Bump connectors having different functions

Industry

CPC
H01L2224/17515

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/17515Bump connectors having different functions

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 12,027,492
- Issue date Jul 2, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of terminals arranged thereon
- Patent number 11,948,916
- Issue date Apr 2, 2024
- Renesas Electronics Corporation
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electronic component, wherein a semiconduct...
- Patent number 11,842,980
- Issue date Dec 12, 2023
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 11,545,461
- Issue date Jan 3, 2023
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,437,334
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 11,398,440
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-packages including a bridge die
- Patent number 11,322,446
- Issue date May 3, 2022
- SK hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting semiconductor components
- Patent number 11,101,238
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 10,847,485
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,529,744
- Issue date Jan 7, 2020
- Japan Display Inc.
- Tetsuya Okamae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microprocessor package with first level die bump ground webbing str...
- Patent number 10,453,795
- Issue date Oct 22, 2019
- Intel Corporation
- Yu Amos Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PoP semiconductor device...
- Patent number 10,297,519
- Issue date May 21, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,170,441
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 10,109,605
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip scale package and manufacturing method thereof
- Patent number 9,941,240
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming PoP semiconductor device...
- Patent number 9,786,623
- Issue date Oct 10, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concentric bump design for the alignment in die stacking
- Patent number 9,721,916
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect arrangement for hexagonal attachment configurations
- Patent number 9,589,919
- Issue date Mar 7, 2017
- Intel Corporation
- Raul Enriquez Shibayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for high-density chip connectivity
- Patent number 9,472,529
- Issue date Oct 18, 2016
- TERAPEDE SYSTEMS INC.
- Madhukar B. Vora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concentric bump design for the alignment in die stacking
- Patent number 9,437,551
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass based multichip package
- Patent number 9,371,982
- Issue date Jun 21, 2016
- Maxim Integrated Products, Inc.
- Tiao Zhou
- F21 - LIGHTING
Information Patent Grant
Stacked package and method of manufacturing the same
- Patent number 9,343,436
- Issue date May 17, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package assembly and methods for forming the same
- Patent number 9,287,246
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D semiconductor device
- Patent number 9,245,827
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Uk-song Kang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BUMPS OF A PACKAGE SUBSTRATE
- Publication number 20240203860
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Ashish RAJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230139657
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Hui Min YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230100980
- Publication date Mar 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hong Am KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220367402
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- INHYUNG SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20220359448
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS
- Publication number 20220148994
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- Taehyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220139877
- Publication date May 5, 2022
- RENESAS ELECTRONICS CORPORATION
- Shuuichi KARIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes in Semiconductor Devices
- Publication number 20220037277
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20220028828
- Publication date Jan 27, 2022
- AISIN CORPORATION
- Takanobu NARUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20210407957
- Publication date Dec 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hong Am KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Electronic Component, Wherein a Semiconduct...
- Publication number 20210351156
- Publication date Nov 11, 2021
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Molded Leadframes in Semiconductor Devices
- Publication number 20210210453
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20210066230
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE
- Publication number 20200273800
- Publication date Aug 27, 2020
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE
- Publication number 20200273799
- Publication date Aug 27, 2020
- SK HYNIX INC.
- Ki Jun SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200203300
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shaped Interconnect Bumps in Semiconductor Devices
- Publication number 20190109110
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20190057946
- Publication date Feb 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTING SEMICONDUCTOR COMPONENTS
- Publication number 20180211935
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-KAI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming PoP Semiconductor Device...
- Publication number 20180012857
- Publication date Jan 11, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20170287939
- Publication date Oct 5, 2017
- Japan Display Inc.
- Tetsuya OKAMAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming POP Semiconductor Device...
- Publication number 20160276307
- Publication date Sep 22, 2016
- STATS ChipPAC, Ltd.
- Yaojian LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160148891
- Publication date May 26, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Concentric Bump Design for the Alignment in Die Stacking
- Publication number 20150228587
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20150171043
- Publication date Jun 18, 2015
- ADVANCED MICRO DEVICES (SHANGHAI) CO. LTD
- I-Tseng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150054155
- Publication date Feb 26, 2015
- Funai Electric Co., Ltd.
- Hisayuki Ohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150021755
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li HSIAO
- H01 - BASIC ELECTRIC ELEMENTS

Bump connectors having different functions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including test bumps

Chip package structure

Semiconductor module and semiconductor device

Adhesive member and display device including the same

Semiconductor device having a plurality of terminals arranged thereon

Method for producing an electronic component, wherein a semiconduct...

Adhesive member and display device including the same

Shaped interconnect bumps in semiconductor devices

Chip package structure

Polymer layers embedded with metal pads for heat dissipation

System-in-packages including a bridge die

Leadframes in semiconductor devices

Surface mounting semiconductor components

Pre-molded leadframes in semiconductor devices

Chip package structure and method for forming the same

Display device

Microprocessor package with first level die bump ground webbing str...

Semiconductor device and method of forming PoP semiconductor device...

Semiconductor structure and manufacturing method thereof

Polymer layers embedded with metal pads for heat dissipation

Semiconductor chip scale package and manufacturing method thereof

Semiconductor device and method of forming PoP semiconductor device...

Concentric bump design for the alignment in die stacking

Interconnect arrangement for hexagonal attachment configurations

Apparatus and methods for high-density chip connectivity

Concentric bump design for the alignment in die stacking

Glass based multichip package

Stacked package and method of manufacturing the same

Package assembly and methods for forming the same

3D semiconductor device

Patents Applicationslast 30 patents

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

PACKAGE BUMPS OF A PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE

ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING TEST BUMPS

ELECTRONIC DEVICE AND SEMICONDUCTOR DEVICE

Leadframes in Semiconductor Devices

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

ADHESIVE MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

Method for Producing an Electronic Component, Wherein a Semiconduct...

Pre-Molded Leadframes in Semiconductor Devices

CHIP PACKAGE STRUCTURE

SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE

SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Shaped Interconnect Bumps in Semiconductor Devices

Polymer Layers Embedded with Metal Pads for Heat Dissipation

SURFACE MOUNTING SEMICONDUCTOR COMPONENTS

Semiconductor Device and Method of Forming PoP Semiconductor Device...

DISPLAY DEVICE

Semiconductor Device and Method of Forming POP Semiconductor Device...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Concentric Bump Design for the Alignment in Die Stacking

DIE-DIE STACKING STRUCTURE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE

STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME