HOKAZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
- Publication number 20240014155
- Publication date Jan 11, 2024
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Wenjie HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS
- Publication number 20230098907
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- LongTing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUC...
- Publication number 20220367329
- Publication date Nov 17, 2022
- Vitesco Technologies GMBH
- Detlev Bagung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC SEMICONDUCTOR DEVICE
- Publication number 20220181447
- Publication date Jun 9, 2022
- Rohm Co., Ltd.
- Toshio NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220045031
- Publication date Feb 10, 2022
- INFINEON TECHNOLOGIES AG
- Richard Knipper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFA...
- Publication number 20210366788
- Publication date Nov 25, 2021
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210257334
- Publication date Aug 19, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR JOINING A MICORELECTRONIC CHIP TO A WIRE ELEMENT
- Publication number 20200335475
- Publication date Oct 22, 2020
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING SUPPORT JIG
- Publication number 20200135691
- Publication date Apr 30, 2020
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190287946
- Publication date Sep 19, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS
- Publication number 20190164935
- Publication date May 30, 2019
- International Business Machines Corporation
- Martin O. Sandberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190067260
- Publication date Feb 28, 2019
- Sumitomo Electric Industries, Ltd.
- Koichi KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SiC semiconductor device

Chip package, method of forming a chip package and method of formin...

Semiconductor device and method for fabricating the same

Semiconductor packaging method and semiconductor package device

Semiconductor device and method for fabricating the same

Method of manufacturing a semiconductor device having a bond wire o...

Solar cell module including solar cells

Straight wirebonding of silicon dies

Method and device for establishing a wire connection as well as a c...

Semiconductor device manufacturing method and soldering support jig

Method for joining a micorelectronic chip to a wire element

Semiconductor packages with an intermetallic layer

Method of forming an electrical contact and method of forming a chi...

Anisotropic conductive film

Solder ball, solder joint, and joining method

Semiconducter device with filler to suppress generation of air bubb...

Bonding wire having a silver alloy core, wire bonding method using...

Signal routing in complex quantum systems

Methods for connecting inter-layer conductors and components in 3D...

Intelligent power module and manufacturing method thereof

Semiconductor device manufacturing method and soldering support jig

Electronic device

Ink printed wire bonding

Chip package and method of forming a chip package with a metal cont...

Package with roughened encapsulated surface for promoting adhesion

Package with roughened encapsulated surface for promoting adhesion

Method of manufacturing a semiconductor device

System and method for routing signals in complex quantum systems

Leadframe package with stable extended leads

Electronic circuit arrangement and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

POWER MODULE

Semiconductor Device and Method of Making a Semiconductor Package w...

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...

BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...

CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

PACKAGE GEOMETRIES TO ENABLE VISUAL INSPECTION OF SOLDER FILLETS

CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUC...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

SiC SEMICONDUCTOR DEVICE

STRAIGHT WIREBONDING OF SILICON DIES

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD FOR MANUFA...

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

METHOD FOR JOINING A MICORELECTRONIC CHIP TO A WIRE ELEMENT

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SOLDERING SUPPORT JIG

SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS

SYSTEM AND METHOD FOR ROUTING SIGNALS IN COMPLEX QUANTUM SYSTEMS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME