Bonding techniques

Industry

CPC
H01L2224/868

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/868Bonding techniques

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on film and display device including the same
- Patent number 10,971,438
- Issue date Apr 6, 2021
- LG Display Co., Ltd.
- Jihun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed, high-resolution electrophysiology in-vivo using conform...
- Patent number 10,918,298
- Issue date Feb 16, 2021
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Adhesive substrate, transfer device having adhesive substrate, and...
- Patent number 10,818,618
- Issue date Oct 27, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly having an adhesion layer, and method for...
- Patent number 10,665,562
- Issue date May 26, 2020
- Semikron Elektronik GmbH & Co. KG
- Ulrich Sagebaum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,643,942
- Issue date May 5, 2020
- Compass Technology Company Limited
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heterogeneous integration of ultrathin functional block by solid ph...
- Patent number 10,522,510
- Issue date Dec 31, 2019
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of fine pitch traces using ultra-thin PAA modified fully...
- Patent number 10,468,342
- Issue date Nov 5, 2019
- Compass Technology Company, Ltd.
- Kelvin Po Leung Pun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,842,832
- Issue date Dec 12, 2017
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with chip for the high-frequency range
- Patent number 9,669,480
- Issue date Jun 6, 2017
- Rohde & Schwarz GmbH & Co. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection of microelectronic devices
- Patent number 9,397,071
- Issue date Jul 19, 2016
- Intel Corporation
- Omkar G. Karhade
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and a method for fabricating an electronic device
- Patent number 9,018,742
- Issue date Apr 28, 2015
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...
- Publication number 20230369277
- Publication date Nov 16, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME
- Publication number 20230087198
- Publication date Mar 23, 2023
- HANWHA PRECISION MACHINERY CO., LTD.
- Tae Woo KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20210327843
- Publication date Oct 21, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20180151536
- Publication date May 31, 2018
- LG Display Co., Ltd.
- Jihun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...
- Publication number 20180151541
- Publication date May 31, 2018
- Intel Corporation
- Kimin JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
- Publication number 20160300824
- Publication date Oct 13, 2016
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY
- Publication number 20150187731
- Publication date Jul 2, 2015
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component with chip for the high-frequency range
- Publication number 20150181712
- Publication date Jun 25, 2015
- ROHDE & SCHWARZ GMBH & CO. KG
- Daniel Hageneder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130187259
- Publication date Jul 25, 2013
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...
- Publication number 20120157804
- Publication date Jun 21, 2012
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Bonding techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Chip-on film and display device including the same

High-speed, high-resolution electrophysiology in-vivo using conform...

Adhesive substrate, transfer device having adhesive substrate, and...

Power electronics assembly having an adhesion layer, and method for...

Formation of fine pitch traces using ultra-thin PAA modified fully...

Heterogeneous integration of ultrathin functional block by solid ph...

Formation of fine pitch traces using ultra-thin PAA modified fully...

Discrete flexible interconnects for modules of integrated circuits

High density interconnection of microelectronic devices

Semiconductor component with chip for the high-frequency range

Methods of forming semiconductor packages with an intermetallic lay...

High density interconnection of microelectronic devices

Electronic device and a method for fabricating an electronic device

Patents Applicationslast 30 patents

LIQUID PHASE BONDING FOR ELECTRICAL INTERCONNECTS IN SEMICONDUCTOR...

HYBRID BONDING APPARATUS AND HYBRID BONDING METHOD USING THE SAME

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME

HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PH...

HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES

LOW COST CONNECTOR FOR HIGH SPEED, HIGH DENSITY SIGNAL DELIVERY

Semiconductor component with chip for the high-frequency range

Electronic Device and a Method for Fabricating an Electronic Device

High-Speed, High-Resolution Electrophysiology In-Vivo Using Conform...