by applying an insulating layer having channels for the next circuit layer

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CPC
H05K3/465

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/465by applying an insulating layer having channels for the next circuit layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for laminating graphene-coated printed circuit boards
- Patent number 12,004,308
- Issue date Jun 4, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Multilayer circuit board and manufacturing method therefor
- Patent number 11,956,904
- Issue date Apr 9, 2024
- STEMCO CO., LTD.
- Jae Soo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package manufacturing method, and adhesive sheet used...
- Patent number 11,935,865
- Issue date Mar 19, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit and manufacturing method thereof, and disp...
- Patent number 11,839,025
- Issue date Dec 5, 2023
- Beijing BOE Optoelectronics Technology Co., Ltd
- Xiaoxia Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Phenoxy resin, resin composition including same, cured object obtai...
- Patent number 11,807,711
- Issue date Nov 7, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Hiroshi Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded magnetic inlay and integrated coil...
- Patent number 11,792,932
- Issue date Oct 17, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan Salkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing the same
- Patent number 11,700,685
- Issue date Jul 11, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil and method for manufacturing the same
- Patent number 11,688,553
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing laminate having patterned metal foil, and lami...
- Patent number 11,664,240
- Issue date May 30, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board automated layup system
- Patent number 11,653,484
- Issue date May 16, 2023
- Raytheon Company
- Mikhail Pevzner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and imaging device
- Patent number 11,627,661
- Issue date Apr 11, 2023
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a closed cavity printed circuit board with pattern...
- Patent number 11,622,453
- Issue date Apr 4, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Method for forming channels in printed circuit boards by stacking s...
- Patent number 11,606,865
- Issue date Mar 14, 2023
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422901
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Heun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES
- Publication number 20240389225
- Publication date Nov 21, 2024
- Liquid Wire Inc.
- Trevor Antonio Rivera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240373554
- Publication date Nov 7, 2024
- LG Innotek Co., Ltd.
- Jae Man BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD
- Publication number 20240365477
- Publication date Oct 31, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...
- Publication number 20240260200
- Publication date Aug 1, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME
- Publication number 20240224436
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240215165
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myong Keun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240206051
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Kaori KOIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240188216
- Publication date Jun 6, 2024
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
- Publication number 20240188227
- Publication date Jun 6, 2024
- DAI NIPPON PRINTING CO., LTD.
- Keita IIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures for Forming Printed Board Interconnects Using Solder
- Publication number 20240172372
- Publication date May 23, 2024
- Conductor Analysis Technologies, Inc.
- Timothy A. Estes
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147634
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
- Publication number 20240080994
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Gun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...
- Publication number 20240064910
- Publication date Feb 22, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Junqi TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...
- Publication number 20240057252
- Publication date Feb 15, 2024
- SEKISUI KASEI CO., LTD.
- Koichiro OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE
- Publication number 20240049397
- Publication date Feb 8, 2024
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...
- Publication number 20240032209
- Publication date Jan 25, 2024
- Chihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240023250
- Publication date Jan 18, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUSTOMIZED THERMAL PATHWAYS IN A PCB
- Publication number 20240008190
- Publication date Jan 4, 2024
- DSBJ PTE. LTD.
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WI...
- Publication number 20230391939
- Publication date Dec 7, 2023
- Kohta IWANAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...
- Publication number 20230397337
- Publication date Dec 7, 2023
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
- Publication number 20230345631
- Publication date Oct 26, 2023
- JSR Corporation
- Nobuyuki MIYAKI
- B32 - LAYERED PRODUCTS

by applying an insulating layer having channels for the next circuit layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board and method for manufacturing wiring board

Multi-layer printed circuit board made of different materials and m...

Bent laminated printed circuit board

Embedding component in component carrier by component fixation stru...

Electromagnetic wave transmission board comprising an inner board w...

Semi-flex component carrier with dielectric material having high el...

Multilayer body

Laminated component carrier with a thermoplastic structure

Component carrier with low-solvent fiber-free dielectric layer

Process for laminating graphene-coated printed circuit boards

Flexible laminated board and multilayer circuit board

Multilayer circuit board and manufacturing method therefor

Method for manufacturing transparent circuit board

Semiconductor package manufacturing method, and adhesive sheet used...

Circuit board preparation method

Catalyzed metal foil and uses thereof

Flexible printed circuit and manufacturing method thereof, and disp...

Phenoxy resin, resin composition including same, cured object obtai...

Component carrier with embedded magnetic inlay and integrated coil...

Method for manufacturing a circuit having a lamination layer using...

Method for manufacturing an electronic module and electronic module

Method for manufacturing the same

Multilayer coil and method for manufacturing the same

Method for producing laminate having patterned metal foil, and lami...

Printed circuit board automated layup system

Process for fabrication of a printed circuit board using a semi-add...

Wired circuit board and imaging device

Method of making a closed cavity printed circuit board with pattern...

Electronics assemblies for downhole use

Method for forming channels in printed circuit boards by stacking s...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

STRETCHABLE AND FLEXIBLE METAL FILM STRUCTURES

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD AND METHOD OF PRODUCING CIRCUIT BOARD

METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USI...

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME

PRINTED CIRCUIT BOARD

WIRING BOARD

TRANSPARENT CIRCUIT BOARD

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

Structures for Forming Printed Board Interconnects Using Solder

Flexible Printed Wiring Board and Method for Manufacturing Same

PRINTED CIRCUIT BOARD

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT

LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...

LAMINATE, LAMINATE WITH BUILDUP LAYER, LAMINATE WITH METAL FOIL, AN...

METHODS TO FILL THROUGH-HOLES OF A SUBSTRATE WITH METAL PASTE

MALEIMIDE RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD,...

WIRING SUBSTRATE

CUSTOMIZED THERMAL PATHWAYS IN A PCB

MULTILAYER WIRING BOARD

RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WI...

METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...

PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD