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Bump connectors formed on an encapsulation of the semiconductor or solid-state body
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H01L2224/12105
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/12105
Bump connectors formed on an encapsulation of the semiconductor or solid-state body
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last 30 patents
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Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for fabricating a computing system with an int...
Patent number
11,967,528
Issue date
Apr 23, 2024
Apple Inc.
Vidhya Ramachandran
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package having a main die and a dummy die
Patent number
11,967,563
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
Patent number
11,961,764
Issue date
Apr 16, 2024
STATS ChipPAC Pte. Ltd.
Thomas J. Strothmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
RF devices with enhanced performance and methods of forming the same
Patent number
11,955,348
Issue date
Apr 9, 2024
Qorvo US, Inc.
Julio C. Costa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package stacking using chip to wafer bonding
Patent number
11,955,462
Issue date
Apr 9, 2024
Intel Corporation
Georg Seidemann
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Advanced info POP and method of forming thereof
Patent number
11,955,460
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Da Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,435
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including seed structure and method of manufa...
Patent number
11,935,858
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Seungmin Baek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor device
Patent number
11,935,907
Issue date
Mar 19, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming thereof
Patent number
11,935,761
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming device and package structure
Patent number
11,929,322
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
Patent number
11,929,330
Issue date
Mar 12, 2024
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D-interconnect
Patent number
11,929,337
Issue date
Mar 12, 2024
Invensas LLC
Chok J. Chia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LTHC as charging barrier in info package formation
Patent number
11,923,353
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming the same
Patent number
11,916,028
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
11,908,692
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,908,795
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,908,759
Issue date
Feb 20, 2024
Mediatek Inc.
Nan-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package system and method
Patent number
11,901,319
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,901,348
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Tae-Ho Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package
Patent number
11,901,303
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer system-level fan-out packaging structure and manufacturing me...
Patent number
11,894,243
Issue date
Feb 6, 2024
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,887,952
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of packaging chip and chip package structure
Patent number
11,881,415
Issue date
Jan 23, 2024
Pep Innovation PTE Ltd.
Hwee Seng Jimmy Chew
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240153884
Publication date
May 9, 2024
Siliconware Precision Industries Co., Ltd.
Yi-Min FU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
Publication number
20240153872
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
Publication number
20240153896
Publication date
May 9, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
Hui-Min Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
Publication number
20240135079
Publication date
Apr 25, 2024
iCometrue Company Ltd.
Mou-Shiung LIN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
Publication number
20240120211
Publication date
Apr 11, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240096760
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096851
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Unbyoung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096811
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Chung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240088053
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHEN-HUA YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Publication number
20240088104
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacking Via Structures for Stress Reduction
Publication number
20240088061
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED BRIDGE DIES
Publication number
20240079339
Publication date
Mar 7, 2024
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20240047376
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
Publication number
20240047390
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Minjung CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGE STRUCTURES WITH CASCADED OPENINGS IN ENHANCEMENT LAYER
Publication number
20240038701
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Ting Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240030125
Publication date
Jan 25, 2024
Advanced Semiconductor Engineering, Inc.
Jung Jui KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240014151
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
Publication number
20240006377
Publication date
Jan 4, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
Publication number
20230395588
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jie CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Embedded Packaging Concepts for Integration of ASICs and Optical Co...
Publication number
20230386865
Publication date
Nov 30, 2023
Apple Inc.
Kishore N. Renjan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
Publication number
20230386864
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Forming Thereof
Publication number
20230386866
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dummy through vias for Integrated Circuit Packages and Methods of F...
Publication number
20230377905
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien-Li Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
Publication number
20230378075
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INT...
Publication number
20230369266
Publication date
Nov 16, 2023
Micron Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
Publication number
20230360986
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
Publication number
20230352442
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Company Co., Ltd.
Hui-Jung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...
Publication number
20230352355
Publication date
Nov 2, 2023
Nippon Electric Glass Co., Ltd.
Hiroki KATAYAMA
B24 - GRINDING POLISHING
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20230343607
Publication date
Oct 26, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Jae Yoon Kim
H01 - BASIC ELECTRIC ELEMENTS