by applying an insulating layer having channels for the next circuit layer

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CPC
H05K3/465

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/465by applying an insulating layer having channels for the next circuit layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods to fill through-holes of a substrate with metal paste
- Patent number 12,342,470
- Issue date Jun 24, 2025
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Customized thermal pathways in a PCB
- Patent number 12,342,474
- Issue date Jun 24, 2025
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and method of manufacturing the same
- Patent number 12,336,093
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maleimide resin composition, prepreg, resin film, laminated board,...
- Patent number 12,324,105
- Issue date Jun 3, 2025
- Resonac Corporation
- Chihiro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating layer for multilayer printed circuit board, multilayer p...
- Patent number 12,313,973
- Issue date May 27, 2025
- LG Chem, Ltd.
- Jeong Wook Mun
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Production method for multilayer wiring board
- Patent number 12,302,504
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic discharge protection of electronic component embedded...
- Patent number 12,284,753
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Mahadi-Ul Hassan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate, laminate with buildup layer, laminate with metal foil, an...
- Patent number 12,284,755
- Issue date Apr 22, 2025
- SEKISUI KASEI CO., LTD.
- Koichiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Closed-cavity printed circuit board
- Patent number 12,284,771
- Issue date Apr 22, 2025
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically connected component carrier stacks with respective cav...
- Patent number 12,279,369
- Issue date Apr 15, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bernhard Reitmaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and method for producing same
- Patent number 12,269,238
- Issue date Apr 8, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Nishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 12,256,501
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- In Gun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacture for embedded IC chip directly connected to PCB
- Patent number 12,213,258
- Issue date Jan 28, 2025
- AVERATEK CORPORATION
- Haris Basit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-containing substrate
- Patent number 12,200,871
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Takao Koshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for laminating graphene-coated printed circuit boards
- Patent number 12,004,308
- Issue date Jun 4, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Multilayer circuit board and manufacturing method therefor
- Patent number 11,956,904
- Issue date Apr 9, 2024
- STEMCO CO., LTD.
- Jae Soo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package manufacturing method, and adhesive sheet used...
- Patent number 11,935,865
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...
- Publication number 20250240870
- Publication date Jul 24, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...
- Publication number 20250151208
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stamping Surface Profile in Design Layer and Filling an Indentation...
- Publication number 20250142736
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER ELECTRICAL STRUCTURES
- Publication number 20250081339
- Publication date Mar 6, 2025
- Qorvo US, Inc.
- Jerry Holt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20250071909
- Publication date Feb 27, 2025
- HAESUNG DS CO., LTD.
- Soon-Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...
- Publication number 20250040059
- Publication date Jan 30, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Tomoyuki KAWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240373554
- Publication date Nov 7, 2024
- LG Innotek Co., Ltd.
- Jae Man BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20240365477
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME
- Publication number 20240224436
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215165
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myong Keun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240206051
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Kaori KOIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240188216
- Publication date Jun 6, 2024
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20240188227
- Publication date Jun 6, 2024
- DAI NIPPON PRINTING CO., LTD.
- Keita IIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147634
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...
- Publication number 20240064910
- Publication date Feb 22, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Junqi TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...
- Publication number 20240057252
- Publication date Feb 15, 2024
- SEKISUI KASEI CO., LTD.
- Koichiro OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE
- Publication number 20240049397
- Publication date Feb 8, 2024
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
- Publication number 20240032209
- Publication date Jan 25, 2024
- Chihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS

by applying an insulating layer having channels for the next circuit layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods to fill through-holes of a substrate with metal paste

Customized thermal pathways in a PCB

Multilayer board and method of manufacturing the same

Maleimide resin composition, prepreg, resin film, laminated board,...

Insulating layer for multilayer printed circuit board, multilayer p...

Production method for multilayer wiring board

Electrostatic discharge protection of electronic component embedded...

Laminate, laminate with buildup layer, laminate with metal foil, an...

Closed-cavity printed circuit board

Electrically connected component carrier stacks with respective cav...

Multilayer resin substrate and method for producing same

Printed circuit board

Method of manufacture for embedded IC chip directly connected to PCB

Component-containing substrate

Wiring board and method for manufacturing wiring board

Multi-layer printed circuit board made of different materials and m...

Bent laminated printed circuit board

Embedding component in component carrier by component fixation stru...

Electromagnetic wave transmission board comprising an inner board w...

Semi-flex component carrier with dielectric material having high el...

Multilayer body

Laminated component carrier with a thermoplastic structure

Component carrier with low-solvent fiber-free dielectric layer

Process for laminating graphene-coated printed circuit boards

Flexible laminated board and multilayer circuit board

Multilayer circuit board and manufacturing method therefor

Method for manufacturing transparent circuit board

Semiconductor package manufacturing method, and adhesive sheet used...

Circuit board preparation method

Catalyzed metal foil and uses thereof

Patents Applicationslast 30 patents

POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DEL...

SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYER...

Stamping Surface Profile in Design Layer and Filling an Indentation...

MULTI-LAYER ELECTRICAL STRUCTURES

METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTIL...

PRINTED CIRCUIT BOARD

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME

PRINTED CIRCUIT BOARD

WIRING BOARD

TRANSPARENT CIRCUIT BOARD

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

Structures for Forming Printed Board Interconnects Using Solder

Flexible Printed Wiring Board and Method for Manufacturing Same

PRINTED CIRCUIT BOARD

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...

LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...

METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE

MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...