Bump or bump-like direct electrical connections between devices

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CPC
H01L2225/06513

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

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H01L2225/06513Bump or bump-like direct electrical connections between devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit comprising master chip with first...
- Patent number 12,293,990
- Issue date May 6, 2025
- SK hynix Inc.
- Yun Gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,294,002
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with signal bump and dummy bump, semiconductor p...
- Patent number 12,288,762
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Keum Hee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Failover methods and systems in three-dimensional memory device
- Patent number 12,287,712
- Issue date Apr 29, 2025
- RAMBUS INC.
- Joohee Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shared well structure manufacturing method
- Patent number 12,288,786
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang Zhou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 12,288,734
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Juik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,277,056
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System-in-package network processors
- Patent number 12,273,282
- Issue date Apr 8, 2025
- Altera Corporation
- Kevin Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 12,266,585
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package process and package structure
- Patent number 12,266,632
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Chih Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,253,943
- Issue date Mar 18, 2025
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Game engine on a chip
- Patent number 12,249,018
- Issue date Mar 11, 2025
- TMRW FOUNDATION IP S.ÀR.L.
- Cevat Yerli
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,249,593
- Issue date Mar 11, 2025
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system having combined high density, low bandwidth and low d...
- Patent number 12,243,575
- Issue date Mar 4, 2025
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED DIE ON INTERPOSER PACKAGES
- Publication number 20250149462
- Publication date May 8, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS
- Publication number 20250149526
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonjung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING COP STRUCTURE AND MEMORY PACKAGE INCLUDING THE...
- Publication number 20250151292
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Changyoung Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH BANDWIDTH MEMORY
- Publication number 20250151293
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jeehyun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149481
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES
- Publication number 20250140627
- Publication date May 1, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250140668
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Hyunwoong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250132187
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250131961
- Publication date Apr 24, 2025
- SK HYNIX INC.
- Won Jae CHOI
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID HIGH BANDWIDTH MEMORY STACK
- Publication number 20250132293
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
- Publication number 20250132302
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kwun-Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHIP, LOGIC CHIP, CHIP STACKED STRUCTURE, AND MEMORY
- Publication number 20250125254
- Publication date Apr 17, 2025
- CXMT CORPORATION
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
- Publication number 20250125302
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR
- Publication number 20250125241
- Publication date Apr 17, 2025
- iCometrue Company Ltd.
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...
- Publication number 20250125309
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHIP, LOGIC CHIP, CHIP STACK STRUCTURE, AND MEMORY
- Publication number 20250125264
- Publication date Apr 17, 2025
- CXMT CORPORATION
- Jiarui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED MEMORY STACK
- Publication number 20250125220
- Publication date Apr 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Via Structure And Method For Manufac...
- Publication number 20250125225
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Yeonjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125301
- Publication date Apr 17, 2025
- Fuji Electric Co., Ltd.
- Ryo MAETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATI...
- Publication number 20250125314
- Publication date Apr 17, 2025
- Quantinuum LLC
- David DEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE
- Publication number 20250120099
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- MINWOO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118650
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES
- Publication number 20250118694
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...
- Publication number 20250118663
- Publication date Apr 10, 2025
- JARIET TECHNOLOGIES, INC.
- Scott Richard POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112193
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- INHYUNG SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...
- Publication number 20250105223
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sangwook HAN
- H01 - BASIC ELECTRIC ELEMENTS

Bump or bump-like direct electrical connections between devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor integrated circuit comprising master chip with first...

Integrated circuit package and method of forming same

Integrated circuit packages and methods of forming the same

Semiconductor chip with signal bump and dummy bump, semiconductor p...

Failover methods and systems in three-dimensional memory device

Shared well structure manufacturing method

Semiconductor device

Microelectronic assemblies

Semiconductor packages

Electronic package and method of forming the same

Semiconductor device and method for manufacturing the same

Memory device interface and method

System-in-package network processors

3D semiconductor memory device and structure with memory and metal...

Stacked dies and methods for forming bonded structures

Method of fabricating semiconductor package

Arrangement and thermal management of 3D stacked dies

Package process and package structure

Memory device interface and method

Stacked semiconductor device

Secure semiconductor integration and method for making thereof

Wire bond wires for interference shielding

Semiconductor package including heat dissipation layer

Game engine on a chip

Semiconductor package and method manufacturing the same

Electronic device

Three dimensional circuit implementing machine trained network

Semiconductor device including penetration via structure

Memory system having combined high density, low bandwidth and low d...

Thermocompression bonding using metastable gas atoms

Patents Applicationslast 30 patents

EMBEDDED DIE ON INTERPOSER PACKAGES

SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF STACKED CHIPS

MEMORY DEVICE HAVING COP STRUCTURE AND MEMORY PACKAGE INCLUDING THE...

HIGH BANDWIDTH MEMORY

SEMICONDUCTOR PACKAGE

Multi-Die Fine Grain Integrated Voltage Regulation

PASSIVATION STRUCTURE WITH PLANAR TOP SURFACES

SEMICONDUCTOR PACKAGE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

SEMICONDUCTOR DEVICE

HYBRID HIGH BANDWIDTH MEMORY STACK

HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...

MEMORY CHIP, LOGIC CHIP, CHIP STACKED STRUCTURE, AND MEMORY

SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

3D CHIP PACKAGE BASED ON VERTICAL-THROUGH-VIA CONNECTOR

SEMICONDUCTOR DEVICE STRUCTURE WITH COMPRESSIBLE BONDS AND METHODS...

MEMORY CHIP, LOGIC CHIP, CHIP STACK STRUCTURE, AND MEMORY

INVERTED MEMORY STACK

Semiconductor Device Including Via Structure And Method For Manufac...

SEMICONDUCTOR DEVICE

INTEGRATION AND CO-PACKAGING OF CONFINEMENT APPARATUS AND APPLICATI...

MEMORY DEVICE AND A MEMORY SYSTEM INCLUDING THE MEMORY DEVICE

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

HONEYCOMB PATTERN FOR CONDUCTIVE FEATURES

Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

SEMICONDUCTOR PACKAGE

RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...