Bump or bump-like direct electrical connections between devices

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CPC
H01L2225/06513

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06513Bump or bump-like direct electrical connections between devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die on interposer packages
- Patent number 12,230,582
- Issue date Feb 18, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,218,100
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Inhyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,939
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,914
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Inhyung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable logic device with fine-grained disaggregation
- Patent number 12,206,410
- Issue date Jan 21, 2025
- Intel Corporation
- Dheeraj Subbareddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modeling method and apparatus, computer device and storage medium
- Patent number 12,204,841
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kun Weng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure and method for manufac...
- Patent number 12,199,015
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier collar for interconnects
- Patent number 12,198,981
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator (IVR) package including inductor and c...
- Patent number 12,191,288
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Sangnam Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 12,183,718
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 12,183,596
- Issue date Dec 31, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,664
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro bump, method for forming micro bump, chip interconnection str...
- Patent number 12,176,311
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D chip package based on vertical-through-via connector
- Patent number 12,176,278
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked DRAM device and method of manufacture
- Patent number 12,170,126
- Issue date Dec 17, 2024
- RAMBUS INC.
- Thomas Vogelsang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250062304
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- SEOKGEUN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
- Publication number 20250062212
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Ki Won BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062255
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...
- Publication number 20250062269
- Publication date Feb 20, 2025
- Micron Technology, Inc.
- Kai Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062248
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250062303
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING LARGE CHIPS THROUGH STITCHING
- Publication number 20250054879
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...
- Publication number 20250054914
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20250054898
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHI...
- Publication number 20250054910
- Publication date Feb 13, 2025
- Meta Platforms Technologies, LLC
- Huseyin Ekin Sumbul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE
- Publication number 20250054912
- Publication date Feb 13, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Julius Kovats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20250046776
- Publication date Feb 6, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Power Switches and Power User Circuits Separated in D...
- Publication number 20250046700
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM
- Publication number 20250036583
- Publication date Jan 30, 2025
- KIOXIA Corporation
- Kenji SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS
- Publication number 20250038151
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Kyuha Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTE...
- Publication number 20250038150
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiaoxin Liu
- G11 - INFORMATION STORAGE
Information Patent Application
THERMAL DISSIPATION IN STACKED MEMORY DEVICES AND ASSOCIATED SYSTEM...
- Publication number 20250031386
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CHIPLET SYSTEM
- Publication number 20250029971
- Publication date Jan 23, 2025
- Zero ASIC Corporation
- Andreas Olofsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250031434
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE RELATED TO SIGNAL TRANSMISSION
- Publication number 20250029640
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Kyung Jun CHO
- G11 - INFORMATION STORAGE
Information Patent Application
Inter-Terminal Die-to-Die Attachment
- Publication number 20250029953
- Publication date Jan 23, 2025
- MURATA MANUFACTURING CO., LTD.
- Kazunori Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250022845
- Publication date Jan 16, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...
- Publication number 20250022868
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES
- Publication number 20250022869
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Sung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...
- Publication number 20250022901
- Publication date Jan 16, 2025
- Hamamatsu Photonics K.K.
- Nao INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...
- Publication number 20250015003
- Publication date Jan 9, 2025
- Intel Corporation
- Srinivas PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...
- Publication number 20250015053
- Publication date Jan 9, 2025
- Qorvo US, Inc.
- Tarak A. Railkar
- H01 - BASIC ELECTRIC ELEMENTS

Bump or bump-like direct electrical connections between devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronics assemblies employing copper in multiple locations

Double-sided substrate with cavities for direct die-to-die intercon...

Embedded die on interposer packages

Semiconductor package and related methods

Stacked semiconductor device assembly in computer system

TSV check circuit with replica path

Semiconductor package

Semiconductor die connection system and method

Semiconductor package and method of forming the same

Passivation structure with planar top surfaces

Package-on-package assembly with wire bond vias

Semiconductor package

Semiconductor package

Honeycomb pattern for conductive features

Programmable logic device with fine-grained disaggregation

Die to die high-speed communication without discrete amplifiers bet...

Modeling method and apparatus, computer device and storage medium

Semiconductor device and a manufacturing method thereof

Semiconductor device including via structure and method for manufac...

Diffusion barrier collar for interconnects

Semiconductor packages

Semiconductor device assembly with pillar array

Integrated voltage regulator (IVR) package including inductor and c...

Semiconductor package having a high reliability

Low cost package warpage solution

Semiconductor package

Micro bump, method for forming micro bump, chip interconnection str...

Semiconductor package and method manufacturing the same

3D chip package based on vertical-through-via connector

Stacked DRAM device and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICES WITH NON-CONDUCTIVE FILM RETENTION ARRANGEMEN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

FORMING LARGE CHIPS THROUGH STITCHING

METHOD OF ALIGNMENT OF ELECTRICAL COMPONENTS OF AN ELECTRICAL APPAR...

BUFFER LAYER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

SYSTEMS AND METHODS FOR THREE-DIMENSIONALLY STACKING SYSTEMS ON CHI...

INTEGRATED CIRCUIT DEVICE INCLUDING DIES ARRANGED FACE-TO-FACE

PACKAGING STRUCTURE AND PACKAGING METHOD

Packages with Power Switches and Power User Circuits Separated in D...

MEMORY SYSTEM

SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS

CHIP-PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTE...

THERMAL DISSIPATION IN STACKED MEMORY DEVICES AND ASSOCIATED SYSTEM...

MODULAR CHIPLET SYSTEM

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

MEMORY DEVICE RELATED TO SIGNAL TRANSMISSION

Inter-Terminal Die-to-Die Attachment

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

MICROELECTRONIC ASSEMBLIES

STACK-TYPE SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDU...

METHODS OF MANUFACTURING SEMICONDUCTOR DIE STACK STRUCTURES

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...

Multi-Die Fine Grain Integrated Voltage Regulation

HYBRID FAN-OUT ARCHITECTURE WITH EMIB AND GLASS CORE FOR HETEROGENE...

BARE FLIP-CHIP DIE STACK AND THE FABRICATION METHOD AND TOOLING THE...