Bosch process

Industry

CPC
B81C2201/0112

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2201/00Manufacture or treatment of micro-structural devices or systems

Current Industry

B81C2201/0112Bosch process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Etching method
- Patent number 12,020,942
- Issue date Jun 25, 2024
- ULVAC, Inc.
- Taichi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure forming method and device
- Patent number 11,679,976
- Issue date Jun 20, 2023
- Seiko Epson Corporation
- Shogo Inaba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a micro machined channel
- Patent number 11,629,048
- Issue date Apr 18, 2023
- Berkin B.V.
- Yiyuan Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing micromechanical structures in a device wafer
- Patent number 11,524,893
- Issue date Dec 13, 2022
- Murata Manufacturing Co., Ltd.
- Hidetoshi Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor, method for manufacturing inertial sensor, inertial...
- Patent number 11,448,506
- Issue date Sep 20, 2022
- Seiko Epson Corporation
- Koichiro Komizo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor
- Patent number 11,150,092
- Issue date Oct 19, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Imanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for multiple-patterning nanosphere lithography for fabricat...
- Patent number 11,037,794
- Issue date Jun 15, 2021
- The Regents of the University of California
- Xiaobin Xu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a stress-decoupled micromechanical pressure se...
- Patent number 10,988,377
- Issue date Apr 27, 2021
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 10,964,547
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Han Meng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertial sensor, method for manufacturing inertial sensor, inertial...
- Patent number 10,955,242
- Issue date Mar 23, 2021
- Seiko Epson Corporation
- Koichiro Komizo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and manufacturing method for making same
- Patent number 10,947,110
- Issue date Mar 16, 2021
- AAC Technologies Pte. Ltd.
- Lieng Loo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing micromechanical structures in a device wafer
- Patent number 10,807,863
- Issue date Oct 20, 2020
- Murata Manufacturing Co., Ltd.
- Hidetoshi Fujii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating laterally insulated integrated circuit chips
- Patent number 10,643,856
- Issue date May 5, 2020
- STMicroelectronics (Tours) SAS
- Mathieu Rouviere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 10,529,578
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Han Meng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,522,429
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of production of semiconductor device having semiconductor l...
- Patent number 10,479,675
- Issue date Nov 19, 2019
- Denso Corporation
- Akira Ogawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microstructured substrate
- Patent number 10,355,302
- Issue date Jul 16, 2019
- Centre National de la Recherche Scientifique
- Christophe Lethien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Material structure and method for deep silicon carbide etching
- Patent number 10,343,900
- Issue date Jul 9, 2019
- The Government of the United States of America, as represented by the Secreta...
- Eugene A. Imhoff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS grid for manipulating structural parameters of MEMS devices
- Patent number 10,199,262
- Issue date Feb 5, 2019
- MEMS DRIVE, INC.
- Roman Gutierrez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-level micromechanical structure
- Patent number 9,764,942
- Issue date Sep 19, 2017
- Murata Manufacturing Co., Ltd.
- Antti Iihola
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduction of chipping damage to MEMS structure
- Patent number 9,738,511
- Issue date Aug 22, 2017
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component with a reduced contact surface and its fa...
- Patent number 9,731,964
- Issue date Aug 15, 2017
- Nivarox-Far S.A.
- Alex Gandelhman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate for diaphragm-type resonant MEMS devices, diaphragm-type...
- Patent number 9,688,528
- Issue date Jun 27, 2017
- FUJIFILM Corporation
- Takahiro Sano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reactive ion etching
- Patent number 9,656,858
- Issue date May 23, 2017
- Atlantic Inertial Systems Limited
- Tracey Hawke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Etching method for forming a carrier having inward side walls in pa...
- Patent number 9,586,207
- Issue date Mar 7, 2017
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Sebastien Mermoz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Recess with tapered sidewalls for hermetic seal in MEMS devices
- Patent number 9,567,207
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for MEMS devices with increased sensitivity
- Patent number 9,505,605
- Issue date Nov 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having a micro-mechanical structure
- Patent number 9,481,563
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Manfred Engelhardt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate etching method
- Patent number 9,478,439
- Issue date Oct 25, 2016
- Beijing NMC Co., Ltd.
- Zhongwei Jiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for etching a substrate
- Patent number 9,318,341
- Issue date Apr 19, 2016
- Applied Materials, Inc.
- Robert P. Chebi
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP
- Publication number 20240409396
- Publication date Dec 12, 2024
- Canon Kabushiki Kaisha
- RYOTARO MURAKAMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ETCHING METHOD
- Publication number 20240304453
- Publication date Sep 12, 2024
- Ulvac, Inc.
- Taichi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING MIRROR DEVICE
- Publication number 20240092634
- Publication date Mar 21, 2024
- Hamamatsu Photonics K.K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Preparation Method Of Miniature Solid Silicon Needle
- Publication number 20210395078
- Publication date Dec 23, 2021
- Zhu Hongfei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Inertial Sensor, Method For Manufacturing Inertial Sensor, Inertial...
- Publication number 20210164781
- Publication date Jun 3, 2021
- SEIKO EPSON CORPORATION
- Koichiro KOMIZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING MICROMECHANICAL STRUCTURES IN A DEVICE WAFER
- Publication number 20210002131
- Publication date Jan 7, 2021
- Murata Manufacturing Co., Ltd.
- Hidetoshi FUJII
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FORMING METHOD AND DEVICE
- Publication number 20200247666
- Publication date Aug 6, 2020
- SEIKO EPSON CORPORATION
- Shogo INABA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING A MICRO MACHINED CHANNEL
- Publication number 20200216308
- Publication date Jul 9, 2020
- BERKIN B.V.
- Yiyuan ZHAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCUTRE
- Publication number 20200098583
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Han Meng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS microphone and manufacturing method for making same
- Publication number 20200048080
- Publication date Feb 13, 2020
- AAC Technologies Pte. Ltd.
- Lieng Loo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR
- Publication number 20190242709
- Publication date Aug 8, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKASHI IMANAKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, INERTIAL...
- Publication number 20190154446
- Publication date May 23, 2019
- SEIKO EPSON CORPORATION
- Koichiro KOMIZO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING LATERALLY INSULATED INTEGRATED CIRCUIT CHIPS
- Publication number 20190019687
- Publication date Jan 17, 2019
- STMicroelectronics (Tours) SAS
- Mathieu ROUVIERE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Material Structure and Method for Deep Silicon Carbide Etching
- Publication number 20180065844
- Publication date Mar 8, 2018
- The Government of the United States of America, as represented by the Secreta...
- Eugene A. IMHOFF
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170154830
- Publication date Jun 1, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- LEE-CHUAN TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT WITH A REDUCED CONTACT SURFACE AND ITS FA...
- Publication number 20160376147
- Publication date Dec 29, 2016
- Nivarox-Far S.A.
- Alex Gandelhman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LEVEL MICROMECHANICAL STRUCTURE
- Publication number 20160332864
- Publication date Nov 17, 2016
- Murata Manufacturing Co., Ltd.
- Antti IIHOLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Recess with Tapered Sidewalls for Hermetic Seal in MEMS Devices
- Publication number 20160332867
- Publication date Nov 17, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING HIGH ASPECT RATIO PROBES AND DEFORMING HIGH...
- Publication number 20160280537
- Publication date Sep 29, 2016
- California Institute of Technology
- Michael D. HENRY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR ELEMENT AND METHODS FOR MANUFACTURING THE SAME
- Publication number 20160244326
- Publication date Aug 25, 2016
- INFINEON TECHNOLOGIES AG
- Christian BRETTHAUER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROSTRUCTURED SUBSTRATE
- Publication number 20160240882
- Publication date Aug 18, 2016
- Centre National de la Recherche Scientifique
- Christophe Lethien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ETCHING METHOD FOR FORMING A CARRIER HAVING INWARD SIDE WALLS IN PA...
- Publication number 20160144365
- Publication date May 26, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Sebastien MERMOZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE FOR DIAPHRAGM-TYPE RESONANT MEMS DEVICES, DIAPHRAGM-TYPE...
- Publication number 20160107880
- Publication date Apr 21, 2016
- FUJIFILM CORPORATION
- Takahiro SANO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Devices and Methods for Manufacturing Semiconductor D...
- Publication number 20140291779
- Publication date Oct 2, 2014
- Manfred Engelhardt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and Apparatus for MEMS Devices with Increased Sensitivity
- Publication number 20140252358
- Publication date Sep 11, 2014
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for the Prevention of Suspended Silicon Structure Etching Du...
- Publication number 20140131818
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Ting-Hau Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYBRID INTERGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF
- Publication number 20130299927
- Publication date Nov 14, 2013
- ROBERT BOSCH GmbH
- Axel Franke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING TRENCH-LIKE DEPRESSIONS IN THE SURFACE OF A WAFER
- Publication number 20130263847
- Publication date Oct 10, 2013
- Boehringer Ingelheim microParts GmbH
- Klaus KADEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR ACHIEVING SMOOTH SIDE WALLS AFTER BOSCH ETCH PROCESS
- Publication number 20130237062
- Publication date Sep 12, 2013
- Jaroslaw W. Winniczek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR ETCHING A SUBSTRATE
- Publication number 20120152895
- Publication date Jun 21, 2012
- Applied Materials, Inc.
- ROBERT P. CHEBI
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bosch process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etching method

Structure forming method and device

Method of fabricating a micro machined channel

Method for manufacturing micromechanical structures in a device wafer

Inertial sensor, method for manufacturing inertial sensor, inertial...

Sensor

Methods for multiple-patterning nanosphere lithography for fabricat...

Method for producing a stress-decoupled micromechanical pressure se...

Method of fabricating semiconductor structure

Inertial sensor, method for manufacturing inertial sensor, inertial...

MEMS microphone and manufacturing method for making same

Method for manufacturing micromechanical structures in a device wafer

Method for fabricating laterally insulated integrated circuit chips

Method of fabricating semiconductor structure

Method of manufacturing semiconductor device

Method of production of semiconductor device having semiconductor l...

Microstructured substrate

Material structure and method for deep silicon carbide etching

MEMS grid for manipulating structural parameters of MEMS devices

Multi-level micromechanical structure

Reduction of chipping damage to MEMS structure

Micromechanical component with a reduced contact surface and its fa...

Substrate for diaphragm-type resonant MEMS devices, diaphragm-type...

Reactive ion etching

Etching method for forming a carrier having inward side walls in pa...

Recess with tapered sidewalls for hermetic seal in MEMS devices

Methods and apparatus for MEMS devices with increased sensitivity

Semiconductor device having a micro-mechanical structure

Substrate etching method

Methods for etching a substrate

Patents Applicationslast 30 patents

LIQUID EJECTION CHIP AND METHOD FOR MANUFACTURING LIQUID EJECTION CHIP

ETCHING METHOD

METHOD FOR MANUFACTURING MIRROR DEVICE

Preparation Method Of Miniature Solid Silicon Needle

Inertial Sensor, Method For Manufacturing Inertial Sensor, Inertial...

METHOD FOR MANUFACTURING MICROMECHANICAL STRUCTURES IN A DEVICE WAFER

STRUCTURE FORMING METHOD AND DEVICE

METHOD OF FABRICATING A MICRO MACHINED CHANNEL

METHOD OF FABRICATING SEMICONDUCTOR STRUCUTRE

MEMS microphone and manufacturing method for making same

SENSOR

INERTIAL SENSOR, METHOD FOR MANUFACTURING INERTIAL SENSOR, INERTIAL...

METHOD FOR FABRICATING LATERALLY INSULATED INTEGRATED CIRCUIT CHIPS

Material Structure and Method for Deep Silicon Carbide Etching

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MICROMECHANICAL COMPONENT WITH A REDUCED CONTACT SURFACE AND ITS FA...

MULTI-LEVEL MICROMECHANICAL STRUCTURE

Recess with Tapered Sidewalls for Hermetic Seal in MEMS Devices

METHODS FOR FABRICATING HIGH ASPECT RATIO PROBES AND DEFORMING HIGH...

SEMICONDUCTOR ELEMENT AND METHODS FOR MANUFACTURING THE SAME

MICROSTRUCTURED SUBSTRATE

ETCHING METHOD FOR FORMING A CARRIER HAVING INWARD SIDE WALLS IN PA...

SUBSTRATE FOR DIAPHRAGM-TYPE RESONANT MEMS DEVICES, DIAPHRAGM-TYPE...

Semiconductor Devices and Methods for Manufacturing Semiconductor D...

Methods and Apparatus for MEMS Devices with Increased Sensitivity

Method for the Prevention of Suspended Silicon Structure Etching Du...

HYBRID INTERGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF

METHOD FOR PRODUCING TRENCH-LIKE DEPRESSIONS IN THE SURFACE OF A WAFER

METHOD FOR ACHIEVING SMOOTH SIDE WALLS AFTER BOSCH ETCH PROCESS

METHODS FOR ETCHING A SUBSTRATE