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H01L21/76844

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76844Bottomless liners

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Contact features of semiconductor devices
- Patent number 12,112,984
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of metal barrier in damascene processes
- Patent number 12,068,194
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,027,418
- Issue date Jul 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Pingheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with conductive...
- Patent number 12,014,986
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Chin-Te Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating pattern collapse
- Patent number 11,961,761
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having vertical conductive graphene and met...
- Patent number 11,948,837
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor devices
- Patent number 11,935,786
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with covering liners
- Patent number 11,894,264
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,153
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less structures
- Patent number 11,848,190
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of metal barrier in damascene processes and th...
- Patent number 11,837,500
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line
- Patent number 11,784,127
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via fabrication
- Patent number 11,776,849
- Issue date Oct 3, 2023
- Quantinuum LLC
- Robert Edward Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line applications
- Patent number 11,764,157
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with source/drain...
- Patent number 11,735,470
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hung Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field effect transistor (FinFET) device structure with protecti...
- Patent number 11,735,474
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal interconnection
- Patent number 11,715,689
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier free interface between beol interconnects
- Patent number 11,694,926
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with linerless contacts
- Patent number 11,688,632
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Alex Joseph Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with conductive plugs of different a...
- Patent number 11,646,268
- Issue date May 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Chin-Te Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,621,189
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 11,621,190
- Issue date Apr 4, 2023
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with covering liners and method for fabricatin...
- Patent number 11,610,811
- Issue date Mar 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a through silicon via and methods of ma...
- Patent number 11,600,552
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Ju-Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,594,489
- Issue date Feb 28, 2023
- Renesas Electronics Corporation
- Toshikazu Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doping control of metal nitride films
- Patent number 11,587,829
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Annamalai Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,557,514
- Issue date Jan 17, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tiantian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug structure and manufacturing method thereof
- Patent number 11,551,971
- Issue date Jan 10, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- An-Chi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through-silicon vias
- Patent number 11,545,392
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT LINER IN METAL FILL
- Publication number 20250022751
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Sang-Hyeob LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387646
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES
- Publication number 20240387259
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387381
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES
- Publication number 20240363403
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...
- Publication number 20240360549
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240332075
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE
- Publication number 20240290655
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Zheng JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING PATTERN COLLAPSE
- Publication number 20240258163
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20240258164
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELEC...
- Publication number 20240243010
- Publication date Jul 18, 2024
- ADEKA CORPORATION
- JIHYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICES
- Publication number 20240213096
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Tsui-Ling Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADJUSTMENT LAYERS AND METHOD FOR FABRICAT...
- Publication number 20240213162
- Publication date Jun 27, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...
- Publication number 20240203789
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Making the Same
- Publication number 20240170329
- Publication date May 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHENG-JER YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Deposition of Metal Barrier in Damascene Processes
- Publication number 20240006234
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20230402321
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure For Semiconductor Device
- Publication number 20230386912
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsu-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH PROTECTI...
- Publication number 20230369110
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20230299002
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS
- Publication number 20230290678
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20230282570
- Publication date Sep 7, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230282512
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- Kyung Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FOR ELECTRONIC COMPONENT
- Publication number 20230260835
- Publication date Aug 17, 2023
- STMicroelectronics (Rousset) SAS
- Christian Rivero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20230253248
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Bottomless liners

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact features of semiconductor devices

Barrier-less structures

Selective deposition of metal barrier in damascene processes

Semiconductor devices and preparation methods thereof

Method for preparing semiconductor device structure with conductive...

Mitigating pattern collapse

Semiconductor structure having vertical conductive graphene and met...

Contact features of semiconductor devices

Method for fabricating semiconductor device with covering liners

Semiconductor device and method

Barrier-less structures

Selective deposition of metal barrier in damascene processes and th...

Ruthenium liner and cap for back-end-of-line

Through silicon via fabrication

Ruthenium liner and cap for back-end-of-line applications

Method for forming semiconductor device structure with source/drain...

Fin field effect transistor (FinFET) device structure with protecti...

Method of forming metal interconnection

Barrier free interface between beol interconnects

Semiconductor device with linerless contacts

Semiconductor device structure with conductive plugs of different a...

Barrier-less prefilled via formation

Method for filling recessed features in semiconductor devices with...

Semiconductor device with covering liners and method for fabricatin...

Semiconductor device having a through silicon via and methods of ma...

Semiconductor device and method of manufacturing the same

Doping control of metal nitride films

Semiconductor device and fabrication method thereof

Contact plug structure and manufacturing method thereof

Semiconductor component having through-silicon vias

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

GRADIENT LINER IN METAL FILL

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

LOW-RESISTANCE COPPER INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD

CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

SELECTIVE DEPOSITION OF METAL BARRIER IN DAMASCENE PROCESSES

LOW-TEMPERATURE DEPOSITION PROCESSES TO FORM MOLYBDENUM-BASED MATER...

GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES

SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE

MITIGATING PATTERN COLLAPSE

METHODS OF FORMING INTERCONNECT STRUCTURES

INHIBITOR FOR SELECTIVELY DEPOSITING THIN FILM AND METHOD FOR SELEC...

CONTACT FEATURES OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE WITH ADJUSTMENT LAYERS AND METHOD FOR FABRICAT...

SEMICONDUCTOR STRUCTURE HAVING VERTICAL CONDUCTIVE GRAPHENE AND MET...

Semiconductor Structure and Method of Making the Same

Selective Deposition of Metal Barrier in Damascene Processes

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

Contact Structure For Semiconductor Device

FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE WITH PROTECTI...

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CONTACT FOR ELECTRONIC COMPONENT

METHODS OF FORMING METAL LINER FOR INTERCONNECT STRUCTURES