Bridge structure with air gap

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H01L23/4821

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4821Bridge structure with air gap

Industries

Patents Grantslast 30 patents

Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device
- Patent number 12,068,384
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Yutaro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,996,353
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,942,431
- Issue date Mar 26, 2024
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 11,854,788
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor structure with an air gap
- Patent number 11,848,253
- Issue date Dec 19, 2023
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 11,804,439
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having spacer capping pattern disposed...
- Patent number 11,665,883
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Inkyoung Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed inductance integrated field effect transistor structure
- Patent number 11,574,854
- Issue date Feb 7, 2023
- National Research Council of Canada
- Nianhua (Frank) Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip decoupling capacitor
- Patent number 11,450,659
- Issue date Sep 20, 2022
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,437,324
- Issue date Sep 6, 2022
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making wide tuning range and super low capacitance varact...
- Patent number 11,335,815
- Issue date May 17, 2022
- GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
- Yuefei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 11,335,638
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,328,982
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,276,626
- Issue date Mar 15, 2022
- Mitsubishi Electric Corporation
- Yutaro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an air gap
- Patent number 11,205,609
- Issue date Dec 21, 2021
- United Microelectronics Corp.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,101,177
- Issue date Aug 24, 2021
- Winbond Electronics Corp.
- Che-Jui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 11,088,074
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Kazuhiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 10,985,143
- Issue date Apr 20, 2021
- X Display Company Technology Limited
- Christopher Bower
- F21 - LIGHTING
Information Patent Grant
Microfabricated air bridges for planar microwave resonator circuits
- Patent number 10,930,987
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Vivekananda P. Adiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,867,923
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Sang Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,847,437
- Issue date Nov 24, 2020
- Mitsubishi Electric Corporation
- Daichi Otori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 10,833,225
- Issue date Nov 10, 2020
- X Display Company Technology Limited
- Christopher Bower
- G02 - OPTICS
Information Patent Grant
Semiconductor device
- Patent number 10,797,141
- Issue date Oct 6, 2020
- Mitsubishi Electric Corporation
- Yutaro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,777,550
- Issue date Sep 15, 2020
- Mitsubishi Electric Corporation
- Yutaro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing transferable components using microstructured elastomeric...
- Patent number 10,717,267
- Issue date Jul 21, 2020
- Etienne Menard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit with airgaps to control capacitance
- Patent number 10,665,499
- Issue date May 26, 2020
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die, ultrasound probe, ultrasonic diagnostic system and method
- Patent number 10,586,753
- Issue date Mar 10, 2020
- Koninklijke Philips N.V.
- Egbertus Reinier Jacobs
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for forming semiconductor device and semiconductor device fa...
- Patent number 10,515,876
- Issue date Dec 24, 2019
- United Microelectronics Corp.
- Zhi-Biao Zhou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Conductive Features with Air Spacer and Method of Forming Same
- Publication number 20240387332
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20240312876
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304523
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304522
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS
- Publication number 20240153927
- Publication date May 9, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20230378071
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE AND METHOD FOR MA...
- Publication number 20230335469
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Heng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DETECTION MODULE AND BEAT SPECTROMETER
- Publication number 20230317867
- Publication date Oct 5, 2023
- Hamamatsu Photonics K.K.
- Tatsuo DOUGAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR AND BEATING SPECTROSCOPY DEVICE
- Publication number 20230307562
- Publication date Sep 28, 2023
- Hamamatsu Photonics K.K.
- Tatsuo DOUGAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES WITH AIR SPACER AND METHOD OF FORMING SAME
- Publication number 20230038952
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367371
- Publication date Nov 17, 2022
- KIOXIA Corporation
- Nobuyuki MOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing RC Delay in Semiconductor Devices
- Publication number 20220278042
- Publication date Sep 1, 2022
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20220262708
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR BRIDGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SUPERCON...
- Publication number 20220216134
- Publication date Jul 7, 2022
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Wenlong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AN AIR GAP
- Publication number 20220068766
- Publication date Mar 3, 2022
- UNITED MICROELECTRONICS CORP.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220005748
- Publication date Jan 6, 2022
- KABUSHIKI KAISHA TOSHIBA
- Kazuki SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED INDUCTANCE INTEGRATED FIELD EFFECT TRANSISTOR STRUCTURE
- Publication number 20210320053
- Publication date Oct 14, 2021
- National Research Council of Canada
- Nianhua (Frank) JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES
- Publication number 20210305133
- Publication date Sep 30, 2021
- Intel Coporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES
- Publication number 20210305132
- Publication date Sep 30, 2021
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP DECOUPLING CAPACITOR
- Publication number 20210288046
- Publication date Sep 16, 2021
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210265473
- Publication date Aug 26, 2021
- Mitsubishi Electric Corporation
- Yutaro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH AN AIR GAP
- Publication number 20210242110
- Publication date Aug 5, 2021
- UNITED MICROELECTRONICS CORP.
- Ching-Pin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC WAFER COMMUNICATION SYSTEMS AND RELATED PACKAGES
- Publication number 20210242124
- Publication date Aug 5, 2021
- Lightmatter, Inc
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS
- Publication number 20210225815
- Publication date Jul 22, 2021
- X Display Company Technology Limited
- Christopher Bower
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082823
- Publication date Mar 18, 2021
- KIOXIA Corporation
- Nobuyuki MOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005535
- Publication date Jan 7, 2021
- Mitsubishi Electric Corporation
- Yutaro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20200411415
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Bridge structure with air gap

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro assembled LED displays and lighting elements

Semiconductor device

Open cavity bridge power delivery architectures and processes

Air gap seal for interconnect air gap and method of fabricating the...

Semiconductor device and manufacturing method thereof

Micro assembled LED displays and lighting elements

Semiconductor structure with an air gap

Reducing RC delay in semiconductor devices

Semiconductor memory device having spacer capping pattern disposed...

Distributed inductance integrated field effect transistor structure

On-chip decoupling capacitor

Semiconductor device and manufacturing method thereof

Method of making wide tuning range and super low capacitance varact...

Reducing RC delay in semiconductor devices

Air gap seal for interconnect air gap and method of fabricating the...

Semiconductor device

Semiconductor structure with an air gap

Semiconductor structure and method for forming the same

Semiconductor device and method for manufacturing same

Micro assembled LED displays and lighting elements

Microfabricated air bridges for planar microwave resonator circuits

Semiconductor device

Semiconductor device

Micro assembled LED displays and lighting elements

Semiconductor device

Semiconductor device

Printing transferable components using microstructured elastomeric...

Integrated circuit with airgaps to control capacitance

IC die, ultrasound probe, ultrasonic diagnostic system and method

Method for forming semiconductor device and semiconductor device fa...

Patents Applicationslast 30 patents

Conductive Features with Air Spacer and Method of Forming Same

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE STRUCTURE AND METHOD FOR MA...

LIGHT DETECTION MODULE AND BEAT SPECTROMETER

PHOTODETECTOR AND BEATING SPECTROSCOPY DEVICE

CONDUCTIVE FEATURES WITH AIR SPACER AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Reducing RC Delay in Semiconductor Devices

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

AIR BRIDGE STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SUPERCON...

SEMICONDUCTOR STRUCTURE WITH AN AIR GAP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DISTRIBUTED INDUCTANCE INTEGRATED FIELD EFFECT TRANSISTOR STRUCTURE

OPEN CAVITY BRIDGE POWER DELIVERY ARCHITECTURES AND PROCESSES

OPEN CAVITY BRIDGE CO-PLANAR PLACEMENT ARCHITECTURES AND PROCESSES

ON-CHIP DECOUPLING CAPACITOR

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE WITH AN AIR GAP

PHOTONIC WAFER COMMUNICATION SYSTEMS AND RELATED PACKAGES

MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...