by applying pressure

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H01L2224/83104

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83104by applying pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 12,176,902
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 12,057,837
- Issue date Aug 6, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component and method for producing a power semi...
- Patent number 11,955,402
- Issue date Apr 9, 2024
- Vitesco Technologies GbmH
- Christina Quest-Matt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing stacked semiconductor die assemblies with...
- Patent number 11,776,877
- Issue date Oct 3, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,764,139
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 11,711,082
- Issue date Jul 25, 2023
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling inductors in an IC device using interconnecting elements w...
- Patent number 11,557,420
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Inc.
- Tak Ming Mak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure
- Patent number 11,532,498
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration of passive devices
- Patent number 11,398,456
- Issue date Jul 26, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
- Patent number 11,368,157
- Issue date Jun 21, 2022
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with thin redistribution layers
- Patent number 11,270,965
- Issue date Mar 8, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure
- Patent number 11,239,103
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,195,726
- Issue date Dec 7, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup apparatus, method of manufacturing solid-s...
- Patent number 11,177,300
- Issue date Nov 16, 2021
- Sony Corporation
- Hirokazu Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 11,159,165
- Issue date Oct 26, 2021
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Logic drive using standard commodity programmable logic IC chips co...
- Patent number 11,159,166
- Issue date Oct 26, 2021
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,101,231
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Jong-youn Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,062,987
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,037,819
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 11,018,112
- Issue date May 25, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,011,431
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of light emitting devices having opaque insulating layer...
- Patent number 10,978,615
- Issue date Apr 13, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate device, electronic apparatus, and method for manufacturin...
- Patent number 10,892,241
- Issue date Jan 12, 2021
- Sony Corporation
- Shigekazu Ishii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Packaging Stacking Flip Chip
- Publication number 20250006692
- Publication date Jan 2, 2025
- HEBEI BEIXIN SEMICONDUCTOR TECHNOLOGY CO., LTD
- Honglei RAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTER BONDING SHEET
- Publication number 20240413116
- Publication date Dec 12, 2024
- Nitto Denko Corporation
- Ryota MITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20240380401
- Publication date Nov 14, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...
- Publication number 20240379571
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ting-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...
- Publication number 20240373560
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Seongryul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD
- Publication number 20240332116
- Publication date Oct 3, 2024
- Intel Corporation
- Chun Keang Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING FILM FRAMES AND RELATED METHODS
- Publication number 20240304596
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Dukyong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240170360
- Publication date May 23, 2024
- MEDIATEK INC.
- Chun-Yin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20230395463
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME
- Publication number 20230307342
- Publication date Sep 28, 2023
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20230299774
- Publication date Sep 21, 2023
- iCometrue Company Ltd.
- Mou-Shiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
- Publication number 20230245923
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Integration of Passive Devices
- Publication number 20220320048
- Publication date Oct 6, 2022
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS
- Publication number 20220262753
- Publication date Aug 18, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20220029626
- Publication date Jan 27, 2022
- iCometrue Company Ltd.
- Mou-Shiung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...
- Publication number 20220014198
- Publication date Jan 13, 2022
- iCometrue Company Ltd.
- Jin-Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...
- Publication number 20220013434
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Sameer S. Vadhavkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210335701
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
- Publication number 20210305086
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS
- Publication number 20210111138
- Publication date Apr 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure
- Publication number 20200350197
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
- Publication number 20200294845
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20200243435
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure
- Publication number 20200243370
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200219834
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- Jong-youn KIM
- H01 - BASIC ELECTRIC ELEMENTS

by applying pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Logic drive with brain-like elasticity and integrality based on sta...

Semiconductor package with dual sides of metal routing

Logic drive using standard commodity programmable logic IC chips co...

Wafer level chip scale packaging intermediate structure apparatus a...

Power semiconductor component and method for producing a power semi...

Semiconductor device and manufacturing method thereof

Methods of manufacturing stacked semiconductor die assemblies with...

Semiconductor device and method

Logic drive using standard commodity programmable logic IC chips co...

Wafer level chip scale packaging intermediate structure apparatus a...

Coupling inductors in an IC device using interconnecting elements w...

Package-on-package structure

Multi-die package with bridge layer

Wafer level integration of passive devices

Logic drive with brain-like elasticity and integrality based on sta...

Device and method for reworking flip chip components

Semiconductor device with thin redistribution layers

Package-on-package structure

Semiconductor device and manufacturing method thereof

Solid-state image pickup apparatus, method of manufacturing solid-s...

Logic drive using standard commodity programmable logic IC chips co...

Logic drive using standard commodity programmable logic IC chips co...

Semiconductor package and method of manufacturing the same

Microelectronic structures having multiple microelectronic devices...

Semiconductor device

Wafer level chip scale packaging intermediate structure apparatus a...

Bonding method of semiconductor chip and bonding apparatus of semic...

Semiconductor structure and manufacturing method thereof

Plurality of light emitting devices having opaque insulating layer...

Substrate device, electronic apparatus, and method for manufacturin...

Patents Applicationslast 30 patents

Method for Packaging Stacking Flip Chip

SINTER BONDING SHEET

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPRO...

PACKAGE SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT MOUNTED ON C...

SEMICONDUCTOR DEVICE THERMAL INTERFACE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SINTERING FILM FRAMES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE BOARD COMPRISING SAME

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

Wafer Level Integration of Passive Devices

SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

LOGIC DRIVE USING STANDARD COMMODITY PROGRAMMABLE LOGIC IC CHIPS CO...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

SEMICONDUCTOR DEVICE AND METHOD

Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...

SEMICONDUCTOR DEVICE WITH THIN REDISTRIBUTION LAYERS

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

Package-on-Package Structure

Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...

Methods for Making Multi-Die Package With Bridge Layer

Semiconductor Device and Method

Package-on-Package Structure

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME