Bump connectors having different functions

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H01L2224/14515

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/14515Bump connectors having different functions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 12,026,008
- Issue date Jul 2, 2024
- Altera Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compact routing package for high frequency isolation
- Patent number 11,955,418
- Issue date Apr 9, 2024
- Cypress Semiconductor Corporation
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,923,328
- Issue date Mar 5, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip and semiconductor package including the same
- Patent number 11,830,840
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Young Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,705,379
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for clock signal transmission in integrated circuits and...
- Patent number 11,500,412
- Issue date Nov 15, 2022
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package module including flip-chip ground pads and power pads,...
- Patent number 11,424,206
- Issue date Aug 23, 2022
- Realtek Semiconductor Corp.
- Sheng-Feng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,398,412
- Issue date Jul 26, 2022
- SK hynix Inc.
- Hyun Chul Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,322,462
- Issue date May 3, 2022
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 11,257,725
- Issue date Feb 22, 2022
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,171,105
- Issue date Nov 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip, display substrate, display device and method for manu...
- Patent number 10,971,465
- Issue date Apr 6, 2021
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,943,881
- Issue date Mar 9, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drive integrated circuit and display device including the same
- Patent number 10,741,516
- Issue date Aug 11, 2020
- Silicon Works Co., Ltd.
- Myeong Woo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures for burn-in testing and methods the...
- Patent number 10,712,382
- Issue date Jul 14, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor method for forming semiconductor structure having bum...
- Patent number 10,607,858
- Issue date Mar 31, 2020
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with bump allocation
- Patent number 10,541,185
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Hsin Kuo
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor structure having bump on tilting upper corner surface
- Patent number 10,290,512
- Issue date May 14, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,211,176
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip scale package and manufacturing method thereof
- Patent number 9,941,240
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and electr...
- Patent number 9,691,805
- Issue date Jun 27, 2017
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount high-frequency circuit
- Patent number 9,691,722
- Issue date Jun 27, 2017
- Mitsubishi Electric Corporation
- Takeshi Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having stacked structures and methods for fab...
- Patent number 9,653,430
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION
- Publication number 20240290709
- Publication date Aug 29, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20240250053
- Publication date Jul 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsin He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND DRIVE APPARATUS
- Publication number 20240008371
- Publication date Jan 4, 2024
- ASAHI KASEI MICRODEVICES CORPORATION
- Keita OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Clock Signal Transmission In Integrated Circuits And...
- Publication number 20230049681
- Publication date Feb 16, 2023
- Intel Corporation
- Jeffrey Chromczak
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION
- Publication number 20230022660
- Publication date Jan 26, 2023
- CYPRESS SEMICONDUCTOR CORPORATION
- Chenxi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-to-Die Power Delivery
- Publication number 20230024662
- Publication date Jan 26, 2023
- Ankireddy Nalamalpu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220068865
- Publication date Mar 3, 2022
- Advanced Semiconductor Engineering, Inc.
- Hsin He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220013419
- Publication date Jan 13, 2022
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210407948
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Young Jun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183801
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS
- Publication number 20210175134
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Taehyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210143117
- Publication date May 13, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin He HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE MODULE
- Publication number 20210104480
- Publication date Apr 8, 2021
- Realtek Semiconductor Corp.
- SHENG-FENG CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200235065
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190164922
- Publication date May 30, 2019
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE INTEGRATED CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20190157231
- Publication date May 23, 2019
- Silicon Works Co., Ltd.
- Myeong Woo OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CHIP, DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR MANU...
- Publication number 20190148327
- Publication date May 16, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...
- Publication number 20190074197
- Publication date Mar 7, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170179062
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BUMP ALLOCATION
- Publication number 20170117199
- Publication date Apr 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsin KUO
- G01 - MEASURING TESTING
Information Patent Application
Chip Detecting System and Detecting Method
- Publication number 20150155213
- Publication date Jun 4, 2015
- Huawei Technologies Co., Ltd
- Jianqiang Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH INTERNAL PADS
- Publication number 20150145122
- Publication date May 28, 2015
- Samsung Electronics Co., Ltd.
- Young KOOG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150130056
- Publication date May 14, 2015
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TEST AND MONITORING STRUCTURE TO DETECT BOUNDARIES OF...
- Publication number 20150044787
- Publication date Feb 12, 2015
- International Business Machines Corporation
- James V. Crain
- G01 - MEASURING TESTING

Bump connectors having different functions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including test bumps

Chip package structure

Techniques for clock signal transmission in integrated circuits and...

Compact routing package for high frequency isolation

Semiconductor device and semiconductor package

Integrated chip and semiconductor package including the same

Method of direct bonding semiconductor components

Semiconductor package

Semiconductor packages

Techniques for clock signal transmission in integrated circuits and...

Chip package structure

Chip package module including flip-chip ground pads and power pads,...

Semiconductor package

Semiconductor device

Semiconductor package including test bumps

Semiconductor package and manufacturing method of the same

Surface mounting semiconductor components

Driving chip, display substrate, display device and method for manu...

Semiconductor package

Chip package structure and method for forming the same

Drive integrated circuit and display device including the same

Semiconductor device structures for burn-in testing and methods the...

Semiconductor method for forming semiconductor structure having bum...

Semiconductor devices with bump allocation

Semiconductor structure having bump on tilting upper corner surface

Semiconductor package

Semiconductor chip scale package and manufacturing method thereof

Semiconductor device, method for manufacturing the same, and electr...

Surface mount high-frequency circuit

Semiconductor devices having stacked structures and methods for fab...

Patents Applicationslast 30 patents

COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND DRIVE APPARATUS

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

Techniques For Clock Signal Transmission In Integrated Circuits And...

COMPACT ROUTING PACKAGE FOR HIGH FREQUENCY ISOLATION

Die-to-Die Power Delivery

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE

INTEGRATED CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

CHIP PACKAGE MODULE

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

DRIVE INTEGRATED CIRCUIT AND DISPLAY DEVICE INCLUDING THE SAME

DRIVING CHIP, DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR MANU...

SEMICONDUCTOR METHOD FOR FORMING SEMICONDUCTOR STRUCTURE HAVING BUM...

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES WITH BUMP ALLOCATION

Chip Detecting System and Detecting Method

INTEGRATED CIRCUITS WITH INTERNAL PADS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR TEST AND MONITORING STRUCTURE TO DETECT BOUNDARIES OF...